JP4512980B2 - Element device - Google Patents

Description

  The present invention relates to an element device having a through hole into which a terminal is press-fitted.

  In recent years, as an attachment structure for mounting other members such as an integrated circuit device to an element device in which a conductive portion is formed on a base material, a hole-like through hole is formed in the base material by a drill or a laser. Solder-free solder that covers part or all of the outer edge of the through hole with a part of the conductive part formed on the base, press-fits the terminal into the through hole, and makes the conductive part and the terminal elastically contact each other A press-fit type has been developed.

  In the solderless press-fit mounting structure, a so-called press-fit connector is used in which the terminal has a larger diameter than the through hole and elastically expands and contracts. When the terminal is press-fitted into the through hole, the terminal is once reduced in diameter and expanded again in the through hole. Therefore, the surface of the terminal is elastically contacted with the outer edge of the through hole and is electrically connected to the conductive portion exposed at the outer edge of the through hole (for example, Patent Documents 1 and 2).

  FIG. 11 is a cross-sectional view schematically showing a conventional element device, and FIG. 12 is a cross-sectional view schematically showing a state in which a terminal is press-fitted to the element device shown in FIG.

  An element device 100 shown in FIG. 11 includes a base material 101, a through-hole-like through hole 102 provided in the base material 101, and conductive portions 103 formed on the upper surface side and the lower surface side of the base material 101, respectively. Have.

  In the conventional element device 100 as shown in FIG. 11, the outer edge 105 of the through hole 102 is formed to have a smaller diameter than the terminal 106. Therefore, when the terminal 106 is press-fitted into the through hole 102, the surface of the terminal 106 first comes into contact with the inlet portion 107 that constitutes the upper end of the outer edge 105, as shown in FIG. The large diameter terminal 106 is reduced in diameter while being in pressure contact with the outer edge 105 of the through hole. For this reason, the outer edge 105 of the through hole is strongly pressed outward by the elasticity of the terminal 106. Here, in order to securely connect the terminal 106 and the conductive portion 103, it is preferable to set a large pressing force due to the elasticity of the terminal 106. However, if this pressing force is excessive, the conductive portion 103 or There is a case where the base material 101 is greatly deformed to cause a crack in the conductive portion 103 or the base material 101.

  If a crack occurs in the conductive portion 103, the electrical connection between the terminal 106 and the conductive portion 103 may be poor. Further, when a crack occurs in the base material 101, a short circuit may occur due to insufficient insulation by the base material 101. In these cases, the element structure in which other members are mounted on the element device 100 is not suitable for use, and there is a problem that manufacturing loss increases.

In addition, a technology for covering the outer surface of the through hole with a hard support structure has been developed. In this case, the number of parts of the element device is remarkably increased and the manufacturing process becomes very complicated. There was a problem that the manufacturing cost of the remarkably increased.
JP 2003-283093 A JP 2000-174406 A

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an element device at which the outer edge of a through hole is not greatly deformed when a terminal is attached at low cost.

The element device of the present invention that solves the above problems includes a base material, a conductive portion formed on the base material, and a through-hole that is formed in the base material and that the conductive portion is exposed on at least a part of the outer edge. An element device, wherein the conductive portion is electrically connected to the terminal when the terminal is press-fitted into the through-hole,
In the inner layer of the base material located at the periphery of the through hole, a hard reinforcing portion is formed integrally with the base material,
The strengthening portion is arranged on the entire outer circumference side of the through hole so as not to contact the conductive portion.

In the element device of the present invention , a plurality of thin layer bodies are laminated and the adjacent thin layer bodies are bonded to each other with an adhesive, and the substrate is formed on the surface of at least one of the thin layer bodies. It is preferable to have a multilayer laminate having a reinforced portion and a through hole formed in the multilayer laminate .

  According to the element device of the present invention, the hard reinforcing portion is arranged inside the base material located at the periphery of the through hole. For this reason, for example, even when the elasticity of the terminal is set to be large and the terminal strongly presses the outer edge of the through hole, the outer edge of the through hole is prevented from being greatly deformed. Therefore, the base material and the conductive part constituting the outer edge of the through hole are not greatly deformed, and it is possible to prevent the base material and the conductive part from being cracked.

  In addition, since the reinforced part is integrally formed with the base material in the inner layer of the base material, it is possible to manufacture the element device easily and inexpensively without requiring complicated steps to form the reinforced part. become.

  When the reinforced portion is formed of a highly conductive material and at least a part of the reinforced portion is electrically connected to the conductive portion, a part of the conductive portion can be configured from the reinforced portion, and the configuration of the element device is simplified. Thus, the manufacturing cost of the element device can be further reduced.

  The element device of the present invention is provided with a terminal called a press-fit connector described above. The element device of the present invention includes a normal base material and a conductive part, and also includes a through hole for press-fitting a terminal and electrically connecting the terminal and the conductive part.

  The substrate and the conductive part are known ones manufactured by a known method, and what is called a so-called print substrate can be used. The through-hole is a portion formed in a hole shape in the thickness direction of the base material, and may be a through hole penetrating in the thickness direction of the base material, or may be opened on one surface of the base material in the thickness direction. It may be a dead end.

  At the outer edge of the through hole, the base material and the conductive portion are exposed, or only the conductive portion is exposed. That is, when a hole to be a through hole is formed in the base material and only a part thereof is covered with the conductive portion, the base material and the conductive portion are exposed at the outer edge of the through hole. Further, when a hole to be a through hole is formed in the base material and the whole is covered with the conductive portion, only the conductive portion is exposed on the outer edge of the through hole. In any case, the portion of the conductive portion exposed to the outer edge of the through hole in the element device comes into contact with the terminal, and the conductive portion and the terminal are electrically connected.

  The conductive portion may cover the entire outer edge of the through hole and may be exposed to the entire outer edge, or may be exposed to only a part of the outer edge of the through hole, but is preferably exposed to the entire thickness direction of the outer edge. . This is because the electrical connection between the terminal and the conductive portion is ensured by reliably contacting the terminal. Further, when the conductive portion is exposed in the entire thickness direction of the outer edge, there is an advantage that the conductive portion rubbed with the terminal is difficult to peel off.

  In the element device of the present invention, a hard reinforcing portion is integrally formed with the base material in the inner layer of the base material located at the periphery of the through hole. This reinforcing portion is for preventing the outer edge of the through hole from being greatly deformed when the terminal is press-fitted, and is made of a material or shape that is strong enough to withstand the elastic contact of the terminal. Such a reinforced portion may be made of a material having high conductivity such as copper, iron or an alloy thereof, or may be made of a material having low conductivity or non-conductivity such as resin or ceramic. good.

  When the reinforced portion is made of a highly conductive material, at least a part of the reinforced portion may be electrically connected to the conductive portion, and the reinforced portion may constitute a part of the conductive portion. In this case, the conductive portion and the reinforcing portion can be formed inside the element device with a simple configuration, and the manufacturing cost of the element device can be further reduced.

  In addition, it is preferable that the reinforcing portion has a large arrangement thickness in the thickness direction of the base material in order to more reliably prevent the outer edge of the through hole from being greatly deformed. For example, it is desirable that the thickness be formed to be 35 μm or more, or to be formed in two or more layers with a thickness of about 18 μm.

  The reinforcing part only needs to exhibit the effect of supporting the outer edge of the through hole from the inside of the base material, and may or may not be exposed to the outer edge of the through hole. Further, the reinforcing portion may be formed on a part of the periphery of the through hole or may be formed on the entire periphery. When the reinforced portion is formed on the entire periphery of the through-hole periphery, the outer edge of the through-hole is more reliably prevented from being deformed more reliably, and cracks and the like of the base material and the conductive portion are more reliably prevented. .

  In the element device of the present invention, the substrate may have a single layer structure or a multilayer structure of two or more layers. Further, the conductive portion may be formed only on one surface of the base material, may be formed on a plurality of surfaces such as two opposing surfaces of the base material, or may be formed on the inner layer of the base material. good.

  Furthermore, the conductive part may be formed integrally with the part exposed to the outer edge of the through hole and the other part, or may be formed separately. For example, a conductive part is formed in advance on the part other than the outer edge of the through hole of the base material by a method such as printing, and a conductive part is formed only on the outer edge part of the through hole by a method such as plating, and both conductive parts are brought into contact with each other. May be electrically connected. In this case, the part exposed to the outer edge of the through hole in the conductive part and the other part can be formed of different materials.

  In the case where the base material has a multilayer structure, the reinforcing portion can be laminated and formed between the layered base materials, that is, the inner layer of the base material by an ordinary laminating method. When the base material has a single-layer structure, the reinforcing portion can be laminated on the base material inner layer by a method such as insert molding.

Hereinafter, an element device of the present invention will be described with reference to the drawings.

( Reference example )
The element device of this reference example is a printed circuit board on which an integrated circuit device is mounted. The principal part expanded sectional view which represents typically the element apparatus of this reference example is shown in FIG.

As shown in FIG. 1, the element device 1 of the present reference example includes a substantially flat substrate 2, a printed conductive portion 3 that is printed on the upper layer, the inner layer, and the lower surface of the substrate 2, and the substrate 2. Through-hole 5 drilled in the thickness direction, and a connection conductive portion 6 formed by plating on the entire outer edge of the through-hole 5. Among these, the print conductive part 3 and the connection conductive part 6 are connected to each other and are electrically connected to each other to form a conductive part 8. The base material 2 is made of a glass woven epoxy resin, and through holes 5 that are substantially circular through holes are cut and formed at predetermined positions of the base material 2. The through hole 5 is formed in a true cylinder shape having a diameter of 1 mm.

The base material 2 is formed in a laminated structure in which a substantially flat thin layer body 7 is laminated in three layers in the thickness direction. The portion of the printed conductive part 3 formed in the inner layer of the substrate 2 is formed between the uppermost layer and the adjacent layer of the substrate 2 and between the lowermost layer and the adjacent layer. Yes. The printed conductive part 3 and the connecting conductive part 6 are made of copper. A portion of the printed conductive portion 3 formed between the layers of the base material 2 is formed with a thickness of 35 μm. This portion is disposed on the periphery of the through hole 5 over the entire circumference of the through hole 5. In the present reference example , the printed conductive portion 3 formed on the inner layer of the base material 2 constitutes the reinforced portion 10. In the reinforced portion 10, a portion adjacent to the outer edge of the through hole 5 is connected to the connection conductive portion 6.

According to the element device 1 of the present reference example , the reinforcing portion 10 is provided on the periphery of the through hole 5. Therefore, when the terminal is attached to the element device 1, the outer edge of the through hole 5 is not easily deformed even when the terminal 11 is elastically contacted with the through hole 5. No cracks occur. In addition, since the reinforced portion 10 constitutes a part of the conductive portion 8, the conductive portion 8 and the reinforced portion 10 are formed together inside the element device 1 with a simple structure, and the element device 1 is inexpensive. It will be manufactured. A method for manufacturing the element device 1 of this reference example will be described below. 2 to 7 schematically show how the element device 1 of this reference example is manufactured.

  First, as shown in FIG. 2, a substantially flat thin layer body 7 was prepared, and a conductive layer 12 made of copper was formed on the surface of the thin layer body 7 as shown in FIG. Thereafter, the surface of the conductive layer 12 is covered with a mask material (not shown) having a desired pattern, and the conductive layer 12 is etched to form the conductive layer 12 in a desired pattern as shown in FIG. The laminated body 15 which consists of the thin layer body 7 and the printed conductive part 3 formed thereon is formed.

  Next, a substantially flat thin layer body 16 is prepared separately, and the thin layer body 16 is bonded to the gap between the two laminates 15 obtained in the above-described process with an adhesive 18 as shown in FIG. Thus, the multilayer laminate 20 shown in FIG. 6 was obtained.

The through hole 5 is cut and formed in the multilayer laminate 20 obtained by the above process, and the outer peripheral surface of the through hole 5 is copper-plated to form the connection conductive portion 6, and the element device of this reference example shown in FIG. 1 was obtained.

Since the element device of this reference example can be easily manufactured with very few processes as described above, even if the outer edge of the through hole 5 is not easily deformed when the terminal 11 is attached, The manufacturing cost is greatly reduced.

In this reference example , the outer edge of the through hole 5 of the element device 1 is covered with the connection conductive portion 6 made of copper plating, but the connection conductive portion 6 may not be provided as shown in FIG. In this case, at the outer edge of the through hole 5, the base material 2, the printed conductive portion 3 printed on the upper layer and the lower surface of the base material 2, and the reinforcing portion 10 are exposed. When the terminals 11 are press-fitted into the through holes 5 of the element device 1, the conductive portions 8 are in direct contact with and electrically connected to the terminals 11. Also in this case, since the hard reinforcing portion 10 is provided in the inner layer of the base material 2 located at the periphery of the through hole 5, the outer edge of the through hole 5 is not greatly deformed. The conductive portion 8 is not cracked.

Moreover, in this reference example , although the reinforcement | strengthening part 10 was provided in two places of the thickness direction of the base material 2, you may provide only in one place of the thickness direction as shown, for example in FIG. In this case, it is desirable that the thickness of the reinforced portion 10 be thicker than that provided in a plurality of locations in the thickness direction of the substrate 2. This is because the strength of the periphery of the through hole 5 is further increased to make it difficult to deform the outer edge of the through hole 5 when the terminal 11 is press-fitted.

Furthermore, in the present reference example , the reinforcing portion 10 and the connection conductive portion 6 are electrically connected. However, the element device of the present invention is such that, for example, the reinforcing portion 10 does not contact the connection conductive portion 6 as shown in FIG. The reinforcing portion 10 and the connection conductive portion 6 are not electrically connected by being arranged on the outer peripheral side of the through hole 5 . Also in this case, since the periphery of the through hole 5 is reinforced by the reinforcing portion 10 as in the above-described reference example , the outer edge of the through hole 5 is prevented from being greatly deformed even when the terminal 11 is press-fitted. The

It is sectional drawing which represents typically the element apparatus of a reference example . It is sectional drawing which represents typically a mode that the element apparatus of a reference example is manufactured. It is sectional drawing which represents typically a mode that the element apparatus of a reference example is manufactured. It is sectional drawing which represents typically a mode that the element apparatus of a reference example is manufactured. It is sectional drawing which represents typically a mode that the element apparatus of a reference example is manufactured. It is sectional drawing which represents typically a mode that the element apparatus of a reference example is manufactured. It is sectional drawing which represents typically a mode that the element apparatus of a reference example is manufactured. It is sectional drawing which represents typically the other example of the element apparatus of a reference example . It is sectional drawing which represents typically the other example of the element apparatus of a reference example . It is sectional drawing which represents typically an example of the element apparatus of this invention . It is sectional drawing which represents the conventional element device typically. It is sectional drawing which represents typically a mode that the terminal is press-fitted and attached to the conventional element apparatus shown in FIG.

Explanation of symbols

1: Element device 2: Base material 5: Through hole 8: Conductive part 10: Reinforced part 11: Terminal

Claims (2)

A base member, a conductive part formed in the base member, and a through hole formed in the base member and exposed at least at a part of the outer edge, and a terminal is provided in the through hole. An element device in which the conductive portion is electrically connected to the terminal when press-fitted,
In the inner layer of the base material located at the periphery of the through hole, a hard reinforcing portion is integrally formed with the base material,
The element device is characterized in that the reinforcing portion is arranged on the entire outer circumference side of the through-hole so as not to contact the conductive portion. The element device is:
A multilayer having the base material in which a plurality of thin layer bodies are laminated and the adjacent thin layer bodies are bonded together with an adhesive, and the reinforcing portion formed on the surface of at least one of the thin layer bodies A laminate,
The element device according to claim 1, further comprising a through hole formed in the multilayer laminate.

Images