JPH0448628U - - Google Patents
Info
- Publication number
- JPH0448628U JPH0448628U JP1990091340U JP9134090U JPH0448628U JP H0448628 U JPH0448628 U JP H0448628U JP 1990091340 U JP1990091340 U JP 1990091340U JP 9134090 U JP9134090 U JP 9134090U JP H0448628 U JPH0448628 U JP H0448628U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- lead type
- thin metal
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
Description
第１図は本考案の実施例を示す側断面図、第２
図は第１図半導体装置の要部断面斜視図、第３図
および第５図は本考案の他の実施例を示す要部側
断面図、第４図は第３図実施例のバンプ電極の製
造方法を示す側断面図、第６図はＴＡＢリード型
半導体装置の一例を示す側断面図である。
３ａ……インナリード、４……半導体ペレツト
、４ｂ……バンプ電極、５……金属細線。
Fig. 1 is a side sectional view showing an embodiment of the present invention;
1 is a sectional perspective view of the main part of the semiconductor device, FIGS. 3 and 5 are side sectional views of the main part showing other embodiments of the present invention, and FIG. 4 is a bump electrode of the embodiment shown in FIG. FIG. 6 is a side sectional view showing an example of a TAB lead type semiconductor device. 3a...inner lead, 4...semiconductor pellet, 4b...bump electrode, 5...metal thin wire.
Claims (1)
導電箔よりなるインナリードとを圧着接続したＴ
ＡＢリード型半導体装置において、 上記バンプ電極をインナリードの延長方向に細
長く形成したことを特徴とするＴＡＢリード型半
導体装置。 (2) バンプ電極が金属細線をステツチボンデイ
ングして形成されたことを特徴とする実用新案登
録請求の範囲第１項記載のＴＡＢリード型半導体
装置。 (3) ステツチボンデイングされた金属細線の終
端位置がインナリードの遊端側に位置しているこ
とを特徴とする実用新案登録請求の範囲第２項記
載のＴＡＢリード型半導体装置。 (4) バンプ電極が金属細線の一端をボールボン
テイングしたことを特徴とする実用新案登録請求
の範囲第２項記載のＴＡＢリード型半導体装置。 (5) ボールボンデイング位置がインナリードの
遊端より内方に位置していることを特徴とする実
用新案登録請求の範囲第４項記載のＴＡＢリード
型半導体装置。[Claims for Utility Model Registration] (1) A T in which a bump electrode formed on a semiconductor pellet and an inner lead made of conductive foil are connected by pressure bonding.
AB lead type semiconductor device, characterized in that the bump electrode is formed to be elongated in the direction of extension of the inner lead. (2) The TAB lead type semiconductor device according to claim 1, wherein the bump electrodes are formed by stitch bonding thin metal wires. (3) The TAB lead type semiconductor device according to claim 2, wherein the terminal end of the stitch-bonded thin metal wire is located on the free end side of the inner lead. (4) The TAB lead type semiconductor device according to claim 2, wherein the bump electrode is formed by ball bonding one end of a thin metal wire. (5) The TAB lead type semiconductor device according to claim 4, wherein the ball bonding position is located inward from the free end of the inner lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091340U JPH0448628U (en) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091340U JPH0448628U (en) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448628U true JPH0448628U (en) | 1992-04-24 |
Family
ID=31826866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990091340U Pending JPH0448628U (en) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448628U (en) |
-
1990
- 1990-08-30 JP JP1990091340U patent/JPH0448628U/ja active Pending