JPH0450744B2 - - Google Patents

Info

Publication number
JPH0450744B2
JPH0450744B2 JP61057439A JP5743986A JPH0450744B2 JP H0450744 B2 JPH0450744 B2 JP H0450744B2 JP 61057439 A JP61057439 A JP 61057439A JP 5743986 A JP5743986 A JP 5743986A JP H0450744 B2 JPH0450744 B2 JP H0450744B2
Authority
JP
Japan
Prior art keywords
metal substrate
copper plate
oxide film
layer
aluminum oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61057439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62214632A (ja
Inventor
Akira Kazami
Jusuke Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP61057439A priority Critical patent/JPS62214632A/ja
Publication of JPS62214632A publication Critical patent/JPS62214632A/ja
Publication of JPH0450744B2 publication Critical patent/JPH0450744B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/724—

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP61057439A 1986-03-14 1986-03-14 混成集積回路 Granted JPS62214632A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61057439A JPS62214632A (ja) 1986-03-14 1986-03-14 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61057439A JPS62214632A (ja) 1986-03-14 1986-03-14 混成集積回路

Publications (2)

Publication Number Publication Date
JPS62214632A JPS62214632A (ja) 1987-09-21
JPH0450744B2 true JPH0450744B2 (enExample) 1992-08-17

Family

ID=13055686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61057439A Granted JPS62214632A (ja) 1986-03-14 1986-03-14 混成集積回路

Country Status (1)

Country Link
JP (1) JPS62214632A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130274A (en) * 1991-04-05 1992-07-14 International Business Machines Corporation Copper alloy metallurgies for VLSI interconnection structures
DE4334127C1 (de) * 1993-10-07 1995-03-23 Mtu Muenchen Gmbh Metallkernleiterplatte zum Einschieben in das Gehäuse eines Elektronikgerätes
KR101204191B1 (ko) * 2010-11-02 2012-11-23 삼성전기주식회사 방열기판
DE102015111667B4 (de) * 2015-07-17 2025-11-06 Rogers Germany Gmbh Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates
CN110113880A (zh) * 2018-12-29 2019-08-09 广东生益科技股份有限公司 金属基覆铜箔层压板及其制备方法

Also Published As

Publication number Publication date
JPS62214632A (ja) 1987-09-21

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