JPH0452999Y2 - - Google Patents

Info

Publication number

JPH0452999Y2

JPH0452999Y2 JP1986174049U JP17404986U JPH0452999Y2 JP H0452999 Y2 JPH0452999 Y2 JP H0452999Y2 JP 1986174049 U JP1986174049 U JP 1986174049U JP 17404986 U JP17404986 U JP 17404986U JP H0452999 Y2 JPH0452999 Y2 JP H0452999Y2

Authority

JP

Japan

Prior art keywords

fiber layer

electrode

soft resin

semiconductor device

resin body

Prior art date

1986-11-14

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 229920005989 resin Polymers 0.000 claims description 53
• 239000011347 resin Substances 0.000 claims description 53
• 239000004065 semiconductor Substances 0.000 claims description 39
• 239000000835 fiber Substances 0.000 claims description 37
• 239000002657 fibrous material Substances 0.000 claims description 16
• 239000003822 epoxy resin Substances 0.000 claims description 10
• 229920000647 polyepoxide Polymers 0.000 claims description 10
• 229920002379 silicone rubber Polymers 0.000 claims description 7
• 239000003365 glass fiber Substances 0.000 claims description 6
• 239000004745 nonwoven fabric Substances 0.000 claims description 6
• 239000004945 silicone rubber Substances 0.000 claims description 6
• 239000002759 woven fabric Substances 0.000 claims description 5
• 239000000463 material Substances 0.000 claims description 4
• 230000002093 peripheral effect Effects 0.000 claims description 2
• 238000007789 sealing Methods 0.000 description 9
• 239000002585 base Substances 0.000 description 8
• HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
• 239000000126 substance Substances 0.000 description 6
• 238000000034 method Methods 0.000 description 5
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
• 238000010438 heat treatment Methods 0.000 description 4
• 229910000679 solder Inorganic materials 0.000 description 4
• 229920002678 cellulose Polymers 0.000 description 3
• 239000001913 cellulose Substances 0.000 description 3
• 239000011162 core material Substances 0.000 description 3
• 230000007613 environmental effect Effects 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 229910052751 metal Inorganic materials 0.000 description 3
• 238000012986 modification Methods 0.000 description 3
• 230000004048 modification Effects 0.000 description 3
• 150000003839 salts Chemical class 0.000 description 3
• 238000005476 soldering Methods 0.000 description 3
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
• 239000002253 acid Substances 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000002411 adverse Effects 0.000 description 2
• 230000002950 deficient Effects 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 229910052759 nickel Inorganic materials 0.000 description 2
• 235000011121 sodium hydroxide Nutrition 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229920000715 Mucilage Polymers 0.000 description 1
• 229910000831 Steel Inorganic materials 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• 150000007513 acids Chemical class 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000003513 alkali Substances 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 238000004140 cleaning Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000001035 drying Methods 0.000 description 1
• 238000005868 electrolysis reaction Methods 0.000 description 1
• 239000003792 electrolyte Substances 0.000 description 1
• 239000008151 electrolyte solution Substances 0.000 description 1
• 238000005530 etching Methods 0.000 description 1
• LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
• IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
• 230000001771 impaired effect Effects 0.000 description 1
• 239000012535 impurity Substances 0.000 description 1
• 239000012784 inorganic fiber Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000005259 measurement Methods 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 239000009719 polyimide resin Substances 0.000 description 1
• 230000001681 protective effect Effects 0.000 description 1
• 238000000926 separation method Methods 0.000 description 1
• 239000010959 steel Substances 0.000 description 1
• 230000035882 stress Effects 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1
• 230000008646 thermal stress Effects 0.000 description 1