JPH0487644U - - Google Patents
Info
- Publication number
- JPH0487644U JPH0487644U JP1990130272U JP13027290U JPH0487644U JP H0487644 U JPH0487644 U JP H0487644U JP 1990130272 U JP1990130272 U JP 1990130272U JP 13027290 U JP13027290 U JP 13027290U JP H0487644 U JPH0487644 U JP H0487644U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- insulating film
- semiconductor pellet
- stage
- supported
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係るリードボンダの断面図、
第２図はＴＡＢリード型半導体装置の斜視図、第
３図及び第４図は従来のリードボンダの断面図で
ある。
１……絶縁性フイルム、２……金属箔リード、
２ａ……一端部、３……半導体ペレツト、３ａ…
…バンプ電極、５……ヒータチツプ、８……ステ
ージ、１０……熱圧着機構、１３……弾性体。
FIG. 1 is a cross-sectional view of the lead bonder according to the present invention.
FIG. 2 is a perspective view of a TAB lead type semiconductor device, and FIGS. 3 and 4 are sectional views of a conventional lead bonder. 1... Insulating film, 2... Metal foil lead,
2a...One end portion, 3...Semiconductor pellet, 3a...
... Bump electrode, 5 ... Heater chip, 8 ... Stage, 10 ... Thermocompression bonding mechanism, 13 ... Elastic body.
Claims (1)
ルムに穿設された半導体ペレツトを配置する窓孔
内に一端部が延在するように配線された金属箔リ
ードと、上記絶縁性フイルムの窓孔内に配置した
半導体ペレツトのバンプ電極とを、熱圧着ポジシ
ヨンの下側に配置され半導体ペレツトを吸着支持
するステージを含む前記熱圧着機構と、上側に配
置したヒータチツプとによつて熱圧着するリード
ボンダにおいて、 上記熱圧着機構のステージを昇降動ステージを
弾性体にて支持したことを特徴とするリードボン
ダ。[Claim for Utility Model Registration] A metal foil lead wired on a long insulating film so that one end extends into a window hole in which a semiconductor pellet is placed, which is drilled in the insulating film. and the bump electrode of the semiconductor pellet placed in the window hole of the insulating film are connected to the thermocompression bonding mechanism, which includes a stage disposed below the thermocompression bonding position and which sucks and supports the semiconductor pellet, and a heater chip disposed above. A lead bonder for thermocompression bonding, characterized in that the stage of the thermocompression bonding mechanism is supported by an elevating stage supported by an elastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990130272U JPH0487644U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990130272U JPH0487644U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487644U true JPH0487644U (en) | 1992-07-30 |
Family
ID=31877628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990130272U Pending JPH0487644U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487644U (en) |
-
1990
- 1990-11-30 JP JP1990130272U patent/JPH0487644U/ja active Pending