JPH0445999B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] A backboard that requires a low-voltage signal pattern and a high-voltage signal pattern is constructed by combining a first backboard on which only a low-voltage signal pattern is formed and a first backboard on which only a high-voltage signal pattern is formed. The first backboard is separated from the second backboard, and the first backboard is placed parallel to the first backboard.
By extending the high voltage side terminal of the backboard connector and connecting it to the second backboard,
To facilitate the formation of a high voltage signal pattern and to facilitate improvements after pattern formation.

[Industrial application field]

The present invention relates to a backboard for an electronic device on which a low voltage signal pattern and a high voltage signal pattern are formed.

2. Description of the Related Art In electronic equipment, for example, telephone exchanges, electronic devices in which a large number of printed circuit boards are arranged side by side on a backboard are widely used.

In such electronic devices, the interface between printed boards is a low voltage signal of, for example, -5V, and the interface with the outside, such as audio,
The power supply etc. is a high voltage signal of -48V. Therefore, a backboard naturally requires a low voltage signal pattern and a high voltage signal pattern.

At this time, there is a demand for high voltage signal patterns with sufficient pattern spacing and a backboard that can be easily improved after pattern formation.

[Conventional technology]

FIG. 2 is a plan view showing a conventional backboard structure, in which the backboard 4 has a shield layer on the inner layer, low voltage signal patterns 5 are formed in multiple layers on one side, and high voltage signal patterns 6 on the other side. is formed in multiple layers.

On the surface of the backboard 4 facing the low voltage signal pattern 5, a large number of backboard connectors 3 are arranged in parallel so that the printed board connectors 2 mounted on the side edges of the printed board 1 can be inserted thereinto.

The low voltage side terminal 3A and high voltage side terminal 3B of each backboard connector 3 connect to the backboard 4.
is inserted into the through hole and fixed by soldering, and the low voltage side terminal 3A is connected to the selected low voltage signal pattern 5.
The high voltage side terminals 3B are respectively connected to the selected high voltage signal patterns 6.

The high voltage signal pattern 6 is concentrated on both side edges of the backboard connector 3 and connected to the terminals of an input/output connector 7 mounted on the side edge.

Since it is configured as described above, printed board 1
are connected to each other (mainly low voltage signals) via the low voltage side terminal 3A, the low voltage signal pattern 5, and the low voltage side terminal 3A.

In addition, when a high voltage signal circuit is required for connection between the printed boards 1, the high voltage signal pattern 6
Of course, this can be done via .

Further, a connection circuit (high voltage signal) for connecting the electronic device to the outside includes a high voltage side terminal 3B, a high voltage signal pattern 6, and an input/output connector 7.

[Problem that the invention seeks to solve]

However, in the above-mentioned conventional backboard, through-holes into which the low-voltage side terminal and high-voltage side terminal are inserted are arranged in close proximity at the position of each backboard connector. Forming a high voltage signal pattern so as to thread between such through holes may cause a breakdown voltage failure.

To completely prevent this, it is best to shape the high voltage signal traces to avoid the backboard connectors and around the perimeter of the backboard, but this will result in a larger backboard. There is a problem.

On the other hand, in recent years, electronic devices in which a large number of printed circuit boards are arranged in parallel inevitably have a large number of high voltage signal patterns. For this reason, whether the terminals are sewn together or detoured, the shape of the high voltage signal pattern becomes complicated, and the number of high voltage signal pattern layers must be increased. However, there was a problem in that the difficulty was increasing in terms of both design and manufacturing.

Furthermore, a single backboard has multiple low voltage signal pattern layers and multiple high voltage signal pattern layers, and the patterns are congested.

Therefore, when a part of the signal pattern is cut or modified based on a design change or the like, there is a risk that other signal patterns on the invisible inner layer may be damaged.

[Means for solving problems]

In order to solve the above conventional problems, the present invention requires a large number of printed circuit boards 1 to be vertically inserted on one side, and a low voltage signal pattern 5 and a high voltage signal pattern 6, as shown in FIG. A backboard for an electronic device includes a first backboard 10 on which a low voltage signal pattern 5 is formed, and a first backboard 10 arranged in parallel on one side of the first backboard 10 for inserting each printed board 1 thereinto. The high-voltage side terminal 3B of the first backboard connector 12 is provided with a backboard connector 12 and a second backboard 11 on which a high voltage signal pattern 6 is formed and arranged adjacently to the first backboard 10. It is configured such that it is extended and connected to the high voltage signal pattern 6 of the second backboard 11.

[Effect]

According to the above means of the present invention, only through holes corresponding to the small number of high voltage terminals 3B among the respective first backboard connectors 12 are formed in the second backboard 11.

Therefore, even with a small number of high voltage signal layers, there is a sufficient area for forming the high voltage signal pattern 6, and a high voltage signal pattern with high voltage resistance can be easily formed.

In addition, since it is separated into the first backboard 10 and the second backboard 11, the congestion of the pattern is reduced, and when a part of the signal pattern is cut and modified, the risk of damaging other signal patterns is reduced. do.

〔Example〕

The present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 1 is a perspective view of one embodiment of the present invention.
A printed board connector 2 mounted on the side edge of the printed board 1 is mounted on one side of the first backboard 10 on which the low voltage signal pattern 5 is formed in a desired multi-layered manner.
A large number of first backboard connectors 12 are arranged in parallel so that the first backboard connectors 12 can be inserted.

The low voltage side terminal 3A and high voltage side terminal 3B of the first backboard connector 12 are inserted into through holes of the first backboard 10 and soldered.

The low voltage side terminal 3A is connected to the low voltage signal pattern 5 as desired, and the high voltage side terminal 3B is extended without being connected to the pattern of the first backboard 10.

On the second backboard 11, a desired number of layers of high voltage signal patterns 6 are formed. A first backboard connector 1 mounted on the first backboard 10 is mounted on one side of the second backboard 11.
2, the second terminal connected to the high voltage side terminal 3B
backboard connectors 13 are arranged in parallel.

The terminal of the second backboard connector 13 connected to the high voltage side terminal 3B is connected to the selected high voltage signal pattern 6, and the high voltage signal pattern 6 is
The wires are concentrated on both side edges of the second backboard 11 and connected to terminals of an input/output connector 7 mounted on the side edges.

Since the configuration is as described above, by attaching the second backboard connector 13 to the high voltage side terminal 3B of the first backboard connector 12, the high voltage signal circuit of the printed board 1 can be connected to the high voltage side terminal 3B of the first backboard connector 12. 3B, a high voltage signal pattern 6, and an input/output connector 7, it can be connected to an external circuit.

High voltage side terminal 3B was originally low voltage side terminal 3A
, each second backboard connector 1 provided on the second backboard 11
3 has fewer terminals.

Therefore, the second backboard connector 13
Even if the terminal spacing is sufficiently wide and the number of high voltage signal layers is small, a sufficient area for forming the high voltage signal pattern 6 is generated, and a high voltage signal pattern with high voltage resistance can be easily formed.

In addition, since the first backboard 10 and the second backboard 11 are separated, the congestion of the pattern is reduced. There is no risk of damaging the signal pattern 6, and the risk of damaging other parts of the low voltage signal pattern 5 is also reduced.

〔Effect of the invention〕

As explained above, the present invention separates the backboard into two backboards, one for low voltage and one for high voltage, which facilitates the formation of high voltage signal patterns and reduces the number of high voltage signal pattern layers. , and has excellent practical effects, such as less risk of damaging other patterns when making improvements after pattern formation.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a plan view showing a conventional backboard structure. In the figure, 1 is a printed board, 2 is a printed board connector, and 3 is a printed board.
is the backboard connector, 3A is the low voltage side terminal,
3B is the high voltage side terminal, 4 is the back board, 5 is the low voltage signal pattern, 6 is the high voltage signal pattern, 7
1 shows an input/output connector 7, 10 a first backboard, 11 a second backboard, 12 a first backboard connector, and 13 a second backboard connector.

Claims (1)

[Claims] 1. In a backboard for an electronic device in which a large number of printed boards 1 are vertically inserted on one side and requires a low voltage signal pattern 5 and a high voltage signal pattern 6, the low voltage signal pattern 5 is The formed first backboard 10, the first backboard connectors 12 arranged in parallel on one side of the first backboard 10 for inserting the respective printed boards 1, and the high voltage signal pattern. 6 is formed and a second backboard 11 is arranged adjacent to and parallel to the first backboard 10, the high voltage side terminal 3B of the first backboard connector 12 extends, and the second A backboard structure for an electronic device, characterized in that it is configured to be connected to a high voltage signal pattern 6 of a backboard 11.