JPH04501685A - ダイヤモンド切断方法 - Google Patents

ダイヤモンド切断方法

Info

Publication number
JPH04501685A
JPH04501685A JP1511199A JP51119989A JPH04501685A JP H04501685 A JPH04501685 A JP H04501685A JP 1511199 A JP1511199 A JP 1511199A JP 51119989 A JP51119989 A JP 51119989A JP H04501685 A JPH04501685 A JP H04501685A
Authority
JP
Japan
Prior art keywords
diamond
cut
cutting
vertices
cutting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1511199A
Other languages
English (en)
Japanese (ja)
Inventor
セナナヤケ　ダヤ　ランジット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPH04501685A publication Critical patent/JPH04501685A/ja
Pending legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C17/00—Gems or the like
    • A44C17/001—Faceting gems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Adornments (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP1511199A 1988-11-16 1989-11-14 ダイヤモンド切断方法 Pending JPH04501685A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
LK995488 1988-11-16
LK9954 1988-11-16

Publications (1)

Publication Number Publication Date
JPH04501685A true JPH04501685A (ja) 1992-03-26

Family

ID=19720957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1511199A Pending JPH04501685A (ja) 1988-11-16 1989-11-14 ダイヤモンド切断方法

Country Status (10)

Country Link
US (1) US5190024A (enExample)
EP (1) EP0561770A1 (enExample)
JP (1) JPH04501685A (enExample)
CN (1) CN1019775B (enExample)
AU (1) AU630124B2 (enExample)
IL (1) IL92313A0 (enExample)
IN (1) IN174710B (enExample)
MY (1) MY106338A (enExample)
WO (1) WO1990005624A1 (enExample)
ZA (1) ZA898713B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648411U (ja) * 1992-12-15 1994-07-05 京セラ株式会社 装飾部材

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4751596A (en) * 1995-01-27 1996-08-14 Gerald V. Rogers Spherical sectioned gem setting device
US5932119A (en) 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
RU2133195C1 (ru) * 1998-02-11 1999-07-20 Радько Лидия Валерьевна Способ технической и художественной разметки поверхности и объема минеральных объектов (варианты)
JP2000005993A (ja) * 1998-06-17 2000-01-11 Hisatake Shudo ダイヤモンドのカット方法及びダイヤモンドのプロポーション
US6604382B2 (en) 2000-11-07 2003-08-12 Naotake Shuto New-cut diamond shape
JP3863374B2 (ja) * 2001-01-22 2006-12-27 尚丈 首藤 ダイヤモンドのカット方法及びプロポーション
US7146827B2 (en) * 2001-05-18 2006-12-12 Diamond Innovations, Llc Mixed cut gemstone
USD467833S1 (en) 2001-08-11 2002-12-31 Joseph Mardkha Mixed cut diamond
ATE319546T1 (de) * 2002-02-13 2006-03-15 Arvindbhai Lavjibhai Patel Lasermaschine zur untersuchung, planung und markierung von rohdiamanten
EP1476289A1 (en) 2002-02-21 2004-11-17 Arvindbhai Lavjibhai Patel A novel laser diamond sawing machine
US6786733B2 (en) 2002-10-15 2004-09-07 Overseas Diamonds Inc. Computer-implemented method of and system for teaching an untrained observer to evaluate a gemstone
CN1717298A (zh) * 2003-05-30 2006-01-04 阿尔温德伯翰·拉夫吉伯翰·帕特尔 新型激光打磨机
US7025110B1 (en) * 2003-06-12 2006-04-11 Arthur Suozzi Method and apparatus for setting odd-shaped precious stones
US7000607B2 (en) * 2003-07-11 2006-02-21 Ofer Davidi Gemstone and corresponding method of cutting
US7487870B2 (en) 2003-11-05 2009-02-10 Tom Ceulemans Device and kit for visualizing a cutting regime of a diamond, and a method for determining a cutting regime
US20060173738A1 (en) * 2005-02-02 2006-08-03 Dmitry Marmershteyn Method and system of marketing diamonds
IL166977A (en) * 2005-02-17 2014-03-31 Dialit Ltd A computer-guided system and method for producing polished gems
US20070062917A1 (en) * 2005-09-21 2007-03-22 Quantronix Corporation Laser cutting and sawing method and apparatus
CN101462312B (zh) * 2007-12-21 2012-06-20 广州柏志钻石有限公司 钻石加工方法
BE1018664A5 (nl) * 2009-02-20 2011-06-07 Diamscan N V Verbeterde werkwijze en verbeterd product.
US8769987B2 (en) * 2009-12-01 2014-07-08 Dimexon Diamonds Ltd. Gemstone
CN103504734A (zh) * 2012-06-27 2014-01-15 广东钻石世家国际珠宝有限公司 一种内部呈八心八箭的八边形钻石的制作方法
CN104416684B (zh) * 2013-09-02 2018-03-27 深圳市品越珠宝有限公司 一种组合心形钻石切割工艺
US9745669B2 (en) * 2013-09-27 2017-08-29 Ark Crystal, LLC Precision cut high energy crystals
US20150121960A1 (en) * 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
KR20190028537A (ko) * 2016-07-18 2019-03-18 에스케이에스엠 다이아몬즈 임펙스 리미티드 광택과 색조가 향상된 합성 다이아몬드를 형성하기 위해 다이아몬드들을 자르고 조립하는 방법
BE1024863B1 (nl) * 2016-12-27 2018-07-31 Rose D'anvers Besloten Vennootschap Met Beperkte Aansprakelijkheid Ornament.
WO2021097382A1 (en) * 2019-11-14 2021-05-20 Massachusetts Institute Of Technology Diamond rotors for mas-nmr

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US671830A (en) * 1899-05-02 1901-04-09 Ernest Loesser Diamond-cross-cutting machine.
US671831A (en) * 1900-07-26 1901-04-09 Ernest Loesser Art of working diamonds.
US694215A (en) * 1901-12-05 1902-02-25 Herman A Groen Method of cutting diamonds.
US732119A (en) * 1902-03-27 1903-06-30 Ernest G H Schenck Method of cutting precious stones.
US732118A (en) * 1902-03-27 1903-06-30 Ernest G H Schenck Machine for cutting precious stones.
GB122470A (en) * 1918-01-23 1919-01-23 Jules Groesser Improvements in Apparatus for Cutting or Dividing Diamonds.
US3527198A (en) * 1966-03-26 1970-09-08 Tokyo Shibaura Electric Co Method and apparatus for working diamonds by means of laser light beam
US4392476A (en) * 1980-12-23 1983-07-12 Lazare Kaplan & Sons, Inc. Method and apparatus for placing identifying indicia on the surface of precious stones including diamonds

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648411U (ja) * 1992-12-15 1994-07-05 京セラ株式会社 装飾部材

Also Published As

Publication number Publication date
AU630124B2 (en) 1992-10-22
US5190024A (en) 1993-03-02
AU4484189A (en) 1990-06-12
CN1042685A (zh) 1990-06-06
MY106338A (en) 1995-05-30
ZA898713B (en) 1990-09-26
CN1019775B (zh) 1992-12-30
IN174710B (enExample) 1995-02-18
IL92313A0 (en) 1990-07-26
WO1990005624A1 (en) 1990-05-31
EP0561770A1 (en) 1993-09-29

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