JPH0446466B2 - - Google Patents
Info
- Publication number
- JPH0446466B2 JPH0446466B2 JP59272026A JP27202684A JPH0446466B2 JP H0446466 B2 JPH0446466 B2 JP H0446466B2 JP 59272026 A JP59272026 A JP 59272026A JP 27202684 A JP27202684 A JP 27202684A JP H0446466 B2 JPH0446466 B2 JP H0446466B2
- Authority
- JP
- Japan
- Prior art keywords
- cell
- semi
- wiring
- cylindrical member
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59272026A JPS61150382A (ja) | 1984-12-25 | 1984-12-25 | 触覚センサと基板との接続方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59272026A JPS61150382A (ja) | 1984-12-25 | 1984-12-25 | 触覚センサと基板との接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61150382A JPS61150382A (ja) | 1986-07-09 |
JPH0446466B2 true JPH0446466B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-07-30 |
Family
ID=17508091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59272026A Granted JPS61150382A (ja) | 1984-12-25 | 1984-12-25 | 触覚センサと基板との接続方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61150382A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04204025A (ja) * | 1990-11-30 | 1992-07-24 | Agency Of Ind Science & Technol | 触覚センサの受圧部接合方法 |
US7271586B2 (en) | 2003-12-04 | 2007-09-18 | Honeywell International Inc. | Single package design for 3-axis magnetic sensor |
WO2005068958A1 (en) * | 2004-01-05 | 2005-07-28 | Case Western Reserve University | Structure and method for packaging micro strain sensors |
-
1984
- 1984-12-25 JP JP59272026A patent/JPS61150382A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61150382A (ja) | 1986-07-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |