JPH0451486Y2 - - Google Patents

Info

Publication number
JPH0451486Y2
JPH0451486Y2 JP1988083850U JP8385088U JPH0451486Y2 JP H0451486 Y2 JPH0451486 Y2 JP H0451486Y2 JP 1988083850 U JP1988083850 U JP 1988083850U JP 8385088 U JP8385088 U JP 8385088U JP H0451486 Y2 JPH0451486 Y2 JP H0451486Y2
Authority
JP
Japan
Prior art keywords
nut
outer envelope
terminal
external connection
plate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1988083850U
Other languages
English (en)
Japanese (ja)
Other versions
JPH028042U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988083850U priority Critical patent/JPH0451486Y2/ja
Publication of JPH028042U publication Critical patent/JPH028042U/ja
Application granted granted Critical
Publication of JPH0451486Y2 publication Critical patent/JPH0451486Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988083850U 1988-06-27 1988-06-27 Expired JPH0451486Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988083850U JPH0451486Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-06-27 1988-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988083850U JPH0451486Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-06-27 1988-06-27

Publications (2)

Publication Number Publication Date
JPH028042U JPH028042U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-01-18
JPH0451486Y2 true JPH0451486Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-03

Family

ID=31308559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988083850U Expired JPH0451486Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-06-27 1988-06-27

Country Status (1)

Country Link
JP (1) JPH0451486Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2511371Y2 (ja) * 1990-11-13 1996-09-25 寺崎電気産業株式会社 電気機器の端子装置
JP7677066B2 (ja) * 2021-08-26 2025-05-15 富士電機株式会社 半導体装置、及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPH028042U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-01-18

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