JPH0446466B2 - - Google Patents
Info
- Publication number
- JPH0446466B2 JPH0446466B2 JP59272026A JP27202684A JPH0446466B2 JP H0446466 B2 JPH0446466 B2 JP H0446466B2 JP 59272026 A JP59272026 A JP 59272026A JP 27202684 A JP27202684 A JP 27202684A JP H0446466 B2 JPH0446466 B2 JP H0446466B2
- Authority
- JP
- Japan
- Prior art keywords
- cell
- semi
- wiring
- cylindrical member
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000015541 sensory perception of touch Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Pressure Sensors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は触覚センサと基板との接続方法に関
し、特に配線導体の配設された絶縁シートを積層
して形成した多層基板に触覚センタのセルを搭載
し、セルの配線と基板の配線との間に電気的な接
続が得られるようにする触覚センサと基板との接
続方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of connecting a tactile sensor and a substrate, and in particular, a tactile center cell is connected to a multilayer substrate formed by laminating insulating sheets on which wiring conductors are arranged. The present invention relates to a method for connecting a tactile sensor and a substrate, in which an electrical connection is obtained between the wiring of a cell and the wiring of a substrate.
ロボツト等に使用されてきた従来の触覚センサ
は、例えば導電フイルムのようにセンサ自体が平
担に形成されており、単に押圧力のみを検出する
型のものが多く、したがつてこのようなセンサが
設けられる基板について特別な配慮の必要がなか
つた。しかし、近年では、対象物に対して人間の
触覚に近い機能をもつて接触やすべり等の情報が
得られるようなセンサの要望が高まるに連れて、
たとえば互いに直交する方向の分力の検出が可能
な触覚センサの開発が検討されてきた。
Conventional tactile sensors that have been used in robots, etc., are made of conductive film, for example, and are often of the type that simply detects pressing force. There was no need for special considerations regarding the substrate on which the However, in recent years, as the demand for sensors that can obtain information on objects such as contact and slippage with functions similar to the human tactile sense has increased,
For example, the development of tactile sensors capable of detecting force components in mutually orthogonal directions has been considered.
このような触覚センサの実現には、センサの形
態も平面的でなく、基板に対して立体的な構造を
持つものでなければならず、特にこのようなセン
サが配置される基板はセンサの立体化に伴つて配
線密度の高いものとなり、しかもセンサ受圧面の
受ける外力に対して十分耐えることのできる接合
強度が保持されなければならぬ。そこで、かかる
触覚センサを積層して形成された多層配線基板上
に配列させることが考えられてきた。 In order to realize such a tactile sensor, the shape of the sensor must not be flat, but must have a three-dimensional structure relative to the substrate. Along with this trend, the wiring density has increased, and in addition, the bonding strength must be maintained to be able to withstand the external force exerted on the sensor pressure-receiving surface. Therefore, it has been considered to arrange such tactile sensors on a multilayer wiring board formed by stacking them.
しかして、従来の方法であれば、第３Ａ図およ
び第３Ｂ図に示すような形態で触覚セルが多層セ
ラミツク配線基板に搭載されセンサが構成され
る。すなわち、ここで、１はシリコンの拡散型半
導体による圧力センサとして形成された触覚セン
サセルであり、セル１には複数の表裏所定の位置
に歪ゲージ２がそれぞれ配置されていて、更にセ
ル１の上端には受圧板３が設けられており、受圧
板３に作用した荷重をセル１を介して歪ゲージ２
に伝達させることにより、このような荷重を互い
に直交する３方向の成分に分けて検出させること
ができる。 However, in the conventional method, a sensor is constructed by mounting a tactile cell on a multilayer ceramic wiring board in the form shown in FIGS. 3A and 3B. That is, here, reference numeral 1 is a tactile sensor cell formed as a pressure sensor using a silicon diffusion type semiconductor, and a plurality of strain gauges 2 are arranged at predetermined positions on the front and back sides of the cell 1, and furthermore, at the upper end of the cell 1. is provided with a pressure receiving plate 3, and the load acting on the pressure receiving plate 3 is transferred to the strain gauge 2 through the cell 1.
By transmitting the load to the three directions, such a load can be divided into components in three directions orthogonal to each other and detected.
更に、４はセル１の基部１Ａに配設された端子
であり、端子４と歪ゲージ２とはそれぞれ図示し
ない配線により接続され、また、端子４は多層基
板５側の配線６と接続される。７はスルーホール
８を介して配線６と接続される他層の導体配線で
ある。 Furthermore, 4 is a terminal arranged on the base 1A of the cell 1, and the terminal 4 and the strain gauge 2 are connected to each other by wiring (not shown), and the terminal 4 is connected to the wiring 6 on the multilayer board 5 side. . Reference numeral 7 denotes a conductor wiring in another layer that is connected to the wiring 6 via a through hole 8.
しかして、このような触覚センサセル１の多層
基板５への装着にあたつては、まず、上層基板５
Ａに形成されている溝９にセル１の基部１Ａを嵌
合させ、相互間を接着剤１０によつて接着したあ
と端子４と配線６とがはんだ１１によつて接続さ
れる。 Therefore, when attaching such a tactile sensor cell 1 to the multilayer substrate 5, first, the upper layer substrate 5 is attached.
After fitting the base 1A of the cell 1 into the groove 9 formed in the groove 9 and bonding them together with an adhesive 10, the terminal 4 and the wiring 6 are connected with the solder 11.
しかしながら、このような立体的構成からなる
触覚センサを上述したような方法で多層基板５に
接続したのでは、セル１の外力によるたわみによ
つて、その応力が基部１Ａの周囲に集中すること
になり、セル１自体の破損の虞があるのみなら
ず、はんだ１１の切損により電気的接続が損われ
てしまう。 However, if a tactile sensor having such a three-dimensional configuration is connected to the multilayer substrate 5 in the above-described manner, stress will be concentrated around the base 1A due to the deflection of the cell 1 due to external force. Therefore, not only is there a risk of damage to the cell 1 itself, but also the electrical connection is damaged due to breakage of the solder 11.
本発明の目的は、上述したような問題点に鑑み
て、３方向の成分を有する力が加えられても外れ
たり接続が損われることなく、しかも十分な電気
的接続の状態を保持することのできる強固な触覚
センサと基板との接続方法を提供することにあ
る。
SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a device that does not come off or lose connection even when a force having components in three directions is applied, and that maintains a sufficient electrical connection state. The purpose of the present invention is to provide a method for connecting a tactile sensor and a board that is as strong as possible.
すなわち、本発明は、多層配線基板の上層部に
溝を設けて、この溝の壁面に基板の個々の層の導
体配線と電気的接続が可能な銅製の半円柱形の部
材を嵌込み、触覚センサのセル基部にはこれらの
半円柱部材と対応する位置にセルの配線端子を設
けて、このセル基部を上記の溝に嵌合可能とな
し、半円柱部材にはんだを施し、溝に接着剤を付
着させてこの溝にセルの基部を嵌合させ、更に半
円柱部材に施したはんだを溶融させて、この銅製
の半円柱部材とはんだとによりセル上の配線端子
と基板の配線端子および導体パターンとの間の電
気的接続が得られるようにすると共に、望ましく
はこの銅製のスルーホールを基板面より上方に延
在させて、セルの基部を保持させる補強的役割を
持たせるようにすることを特徴とする。
That is, the present invention provides a groove in the upper layer of a multilayer wiring board, and a semi-cylindrical member made of copper that can be electrically connected to the conductor wiring of each layer of the board is fitted into the wall surface of the groove, and a tactile sensor is provided. The cell base of the sensor is provided with cell wiring terminals at positions corresponding to these semi-cylindrical members, so that this cell base can be fitted into the grooves described above, solder is applied to the semi-cylindrical members, and adhesive is applied to the grooves. The base of the cell is fitted into this groove, and the solder applied to the semi-cylindrical member is melted, and the wiring terminal on the cell and the wiring terminal and conductor on the board are connected by the copper semi-cylindrical member and the solder. In addition to providing electrical connection with the pattern, this copper through hole should preferably extend above the substrate surface to serve as a reinforcement to hold the base of the cell. It is characterized by
以下に、図面に基づいて本発明の実施例を詳細
に説明する。
Embodiments of the present invention will be described in detail below based on the drawings.
第１Ａ図および第１Ｂ図は、本発明によつて構
成した単体触覚センサの一例を示し、ここで、１
４はセル１側の配線端子、１５は上層基板５Ａの
溝９における配線端子１４と対応する位置に配設
した例えば銅などの金属導体の半円柱部材であ
り、配線端子１４とこの半円柱部材１５とを互い
に対向した位置に設けるようになして、以下に述
べる手順によりこれら端子１４と部材１５との間
に電気的接続が得られ、しかもこの部材１５によ
りセル１の基部１Ａが基板５に強固に支持される
ようにすることができる。 FIGS. 1A and 1B illustrate an example of a standalone tactile sensor constructed in accordance with the present invention, where 1
4 is a wiring terminal on the cell 1 side, and 15 is a semi-cylindrical member made of a metal conductor such as copper, which is disposed at a position corresponding to the wiring terminal 14 in the groove 9 of the upper layer substrate 5A, and the wiring terminal 14 and this semi-cylindrical member are 15 are provided in positions facing each other, and an electrical connection is obtained between these terminals 14 and the member 15 by the procedure described below.Moreover, this member 15 connects the base 1A of the cell 1 to the substrate 5. It can be strongly supported.
続いて、第２Ａ図〜第２Ｈ図によつて、本発明
の実施例を製造工程順にしたがつて説明する。 Next, embodiments of the present invention will be described in the order of manufacturing steps with reference to FIGS. 2A to 2H.
まず、第２Ａ図に示すように、アルミナ92％に
対して粘結材等の添加物を加えて得た流動状の高
粘度を有するスリツプ状セラミツクからドクター
ブレード法を用いて厚さが0.2〜0.8mmのグリーン
シート５Ｂを形成し、このシート５Ｂ上所定の位
置に、半円柱部材１５を取付けるための半円形の
孔１５Ａ形成の手順として、円孔１５Ｂをパン
チ、ドリル若しくレーザ等によつて穿設した。し
かして、このあとタングステンＷかモリブデン
Moのペーストを円孔１５Ｂに充填し、更に配線
６の導体パターン６Ａを印刷した。 First, as shown in Fig. 2A, a slip-shaped ceramic having a fluid state and high viscosity obtained by adding additives such as a binder to 92% alumina is made using a doctor blade method to obtain a thickness of 0.2~ A 0.8 mm green sheet 5B is formed, and as a procedure for forming a semicircular hole 15A for attaching a semicircular column member 15 at a predetermined position on this sheet 5B, a circular hole 15B is punched, drilled, or laser cut. It was drilled. However, after this, tungsten W or molybdenum
Mo paste was filled in the circular hole 15B, and a conductor pattern 6A of the wiring 6 was further printed.
続いて、第２Ｂ図に示すように、上層基板用シ
ート５Ｂのセル基部１Ａ取付け位置にレーザを用
いて溝９を形成した。なお、切断にあたつては切
断線が一線上に配列された円孔１５Ｂの中心を横
切るようになして、切取られた溝９の側壁に半円
形の孔１５Ａが得られるようにした。また、この
状態では孔１５Ａに上述したペーストが充填され
ているので、後述する半円柱部材１５を入れ込む
ためにペーストの薄膜層１６を残すだけにしてあ
とのペーストを除去した。 Subsequently, as shown in FIG. 2B, a groove 9 was formed using a laser at the mounting position of the cell base 1A of the upper substrate sheet 5B. In addition, when cutting, the cutting line was made to cross the center of the circular holes 15B arranged in a line, so that a semicircular hole 15A was obtained in the side wall of the cut groove 9. In addition, in this state, the hole 15A was filled with the above-mentioned paste, so the remaining paste was removed, leaving only the thin film layer 16 of the paste in order to insert the semi-cylindrical member 15, which will be described later.
また、本例ではレーザを用いて溝９を形成した
が、パンチすなわち打抜きで溝９を形成してもよ
い。この場合は、半円形の孔１５Ａの形状が崩れ
ないようにする配慮が必要である。 Further, in this example, the grooves 9 are formed using a laser, but the grooves 9 may also be formed by punching. In this case, care must be taken to prevent the shape of the semicircular hole 15A from collapsing.
次に、別に用意した積層用のグリーンシート５
Ｂ上所定の位置に要すればこの段階で導体パター
ンの印刷およびスルーホールの形成を行つて、こ
れらのグリーンシート５Ｂを第２Ｃ図に示すよう
に上層基板のグリーンシート５Ｂと一体に積層体
とした。 Next, green sheet 5 for lamination prepared separately
At this stage, if necessary, conductor patterns are printed and through holes are formed at predetermined positions on B, and these green sheets 5B are integrated with the green sheets 5B of the upper substrate to form a laminate as shown in FIG. 2C. did.
ついで、このように積層したグリーンシート５
Ｂの積層体を水素ガスの還元雰囲気中で約1600℃
に加熱焼成して第２Ｄ図のような多層配線セラミ
ツク基板５を得た。 Next, the green sheets 5 laminated in this way
The laminate of B was heated at approximately 1600℃ in a reducing atmosphere of hydrogen gas.
By heating and firing, a multilayer wiring ceramic substrate 5 as shown in FIG. 2D was obtained.
なお、このようにして得られた多層セラミツク
基板５の寸法は焼成によつて約17％収縮する。こ
のとき、半円形孔１５Ａ内のペースト薄膜層１６
は上記の焼成でセラミツク基板５と治金的には結
合されメタライズされるが、Ｗのみで形成された
導体では電気的接続が十分でないので、この薄膜
層１６上にニツケルや銀でめつきを行い、更にそ
の上にはんだクリームを塗布した。 Note that the dimensions of the multilayer ceramic substrate 5 thus obtained shrink by about 17% during firing. At this time, the paste thin film layer 16 inside the semicircular hole 15A
is metallurgically bonded and metallized with the ceramic substrate 5 by the above firing, but since electrical connection is insufficient with a conductor formed only of W, this thin film layer 16 is plated with nickel or silver. Then, solder cream was applied on top of that.
次に、第２Ｅ図の段階で、半円形孔１５Ａに、
この孔１５Ａより基板５Ａ上部に幾分凸出気味の
長さとした銅製の半円柱部材１５をろう付けで固
定し、この半円柱部材１５の溝９に面した平面に
はんだクリームを、また、溝９の底面にはエポキ
シ樹脂等の接着剤１０を塗布しておく。 Next, at the stage of FIG. 2E, in the semicircular hole 15A,
A copper semi-cylindrical member 15 with a slightly protruding length is fixed to the upper part of the board 5A from this hole 15A by brazing, and solder cream is applied to the plane of this semi-cylindrical member 15 facing the groove 9. An adhesive 10 such as epoxy resin is applied to the bottom surface of 9.
第２Ｆ図は別に用意した受圧板３付きの触覚セ
ンサセル１を示す。このセル１の基部１Ａを第２
Ｅ図に示した溝９に嵌合させて、接着剤１０によ
りセル１を基板５に固定し、更に半円柱部材１５
に塗布したはんだクリームを、レーザにより局部
的に加熱して、部材１５と蓋部１Ａ側の配線端子
１４とをはんだ付けした。 FIG. 2F shows a tactile sensor cell 1 with a pressure receiving plate 3 prepared separately. The base 1A of this cell 1 is
The cell 1 is fitted into the groove 9 shown in FIG.
The solder cream applied thereon was locally heated with a laser to solder the member 15 and the wiring terminal 14 on the lid portion 1A side.
かくして得られた触覚センサのユニツト２０を
第２Ｇ図に示すが、このようなセンサユニツト２
０においては、セル１の基部１Ａが導体の半円柱
部材１５によつて補強され、しかもその応力集中
が緩和されて基板５に強固に固定されるのみなら
ず、電気的にも堅牢な接続状態を維持させること
ができる。 The tactile sensor unit 20 thus obtained is shown in FIG. 2G.
0, the base 1A of the cell 1 is reinforced by the conductive semi-cylindrical member 15, and its stress concentration is alleviated, so that it is not only firmly fixed to the substrate 5 but also electrically robust. can be maintained.
第２Ｈ図は、上述したような手順にしたがつ
て、１枚の多層基板５０をベースとなし、複数の
センサユニツト２０をマトリツクス状に配列させ
て完成した触覚センサを示す。 FIG. 2H shows a tactile sensor completed by using one multilayer substrate 50 as a base and arranging a plurality of sensor units 20 in a matrix according to the procedure described above.
以上説明したように、本発明によれば、多層配
線基板の上層部に溝を設けてこの溝の壁面に基板
の個々の層の導体配線と電気的接続が可能な金属
導体の半円柱部材を取付け、一方触覚センサセル
の基部には上記の半円柱部材と対応する位置にセ
ルの配線端子を配置して、このセルの基部を上記
の溝に嵌合し、基部の底面と溝の底面とを接着剤
により接着させて固定した後、半円柱部材とセル
の配線端子とをはんだ付けして電気的接続が得ら
れるようにするので、セルの基部を基板に半円柱
部材を介して強固に支持させることができ、また
半円柱部材を基板の上面から凸出させるようにす
れば、セルの基板上面近傍に発生する集中応力を
緩和させることができる。
As explained above, according to the present invention, a groove is provided in the upper layer of a multilayer wiring board, and a semi-cylindrical member made of a metal conductor that can be electrically connected to the conductor wiring of each layer of the board is provided on the wall surface of the groove. At the same time, place the wiring terminal of the cell at the base of the tactile sensor cell in a position corresponding to the semi-cylindrical member described above, fit the base of this cell into the groove described above, and connect the bottom of the base and the bottom of the groove. After bonding and fixing with adhesive, the semi-cylindrical member and the wiring terminal of the cell are soldered to obtain an electrical connection, so the base of the cell is firmly supported on the board via the semi-cylindrical member. If the semi-cylindrical member is made to protrude from the upper surface of the substrate, concentrated stress generated near the upper surface of the cell substrate can be alleviated.
更にまた、半円柱部材を介して、セルの配線端
子との間がはんだにより確実にはんだ付けされ、
セルにかかる荷重に対してたわみによつて引外さ
れるようなことがないので、信頼度の高い電気的
接続が得られる。 Furthermore, the wiring terminal of the cell is reliably soldered via the semi-cylindrical member,
Since the cell will not be disconnected due to deflection under the load applied to the cell, a highly reliable electrical connection can be obtained.
なお、以上の説明では、触覚センサを多層配線
基板に取付ける場合の接続方法について述べた
が、本発明の適用はこのような場合に限られるも
のではなく、ひろく一般に、例えばトランスなど
の比較的重い電子部品を多層配線基板上に高密度
で配設する場合の接続方法にも適用できることは
いうまでもない。 In addition, in the above explanation, the connection method was described when attaching a tactile sensor to a multilayer wiring board, but the application of the present invention is not limited to such cases, and is generally applicable to relatively heavy devices such as transformers. It goes without saying that the present invention can also be applied to a connection method when electronic components are arranged at high density on a multilayer wiring board.
第１Ａ図および第１Ｂ図は本発明による単体触
覚センサの構成の一例を示す斜視図および断面
図、第２Ａ図〜第２Ｅ図は本発明の一実施例とし
て多層セラミツク配線基板の製造工程をそれぞれ
順を追つて示す斜視図、第２Ｆ図は本発明に適用
する触覚センサセルの斜視図、第２Ｇ図は本発明
により接続を終えた単体触覚センサユニツトの斜
視図、第２Ｈ図は本発明によりマトリツクス状に
センサユニツトを配列させて得た触覚センサの一
例を示す斜視図、第３Ａ図および第３Ｂ図は従来
の単体触覚センサの構成の一例を示す斜視図およ
び断面図である。
１…触覚センサセル、１Ａ…セル基部、２…歪
ゲージ、３…受圧板、４…端子、５…基板、５Ａ
…上層基板、５Ｂ…グリーンシート、６，７…配
線、６Ａ…導体パターン、８…スルーホール、９
…溝、１０…接着剤、１１…はんだ（付け）、１
４…配線端子、１５…半円柱部材、１５Ａ…半円
形の孔、１５Ｂ…円孔、１６…ペーストの薄膜
層、２０…センサユニツト。
1A and 1B are a perspective view and a cross-sectional view showing an example of the structure of a single tactile sensor according to the present invention, and FIGS. 2A to 2E illustrate the manufacturing process of a multilayer ceramic wiring board as an embodiment of the present invention, respectively. FIG. 2F is a perspective view of a tactile sensor cell applied to the present invention, FIG. 2G is a perspective view of a single tactile sensor unit connected according to the present invention, and FIG. 2H is a perspective view of a tactile sensor unit according to the present invention. FIGS. 3A and 3B are a perspective view showing an example of a tactile sensor obtained by arranging sensor units in a shape, and FIGS. 3A and 3B are a perspective view and a sectional view showing an example of the structure of a conventional single-piece tactile sensor. DESCRIPTION OF SYMBOLS 1... Tactile sensor cell, 1A... Cell base, 2... Strain gauge, 3... Pressure receiving plate, 4... Terminal, 5... Board, 5A
...Upper layer board, 5B...Green sheet, 6,7...Wiring, 6A...Conductor pattern, 8...Through hole, 9
...Groove, 10...Adhesive, 11...Solder (attachment), 1
4... Wiring terminal, 15... Semi-cylindrical member, 15A... Semi-circular hole, 15B... Circular hole, 16... Thin film layer of paste, 20... Sensor unit.
Claims (1)
面に前記多層配線基板の個々の層の導体配線と電
気的接続が可能な金属導体の半円柱部材を取付
け、触覚センサのセルの基部には前記半円柱部材
と対応する位置に当該セルの配線端子を設けて、
前記半円柱部材の前記配線端子と対向する面には
んだを付着させた後、前記セルの基部を前記溝に
嵌合させて接着剤によつて固定し、前記半円柱部
材に付着させたはんだを溶融させて前記電気的接
続が得られるようにすることを特徴とする触覚セ
ンサと基板との接続方法。1. A groove is provided in the upper layer of the multilayer wiring board, and a semi-cylindrical member made of a metal conductor that can be electrically connected to the conductor wiring of each layer of the multilayer wiring board is attached to the wall of the groove, and the base of the cell of the tactile sensor is is provided with a wiring terminal of the cell at a position corresponding to the semi-cylindrical member,
After applying solder to the surface of the semi-cylindrical member facing the wiring terminal, the base of the cell is fitted into the groove and fixed with adhesive, and the solder applied to the semi-cylindrical member is applied. A method for connecting a tactile sensor and a substrate, characterized in that the electrical connection is obtained by melting the sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59272026A JPS61150382A (en) | 1984-12-25 | 1984-12-25 | Method of connecting tactile sensor and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59272026A JPS61150382A (en) | 1984-12-25 | 1984-12-25 | Method of connecting tactile sensor and substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61150382A JPS61150382A (en) | 1986-07-09 |
| JPH0446466B2 true JPH0446466B2 (en) | 1992-07-30 |
Family
ID=17508091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59272026A Granted JPS61150382A (en) | 1984-12-25 | 1984-12-25 | Method of connecting tactile sensor and substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61150382A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04204025A (en) * | 1990-11-30 | 1992-07-24 | Agency Of Ind Science & Technol | Method for bonding pressure sensing part of touch sensor |
| US7271586B2 (en) | 2003-12-04 | 2007-09-18 | Honeywell International Inc. | Single package design for 3-axis magnetic sensor |
| WO2005068958A1 (en) * | 2004-01-05 | 2005-07-28 | Case Western Reserve University | Structure and method for packaging micro strain sensors |
-
1984
- 1984-12-25 JP JP59272026A patent/JPS61150382A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61150382A (en) | 1986-07-09 |
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