JPH0450719B2 - - Google Patents
Info
- Publication number
- JPH0450719B2 JPH0450719B2 JP59195569A JP19556984A JPH0450719B2 JP H0450719 B2 JPH0450719 B2 JP H0450719B2 JP 59195569 A JP59195569 A JP 59195569A JP 19556984 A JP19556984 A JP 19556984A JP H0450719 B2 JPH0450719 B2 JP H0450719B2
- Authority
- JP
- Japan
- Prior art keywords
- superconducting
- heat treatment
- diffusion heat
- superconducting wires
- stabilizing base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009792 diffusion process Methods 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 230000000087 stabilizing effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 10
- 229910000765 intermetallic Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000007790 solid phase Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 239000002887 superconductor Substances 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19556984A JPS6174282A (ja) | 1984-09-18 | 1984-09-18 | 化合物系超電導線の接続方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19556984A JPS6174282A (ja) | 1984-09-18 | 1984-09-18 | 化合物系超電導線の接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6174282A JPS6174282A (ja) | 1986-04-16 |
JPH0450719B2 true JPH0450719B2 (zh) | 1992-08-17 |
Family
ID=16343302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19556984A Granted JPS6174282A (ja) | 1984-09-18 | 1984-09-18 | 化合物系超電導線の接続方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6174282A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6355876A (ja) * | 1986-08-27 | 1988-03-10 | 株式会社東芝 | 超電導線の接続方法 |
JP4845040B2 (ja) * | 2007-03-20 | 2011-12-28 | 古河電気工業株式会社 | 薄膜超電導線の接続方法及びその接続構造体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56112080A (en) * | 1980-02-07 | 1981-09-04 | Furukawa Electric Co Ltd | Method of manufacturing long compound superconductive wire |
-
1984
- 1984-09-18 JP JP19556984A patent/JPS6174282A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56112080A (en) * | 1980-02-07 | 1981-09-04 | Furukawa Electric Co Ltd | Method of manufacturing long compound superconductive wire |
Also Published As
Publication number | Publication date |
---|---|
JPS6174282A (ja) | 1986-04-16 |
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