JPH0451476Y2 - - Google Patents
Info
- Publication number
- JPH0451476Y2 JPH0451476Y2 JP1988111185U JP11118588U JPH0451476Y2 JP H0451476 Y2 JPH0451476 Y2 JP H0451476Y2 JP 1988111185 U JP1988111185 U JP 1988111185U JP 11118588 U JP11118588 U JP 11118588U JP H0451476 Y2 JPH0451476 Y2 JP H0451476Y2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- edge
- semiconductor chip
- terminal member
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/50—
-
- H10W72/07553—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5366—
-
- H10W72/537—
-
- H10W72/5449—
-
- H10W72/932—
-
- H10W90/753—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988111185U JPH0451476Y2 (enExample) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988111185U JPH0451476Y2 (enExample) | 1988-08-26 | 1988-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0233433U JPH0233433U (enExample) | 1990-03-02 |
| JPH0451476Y2 true JPH0451476Y2 (enExample) | 1992-12-03 |
Family
ID=31349014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988111185U Expired JPH0451476Y2 (enExample) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451476Y2 (enExample) |
-
1988
- 1988-08-26 JP JP1988111185U patent/JPH0451476Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0233433U (enExample) | 1990-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4642419A (en) | Four-leaded dual in-line package module for semiconductor devices | |
| JPH11354702A5 (enExample) | ||
| JPH064595Y2 (ja) | ハイブリッドic | |
| JPH10261756A5 (enExample) | ||
| CN112185941B (zh) | 半导体封装件、电机控制器及新能源汽车 | |
| US6621166B2 (en) | Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging | |
| JP3391372B2 (ja) | 絶縁物封止型電子装置及びその製造方法 | |
| JPH0451476Y2 (enExample) | ||
| JPH0645504A (ja) | 半導体装置 | |
| JPS6362339A (ja) | 半導体装置 | |
| JPH0447963Y2 (enExample) | ||
| JP2587722Y2 (ja) | 半導体装置 | |
| JPH0622997Y2 (ja) | 絶縁物封止型半導体装置 | |
| JPS6332269B2 (enExample) | ||
| CN206432258U (zh) | 电力开关的封装装置 | |
| JPS6230498B2 (enExample) | ||
| JP2629461B2 (ja) | 樹脂封止形半導体装置 | |
| JPH0362564A (ja) | 半導体装置 | |
| CN119627009A (zh) | 具有中介层的半导体封装 | |
| JPH0719160Y2 (ja) | 半導体装置 | |
| JPH0936158A (ja) | パッケージ型半導体装置の構造 | |
| JPS646041U (enExample) | ||
| JPS63188942U (enExample) | ||
| JPH0794658A (ja) | リードフレーム | |
| JPWO2023189918A5 (enExample) |