JP5347543B2 - Equipment, equipment manufacturing methods, inspection methods - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a printed wiring board where a state of insertion of a press-fit terminal into a through hole can be electrically inspected in detail; a method of manufacturing a connection body where a printed wiring board and the press fit terminal are connected; an inspection method; and equipment. <P>SOLUTION: The printed circuit board 10 is formed by stacking a plurality of insulating layers P1 to P5 and a plurality of circuit layers, wherein a through hole 11 into which the press-fit terminal 20 is inserted is formed. The printed circuit board includes a wall surface conductor layer C provided on a wall surface of the through hole 11, and patterns A1 to A6, and B1 to B6 for arrangement detection, which are portions of the plurality of circuit layers and provided outside a wall surface conductor layer C at an interval with the wall surface conductor layer C. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

The present invention, through holes are provided, devices and equipment that the printed circuit board is mounted to the press-fit terminal is inserted into them, which in the through hole of the printed wiring board is press-fit terminal is connected is inserted about the method of manufacturing and testing how. More particularly, a device printed circuit board formed by laminating a plurality of insulating layers and a plurality of circuit layers has been mounted, a method of manufacturing a device, it relates to the inspection how.

  Conventionally, some press-fit terminals are connected by press-fitting into through holes provided in the wiring board. In such a case, after press-fitting, it is inspected whether the press-fit terminal and the through hole are securely connected. For this purpose, various inspection techniques have been proposed, such as visual inspection and image, and contact with the terminal tip. Among them, for example, Patent Documents 1 and 2 disclose techniques for electrically inspecting the connection state. According to these techniques, inspection can be performed without visual inspection and without touching a press-fit terminal or a through hole.

  Patent Document 1 describes an inspection technique using a printed wiring board provided with an inner layer wiring connected to an inner wall of a through hole. As a result, it can be detected when the plating on the inner wall of the through hole is damaged during press-fitting. Japanese Patent Application Laid-Open No. H10-228561 describes a technique for performing inspection by connecting a printed wiring board for inspection to a press-fit connector. It is said that all the press-fitting failure modes can be detected by inspecting the continuity between the inspection patterns formed on the inspection printed wiring board.

JP 2004-356180 A JP 2002-237664 A

  However, any of the above-described conventional techniques is a two-choice test of whether or not conduction is made, and it is impossible to detect the press-fit state of each terminal. Therefore, even in an unstable connection state, it is determined as normal as long as it is conductive. For example, the terminal is inserted with an inclination with respect to the through hole, or the outer diameter of the terminal is not sufficiently large with respect to the inner diameter of the through hole, so that the contact pressure to the through hole is small. In these cases, even if normal operation can be performed in the initial stage, the state of the unstable portion may be deteriorated by vibration due to use or the like. In that case, there is a possibility that the connection state becomes defective in a period shorter than the expected lifetime.

The present invention has been made to solve the problems of the conventional inspection method described above. That it is an object, electrically, equipment printed wiring board can be inspected insertion state of the press-fit pin into the through-holes in detail are mounted, a method of manufacturing a device, to provide an inspection how is there.

The device of the present invention, which has been made for the purpose of solving this problem, is equipped with a printed wiring board in which a plurality of insulating layers and a plurality of circuit layers are laminated and an insertion hole into which a press-fit terminal is inserted is formed. In addition, a device in which a press-fit terminal is inserted in the insertion hole , and the printed wiring board is a wall surface conductor layer provided on the wall surface of the insertion hole and a part of a plurality of circuit layers, and a wall surface conductor. the outer layer possess a disposition detection pattern which is provided at a distance from the wall surface conductor layer, the insertion hole press-fit terminal is inserted, between the placement detection pattern and the wall surface conductor layer An electrical signal acquisition unit that acquires an electrical signal that depends on the distance of the device, and a state monitoring unit that grasps whether or not the press-fit terminal is inserted based on the acquired electrical signal .

According to the device of the present invention, when the press-fit terminal is press-fitted into the insertion hole, the distance between the wall surface conductor layer and the arrangement detection pattern is reduced when the insertion hole is expanded. Therefore, it is possible to electrically determine the degree of deformation of the through hole by detecting the electric signal value depending on the distance. Furthermore, if arrangement detection patterns are provided in a plurality of circuit layers, it is possible to easily grasp how far the layers have been deformed by inserting press-fit terminals. Therefore, it is possible to inspect the insertion state of the press-fit terminal into the through hole in detail electrically.

Furthermore, in the present invention, for the insertion hole into which the press-fit terminal is inserted, an electrical signal acquisition unit that acquires an electrical signal depending on the distance between the wall conductor layer and the arrangement detection pattern, and the acquired electrical signal based on, that have a and a state monitoring unit to know the quality of the insertion state of the press-fit terminal.
Since this is the case, it is possible to monitor the insertion state of the press-fit terminal even after being mounted on the device.

Further, in the present invention, it is desirable that the arrangement detection patterns are provided at positions on both sides with respect to the insertion hole.
If it is such, when inserting a flat press-fit terminal into an insertion hole, it can be set as the direction which the wide side opposes the arrangement | positioning detection pattern. And, by detecting with the arrangement detection patterns on both sides, it is possible to accurately grasp the detailed insertion state of the terminal such as the inclination of the terminal.

Furthermore, in the present invention, it is desirable that the arrangement detection pattern is provided separately from the circuit portion of the circuit layer.
In such a case, the original function of the printed wiring board is not affected.

The present invention further provides a method for producing a device, after the flop-less fit terminal is inserted into the insertion hole, a step of acquiring an electrical signal that depends on the distance between the placement detection pattern and wall conductor layers, The present invention extends to a method of manufacturing a device having a process of grasping whether the press-fit terminal is inserted or not based on the acquired electrical signal and eliminating the judged defective product.

The present invention includes a printed circuit board of the device, there is provided an inspection method for inspecting the press-fit terminal is inserted into the insertion hole, the connection state, after the flop-less fit terminal is inserted into the insertion hole, An inspection method comprising a step of acquiring an electric signal depending on a distance between the wall conductor layer and the arrangement detection pattern, and a step of determining whether the press-fit terminal is inserted based on the acquired electric signal. It extends to.

  Further, according to the present invention, in the step of grasping the quality, it is determined that each of the electric signals of the plurality of circuit layer arrangement detection patterns is a non-defective product when all of the values are within a predetermined range. However, it is desirable to determine that the product is defective when there is a value that is not within the predetermined range.

Your name, the apparatus of the present invention also includes a vehicle and industrial robots.

Equipment of the present invention, a method of manufacturing a device, according to the inspection how, electrically, can inspect the insertion state of the press-fit pin into the through-holes in detail.

It is sectional drawing of the printed wiring board which concerns on this form. It is a top view of the printed wiring board concerning this form. It is a section perspective view in the state where a press fit terminal was press-fitted into a printed wiring board. It is explanatory drawing which shows the through hole of the state in which the press fit terminal was inserted normally. It is explanatory drawing which shows a test | inspection circuit. It is explanatory drawing which shows the example of the favorable range of displacement. It is explanatory drawing which shows the through hole of the state in which the press fit terminal was inclined and inserted. It is explanatory drawing which shows the example of the displacement amount at the time of inserting incline. It is explanatory drawing which shows a test | inspection circuit. It is explanatory drawing which shows a vehicle. It is explanatory drawing which shows an industrial robot. It is sectional drawing of the printed wiring board of another example.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best mode for embodying the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, the present invention is applied to a printed wiring board in which a through hole for inserting a press-fit terminal is formed.

  The printed wiring board 10 of the present embodiment is a wiring board having a multilayer structure in which through holes 11 are formed as shown in a sectional view in FIG. In this embodiment, a multilayer wiring board in which five resin layers (P1 to P5) and a total of six circuit layers are provided between both outer surfaces and layers is used. The five resin layers P1 to P5 are electrically insulating layers. Also, this figure shows the state of the printed wiring board 10 before the press-fit terminal 20 is inserted into the through hole 11.

  In each circuit layer of the printed wiring board 10, detection patterns are formed in the vicinity of the left and right sides of the through hole 11 in FIG. That is, the printed wiring board 10 has detection patterns A1 to A6 on the left side of the through hole 11 in the drawing and detection patterns B1 to B6 on the right side of the drawing. A wall conductor layer C is formed on the wall surface of the through hole 11 by plating or the like. In the state shown in this figure, the detection patterns A1 to A6 and B1 to B6 are all slightly separated from the wall surface conductor layer C and are not in contact with each other. That is, the detection patterns A1 to A6, B1 to B6 and the wall surface conductor layer C are insulated from each other by the resin layers P1 to P5.

  Further, each of the detection patterns A1 to A6 and B1 to B6 is substantially equidistant from the wall surface conductor layer C. The resin layers P1 to P5 are manufactured by using, for example, an epoxy resin plate or prepreg containing glass fiber, but portions between the detection patterns A1 to A6 and B1 to B6 and the wall surface conductor layer C. No glass fiber is contained in (inter-pattern portion P0). These detection patterns A1 to A6 and B1 to B6 are formed separately from the original circuit pattern.

  When the printed wiring board 10 of FIG. 1 is viewed from above, it is as shown in FIG. On the surface of the printed wiring board 10, substantially semicircular lands C <b> 1 extending from the wall surface conductor layer C are formed at two locations at the top and bottom in the drawing. Although shown in FIG. 2 with a certain width, the wall surface conductor layer C only has a thickness of about the plating layer thickness from this viewpoint. Further, the first detection patterns A1 and B1 in FIG. 1 are visible on the left and right sides of the through hole 11 in FIG. The detection patterns A2 to A6 in the lower layer are all formed in a detection pattern A1, and the detection patterns B2 to B6 are all formed in a detection pattern B1, both in the same position and shape in plan view.

  The printed wiring board 10 of this embodiment is used by press-fit terminals 20 being press-fitted into the through holes 11 as indicated by arrows in FIG. Further, in the present embodiment, a flat plate as shown in FIG. That is, it is a thin plate in the depth direction in the figure as compared to the left and right direction in the figure. And such a press fit terminal 20 is inserted so that it may become the direction shown with a broken line in FIG. That is, the detection patterns A1 to A6 and B1 to B6 are arranged at positions where the wide sides of the press-fit terminals 20 to be inserted are opposed to each other.

  In this embodiment, the press-fit terminal 20 is harder than the resin in the pattern portion P0 of the printed wiring board 10. Therefore, when the press-fit terminal 20 is press-fitted into the through hole 11, a part of the wall surface conductor layer C is pressed toward the detection patterns A1 to A6 and B1 to B6 by the press-fit terminal 20. Then, the inter-pattern portion P0 at that location is compressed. As a result, as shown in FIG. 3, the inter-pattern portion P0 and the wall conductor layer C are slightly deformed. Then, the arrangement is such that the distance between the wall conductor layer C and the detection pattern at the deformed portion is slightly closer than in the state of FIG. Further, the press-fit terminal 20 and the wall surface conductor layer C are brought into pressure contact with each other to be conducted.

  Each of the detection patterns A1 to A6, B1 to B6 and the wall surface conductor layer C face each other with the inter-pattern portion P0 interposed therebetween. By inserting the press-fit terminal 20, the wall surface conductor layer C is slightly deformed as shown in FIG. Therefore, in the deformed portion, the distance D (DA1 to DA6, DB1 to DB6) between the detection patterns A1 to A6, B1 to B6 and the wall surface conductor layer C is slightly smaller than that before insertion. Since the pattern portion P0 between the detection patterns A1 to A6, B1 to B6 and the wall surface conductor layer C is a thin insulating layer, the wall surface conductor layer C and its detection patterns A1 to A6 and B1 to B6 before and after insertion. The capacitance between and has changed. Therefore, if any electrical signal value depending on the capacitance is acquired, information about the distance D at each detection pattern portion can be obtained.

  Therefore, in this embodiment, as shown in FIG. 5, an inspection apparatus 30 is connected to the printed wiring board 10 in which the press-fit terminals 20 are press-fitted in this way. With this inspection device 30, the insertion state is inspected by obtaining an electric signal value corresponding to the distance D on a one-to-one basis. The inspection apparatus 30 of this embodiment is connected to each of the detection patterns A1 to A6, B1 to B6 and the wall conductor layer C, and the current when an AC voltage is applied between the detection pattern and the wall conductor layer C. The value is measured. In addition to the above, the inspection device may be configured to include a coil as the inspection circuit and measure the frequency of the AC voltage. Alternatively, it may be by applying a DC voltage and measuring the time constant at the on / off time.

  As shown in FIG. 5, the inspection device 30 of this embodiment includes a switching unit 31, a voltage application unit 32, a current detection unit 33, an electric signal processing unit 34, an insertion state determination unit 35, a result output unit 36, and a storage unit 37. Have. The switching unit 31 sequentially switches the detection pattern connected to the voltage application unit 32 to be an inspection target. The voltage application unit 32 applies an AC voltage between the detection pattern to be inspected and the wall surface conductor layer C. The flowing current value is detected by the current detection unit 33.

  Further, in the electric signal processing unit 34, the distances DA1 to DA6 and DB1 to DB6 of the wall surface conductor layers C at the positions of the respective detection patterns correspond one-to-one based on the current value detected by the current detection unit 33. Get the numeric value. The storage unit 37 stores a non-defective range of numerical values obtained in the electrical signal processing unit 34 in advance. And the insertion state determination part 35 compares the numerical value acquired in the electric signal processing part 34 with the non-defective range, respectively, and determines whether or not the insertion state of the press-fit terminal 20 is good. The determination result is output to the result output unit 36. Moreover, you may make it preserve | save the data, such as an acquired electrical signal value and a determination result, in the memory | storage part 37 as needed.

  Next, a determination method in the insertion state determination unit 35 will be described. When the press-fit terminal 20 is press-fitted well into the through hole 11, the distances DA1 to DA6 and DB1 to DB6 are substantially equal on the left and right as shown in FIG. Also, the distance from the insertion side (lower side in the figure) of the press-fit terminal 20 to the middle of the through hole 11 is displaced so that the distance is smaller, and the front side (upper side in the figure) is not displaced. The distance is great. For example, in FIG. 4, the wall surface conductor layer C is almost equidistant in the upper three layers (positions of detection patterns A1 to A3 and B1 to B3). The lower three layers (the positions of the detection patterns A4 to A6 and B4 to B6) are substantially equidistant and smaller than the upper layer. When the insertion state of the press-fit terminal 20 is good, each distance D is approximately like this.

  Therefore, for example, as shown in FIG. 6, ranges in which the distances DA1 to DA6 and DB1 to DB6 can be determined to be good are set and stored in the storage unit 37. If each displacement amount detected at each detection pattern is within the range between the positions indicated by two broken lines in the figure, the inspection device 30 has a good terminal insertion state. It is determined that Further, when it is determined that the inserted state of all the inserted terminals is good, the printed wiring board 10 is determined to be good and supplied to the next process. However, if there is a terminal determined to be not good, it is eliminated without supplying it to the next process. In this embodiment, it is possible to determine in more detail the reason for the malfunction of such a thing.

  Therefore, in this embodiment, another parameter is also used. That is, the left-right difference of the distance D and the left-right stroke amount at the same layer position. The left-right differences d1 to d6 are differences in the distance D between the A side and the B side of the same layer. That is, dk = | DAk−DBk | (k = 1 to 6). Further, as shown in FIG. 4, the stroke amounts SA and SB are the distances from the insertion side of the press-fit terminal 20 to the foremost position (detection pattern A4 and detection pattern B4 in this example). Distance. That is, the distance D is a small range.

  The inspection apparatus 30 predetermines and stores a range in which it can be determined that the left and right differences d1 to d6 and stroke amounts SA and SB are good. By using these parameters, the inspection apparatus 30 can grasp the insertion state of the press-fit terminal 20 that is determined to be defective by the insertion state determination unit 35. As a result, it can be determined whether or not correction is possible, and it can be used for subsequent process improvement.

  For example, when the difference between the left and right stroke amounts SA and SB is large, it can be determined that the press-fit terminal 20 is press-fitted obliquely with respect to the through hole 11. When the press-fit terminal 20 is inserted obliquely with respect to the through-hole 11, for example, as shown in FIG. In the case of this example, the distance D at each position is obtained as indicated by the black circles in FIG. The stroke amount SB on the B side is zero. In this case, even if it is conductive for the time being, it is not preferable because the contact state may deteriorate over time.

  Further, although the difference in the stroke amount between the left and right is small, it can be determined that the one where the left-right differences d1 to d6 of the distance D are large is press-fitted with the center of the through hole 11 and the press-fit terminal 20 shifted. . Even in this case, even if it is conductive for the time being, it is not preferable because the contact state may deteriorate over time. Therefore, it is determined that the insertion state is not good.

  In addition, there may be a problem in the insertion state due to variations in accuracy of parts. When the terminal width is small or the diameter of the through hole 11 is large, the distance D is large as a whole. Alternatively, when the terminal width is large or the diameter of the through hole 11 is small, the distance D is small as a whole. When these occur frequently, there is a possibility that there is a problem in the part accuracy, and improvement is required.

  In addition, although the left-right difference in the distance D is small, the left and right stroke amounts SA and SB may both be excessive or small. This may be due to the insertion pressure during the press fit being too large or too small. Alternatively, even when the press-fit terminal 20 is bent and is in contact only with a very lower layer near the entrance of the through hole 11, it can be determined from the fact that both the stroke amounts SA and SB are small. Alternatively, there is a possibility that the strength balance between the inter-pattern portion P0 of the printed circuit board 10 and the press-fit terminal 20 is not good.

  Note that the inspection device 30 may be mounted on a device using the printed wiring board 10. For example, as shown in FIG. 9, an integrated circuit 40 may be mounted on the printed wiring board 10 so that an electric signal can be detected. The result can be transmitted to the inspection device 30 mounted on the device control device or the like for determination. By doing so, it is possible to monitor the insertion state of the press-fit terminal 20 even after the start of use of the device.

  For example, when the printed wiring board 10 is mounted on a vehicle, an industrial robot, or the like, the terminal connection state may change due to vibration caused by running or driving. Therefore, it is preferable that the inspection apparatus 30 appropriately inspect. The electrical connection can be performed by a continuity test. However, according to the inspection apparatus 30, it can be grasped even when the insertion state becomes unstable although the continuity is established.

  Therefore, the storage unit 37 of the inspection apparatus 30 stores the distance D of each terminal and the stroke amounts SA and SB. When the distance D becomes smaller than before or the stroke amounts SA and SB become larger than before, the inserted state of the terminal may be deteriorated. Therefore, a change in the insertion state of the press-fit terminal can be detected by appropriately performing this inspection. If it is determined that the insertion state has deteriorated, a warning display or the like may be performed. Moreover, you may make it test | inspect in parallel, using an apparatus. For example, the vehicle may be provided with an abnormality detection function during traveling. If it does in this way, an apparatus can be used, confirming the insertion state of a terminal.

  For example, as shown in FIG. 10, the printed wiring board 10 and the inspection device 30 can be mounted on a vehicle 200 and used. The vehicle 200 is a hybrid vehicle that is driven by using an engine 240, a front motor 220, and a rear motor 230 in combination. The vehicle 200 includes a vehicle body 290, an engine 240, a front motor 220, a rear motor 230, a cable 250, an ECU (Electronic Control Unit) 260, and a battery pack 100 attached thereto. The ECU 260 incorporates the printed wiring board 10, the inspection device 30, an inverter, and the like.

  In this example, the ECU 260 corresponds to the state monitoring unit. The vehicle may be any vehicle that uses an ECU, such as an electric vehicle, a hybrid vehicle, a plug-in hybrid vehicle, a hybrid railway vehicle, a forklift, an electric wheelchair, an electric assist bicycle, an electric scooter, and the like. .

  Alternatively, for example, as shown in FIG. 11, the printed wiring board 10 and the inspection device 30 can be mounted on an industrial cart robot 300. The cart robot 300 has two coaxial wheels 302 and 303 and a main body 305 that is rotatably supported by the axle 304 thereof. The main body 305 has a head 311, a trunk 312, a right arm 314, and a left arm 315. A CCD camera or the like is mounted on the head 311 so that the surrounding environment can be detected. The base end portions of the arm portions 314 and 315 are attached to the upper left and right positions (shoulder portions) of the body portion 312. Further, a control computer 325 for controlling each motor driver and the like is provided inside the body portion 312. The control computer 325 incorporates the printed wiring board 10, the inspection device 30, and the like.

  In this example, the control computer 325 corresponds to a state monitoring unit. The industrial robot is not limited to the cart robot as long as it has a built-in control computer. For example, an upright walking robot, a caterpillar mobile robot, a multi-wheel robot, an arm robot, and the like can be given.

  As described above in detail, according to the connection inspection method of the present embodiment, the printed wiring board 10 is a multilayer board in which the wall surface conductor layer C is formed on the wall surface of the through hole 11. Further, in the vicinity of the through hole 11, one having a plurality of detection patterns formed on a part of the circuit layer of the printed wiring board 10 is used. Then, the press-fit terminal 20 is inserted with the wide direction aligned with the through hole 11 on the side where the detection pattern is formed. Then, the distance D between the wall surface conductor layer C and the detection pattern is reduced by pressing by the press-fit terminal 20. Therefore, by detecting an electric signal value depending on the distance D, a numerical value corresponding to the distance D at each position can be obtained. Therefore, the terminal insertion state can be grasped based on this numerical value. As a result, the insertion state of the press-fit terminal into the through hole can be inspected in detail.

In addition, this form is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof.
For example, the number of layers of the printed wiring board 10 is not limited to this. Further, for example, the tip shape of the press-fit terminal is not limited to the illustrated one. Further, in the above embodiment, only the wiring board side is deformed by press-fitting, but both the wiring board and the terminal may be deformed.

  Further, the land C1 of the wall surface conductor layer C of the through hole 11 may be formed in a direction facing the detection pattern as shown in FIG. Further, for example, in the above embodiment, the determination is made using the distance D between the wall surface conductor layer and the detection pattern, but the deformation amount is obtained by comparing the distance before insertion and the distance after insertion. It may be. This is because the insertion state can also be determined based on the amount of deformation. The present invention includes what grasps the quality based on this deformation amount. That is, the predetermined range may be determined by the time when the distance after insertion is measured.

DESCRIPTION OF SYMBOLS 10 Printed wiring board 11 Through hole 20 Press fit terminal 30 Inspection apparatus 200 Vehicle 260 ECU
300 Industrial Robot 325 Control Computer A-1 to A-6, B-1 to B-6 Detection Pattern C Wall Conductor Layer

Claims (7)

A printed wiring board having a plurality of insulating layers and a plurality of circuit layers laminated and having an insertion hole into which a press-fit terminal is inserted is mounted, and the press-fit terminal is inserted into the insertion hole. In equipment,
The printed wiring board is
A wall conductor layer provided on the wall surface of the insertion hole;
A part of the plurality of circuit layers, and an arrangement detection pattern provided on the outside of the wall conductor layer and spaced from the wall conductor layer,
An electrical signal acquisition unit that acquires an electrical signal depending on a distance between the wall conductor layer and the arrangement detection pattern for the insertion hole into which the press-fit terminal is inserted;
An apparatus comprising: a state monitoring unit that grasps whether or not the press-fit terminal is inserted based on the acquired electrical signal. The device according to claim 1,
The arrangement detecting pattern is provided on both sides of the insertion hole. In the device according to claim 1 or 2,
The arrangement detection pattern is provided separately from a circuit portion of the circuit layer. In the manufacturing method of the apparatus as described in any one of Claim 1- Claim 3,
Obtaining an electrical signal depending on a distance between the wall conductor layer and the arrangement detection pattern after the press-fit terminal is inserted into the insertion hole;
And a step of grasping whether the press-fit terminal is inserted or not on the basis of the acquired electrical signal and excluding those determined to be defective. In an inspection method for inspecting a connection state between the printed wiring board of the device according to any one of claims 1 to 3 and a press-fit terminal inserted in the insertion hole,
Obtaining an electrical signal depending on a distance between the wall conductor layer and the arrangement detection pattern after the press-fit terminal is inserted into the insertion hole;
And a step of grasping whether the press-fit terminal is inserted or not based on the acquired electrical signal. Oite the manufacture how the apparatus according to claim 4,
In the step of determining whether the product is good or bad, it is determined that the electrical signal of each of the arrangement detection patterns of the plurality of circuit layers is a non-defective product when all of the values are within a predetermined range. A method for manufacturing a device, characterized in that if there is a value that is not within a predetermined range, the product is determined to be defective. In the inspection method according to 請 Motomeko 5,
In the step of determining whether the product is good or bad, it is determined that the electrical signal of each of the arrangement detection patterns of the plurality of circuit layers is a non-defective product when all of the values are within a predetermined range. An inspection method characterized in that if there is a value that is not within a predetermined range, it is determined that the product is defective.

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