JPH0318110A - Fitting structure for noise filter - Google Patents
Fitting structure for noise filterInfo
- Publication number
- JPH0318110A JPH0318110A JP15280189A JP15280189A JPH0318110A JP H0318110 A JPH0318110 A JP H0318110A JP 15280189 A JP15280189 A JP 15280189A JP 15280189 A JP15280189 A JP 15280189A JP H0318110 A JPH0318110 A JP H0318110A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- noise filter
- ground
- ground conductor
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 89
- 239000012212 insulator Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000003990 capacitor Substances 0.000 abstract description 39
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子回路、特にデジタル回路におけるノイズ
防止のためのフィルタ群を基板に取付ける構造に関する
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a structure for attaching a filter group to a substrate for noise prevention in electronic circuits, particularly digital circuits.
従来の技術と課題
電子回路、特にデジタル回路のノイズ対策として採用さ
れている方法の一つに信号導体路とグランド導体との間
をノイズフィルタ、一般にはバイパスコンデンサを介し
て接続して高周波成分のノイズをグランド導体に逃がし
て除去する方法が知られている。バイパスコンデンサと
しては、例えば第１０図（ａ）に示すチップ型三端子コ
ンデンサ１０がある。三端子コンデンサ１０は、両端部
に信号電極（Ａ），（Ｂ）及び中央部にグランド電極（
Ｃ）が形成されている。第１０図（ｂ）にチップ型三端
子コンデンサ１０の等価回路図を示す。Conventional Technology and Issues One of the methods adopted as noise countermeasures for electronic circuits, especially digital circuits, is to connect the signal conductor and the ground conductor via a noise filter, generally a bypass capacitor, to remove high-frequency components. A known method is to remove noise by dissipating it into a ground conductor. As a bypass capacitor, there is, for example, a chip type three-terminal capacitor 10 shown in FIG. 10(a). The three-terminal capacitor 10 has signal electrodes (A) and (B) at both ends and a ground electrode (
C) is formed. FIG. 10(b) shows an equivalent circuit diagram of the chip type three-terminal capacitor 10.
ところで、ノイズフィルタが、コネクタの近傍に配置し
て使用される場合、コネクタの各ビン毎に三端子コンデ
ンサ１０が１個接続されることが多い。このとき、三端
子コンデンサ１０は従来第１１図（ａ）に示すように、
整列配置され、密集した状態で基板１１に取付けられる
。即ち、第１１図（ｂ）に示すようにグランド導体部１
２ａ， １２ｂ． １２ｃ及び信号導体路１３ａ， １
３ｂは基板１１の上面に形成されていて、信号導体路１
３ａ．１３ｂは平行に整列配置され、かつ対向している
。信号導体路１３ｂは右側でコネクタ（図示せず）と接
続されている。グランド導体部１２ｃは三端子コンデン
サ１０のグランド電極（Ｃ）と電気的に接続されるもの
で、グランド導体部１２ａ．１２ｂ間を架橋している。By the way, when a noise filter is placed near a connector and used, one three-terminal capacitor 10 is often connected to each bin of the connector. At this time, the conventional three-terminal capacitor 10 is as shown in FIG. 11(a).
They are arranged in alignment and attached to the substrate 11 in a densely packed state. That is, as shown in FIG. 11(b), the ground conductor portion 1
2a, 12b. 12c and signal conductor path 13a, 1
3b is formed on the upper surface of the substrate 11, and is connected to the signal conductor path 1.
3a. 13b are arranged in parallel and facing each other. The signal conductor 13b is connected on the right side with a connector (not shown). The ground conductor portion 12c is electrically connected to the ground electrode (C) of the three-terminal capacitor 10, and the ground conductor portion 12a. 12b is bridged.
グランド導体部１２ｃは、アセンブリ工程で信号導体路
１３ａ． １３ｂとの間に半田ブリッジを発生させず、
しかも三端子コンデンサ１０のグランド電極（Ｃ）と電
気的接続が確実に行なえるだけの幅を有している。信号
導体路１３ａと三端子コンデンサ１０の信号電極（Ａ）
との間、信号導体路１３ｂと信号電極（Ｂ）との間、及
びグランド導体部１２ｃとグランド電極（Ｃ）との間は
半田を介して接続されている。The ground conductor portion 12c is connected to the signal conductor path 13a during the assembly process. 13b without generating a solder bridge,
Moreover, it has a width sufficient to ensure electrical connection with the ground electrode (C) of the three-terminal capacitor 10. Signal conductor path 13a and signal electrode (A) of three-terminal capacitor 10
, the signal conductor path 13b and the signal electrode (B), and the ground conductor portion 12c and the ground electrode (C) are connected via solder.
ところが、以上の取付け構造では、グランド導体部１
２ｃの幅が三端子コンデンサ１０の寸法、特に長さの制
約から細長くならざるを得す、このような細長い線形状
をした導体は、いわゆるコイルとしての機能を有する。However, in the above mounting structure, the ground conductor part 1
The width of the conductor 2c has to be elongated due to the dimensions of the three-terminal capacitor 10, especially the length, and such a long and thin wire-shaped conductor has a function as a so-called coil.
従って、各三端子コンデンサ１０のグランド電極（Ｃ）
間及びグランド電極（Ｃ）とグランド導体部１２ａ．１
２ｂ間にそれぞれインダクタンスＬ２． Ｌ３， Ｌ４
，Ｌ５．ＬＬ．Ｌ６が発生し、これらインダクタンスＬ
１〜Ｌ６は三端子コンデンサ１０のグランド電極（Ｃ）
に直列に入る。第１１図（８）の等価回路を第１１図（
Ｃ）に示す。Therefore, the ground electrode (C) of each three-terminal capacitor 10
between the ground electrode (C) and the ground conductor portion 12a. 1
2b and inductance L2. L3, L4
, L5. LL. L6 occurs, and these inductances L
1 to L6 are the ground electrodes (C) of the three-terminal capacitor 10
enters in series. The equivalent circuit of Fig. 11 (8) is shown in Fig. 11 (
Shown in C).
このため、三端子コンデンサ１０の高周波ノイズ除去作
用が阻害されてフィルタ特性が充分発揮されない場合が
あった。また、インダクタンスＬ１〜Ｌ６は電流の変化
ｄｉ／ｄｔによってＬ・ｄｉ／ｄｔのノイズ電圧を生じ
させ、しかも、この電流の変化ｄｉ／ｄｔはインダクタ
ンスＬ１〜Ｌ６を介して全ての三端子コンデンサ１０に
影響を与えるため、いわゆる共通インピーダンスノイス
を発生させるという問題点があった。For this reason, the high frequency noise removal effect of the three-terminal capacitor 10 may be inhibited, and the filter characteristics may not be fully exhibited. Furthermore, the inductances L1 to L6 generate a noise voltage of L·di/dt due to the current change di/dt, and this current change di/dt is applied to all three-terminal capacitors 10 via the inductances L1 to L6. Therefore, there is a problem in that so-called common impedance noise is generated.
本発明の課題は、高密度に実装されたノイズフィルタ群
のフィルタ特性が充分発揮できる取付け構造を提供する
ことにある。An object of the present invention is to provide a mounting structure that can fully exhibit the filter characteristics of a group of noise filters mounted in high density.
課題を解決するための手段
以上の課題を解決するために、本発明に係るノイズフィ
ルタの取付け構造は、信号導体路に電気的に接続してい
る端子部がグランド導体部の両側に対向して整列配置さ
れていて、絶縁体がノイズフィルタと電気的に接続する
部分を除いて前記グランド導体部及び端子部を被覆して
いて、さらに前記絶縁体の上にノイズフィルタが整列配
置されている構造を成し、前記信号導体路が前記端子部
を介してノイズフィルタの両端に設けられた信号電極と
電気的に接続されていて、かつノイズフィルタの中央部
に設けられたグランド電極が前記グランド導体部と電気
的に接続されていることを特徴とする。Means for Solving the Problems In order to solve the above problems, the mounting structure of the noise filter according to the present invention is such that the terminal portion electrically connected to the signal conductor path faces both sides of the ground conductor portion. A structure in which the insulators are arranged in an array, the insulator covers the ground conductor part and the terminal part except for the part electrically connected to the noise filter, and the noise filter is further arranged in an array on the insulator. The signal conductor path is electrically connected to signal electrodes provided at both ends of the noise filter via the terminal portion, and the ground electrode provided at the center of the noise filter is connected to the ground conductor. It is characterized by being electrically connected to the section.
作用
即ち、端子部及びグランド導体部が、ノイズフィルタと
電気的に接続する部分を除いて絶縁体によって被覆され
ているので、端子部とグランド導体部との間隔を小さく
しても、アセンブリ工程での半田ブリッジなどの不具合
は発生しない。従ってグランド導体部の幅を従来の幅よ
り広くできるので、ノイズフィルタのグランド電極に直
列に入っているインダクタンスＬの数値は極めて小さい
ものにでき、高周波ノイズ除去作用を阻害せず、また、
ノイズ電圧も小さいものになる。In other words, since the terminal part and the ground conductor part are covered with an insulator except for the part that electrically connects to the noise filter, even if the distance between the terminal part and the ground conductor part is small, there will be no problem in the assembly process. Problems such as solder bridges do not occur. Therefore, since the width of the ground conductor can be made wider than the conventional width, the value of the inductance L connected in series with the ground electrode of the noise filter can be made extremely small, and the high frequency noise removal effect is not inhibited.
The noise voltage also becomes small.
実施例
以下、本発明に係るノイズフィルタの取付け構造の実施
例をその取付け方法と共に図面に従って説明する。本実
施例では、ノイズフィルタとして第１０図に示すチップ
型三端子コンデンサ１０を使用し、この三端子コンデン
サ１０が５個整列配置された場合について説明する。Embodiments Hereinafter, embodiments of the noise filter mounting structure according to the present invention will be described with reference to the drawings, together with the mounting method thereof. In this embodiment, a case will be described in which a chip type three-terminal capacitor 10 shown in FIG. 10 is used as a noise filter, and five three-terminal capacitors 10 are arranged in a line.
まず、第１図に示すように、基板１の上面にグランド導
体２及び端子部３ａ， ３ｂを形或する（第１図中実線
斜線で示す）。端子部３８及び３ｂはグランド導体２に
よって周囲を囲まれグランド導体部２ａの両側に平行に
整列配置され、かつ対向して形或される。グランド導体
部２ａは、後で載置される三端子コンデンサ１０のグラ
ンド電極（Ｃ）と接続されることになる。グランド導体
部２ａは、端子部３ａ及び３ｂとの間にわずかの隙間を
有して形成される。First, as shown in FIG. 1, a ground conductor 2 and terminal portions 3a, 3b are formed on the upper surface of a substrate 1 (indicated by solid diagonal lines in FIG. 1). The terminal portions 38 and 3b are surrounded by the ground conductor 2, are arranged parallel to each other on both sides of the ground conductor portion 2a, and are formed to face each other. The ground conductor portion 2a will be connected to a ground electrode (C) of a three-terminal capacitor 10 that will be placed later. The ground conductor portion 2a is formed with a slight gap between it and the terminal portions 3a and 3b.
このため、グランド導体部２ａの幅は、第１１図で示し
た従来のグランド導体部１２ｃの幅よりかなり広い幅と
なる。Therefore, the width of the ground conductor portion 2a is considerably wider than the width of the conventional ground conductor portion 12c shown in FIG.
一方、基板１の下面には、信号導体路４ａ及び４ｂが平
行に整列配置され、かつ、対向して形或される（第１図
中点線斜線で示す）。信号導体路４ａ及び４ｂはそれぞ
れスルーホール５を介して端子部３ａ．３ｂと電気的に
接続される。スルーホール５はめっき等によって形成さ
れる。図示されていないが、例えば信号導体路４ａは左
側でＩＣ等の電子回路素子と接続され、信号導体路４ｂ
は右側でコネクタと接続される。On the other hand, on the lower surface of the substrate 1, signal conductor paths 4a and 4b are arranged in parallel and facing each other (indicated by dotted diagonal lines in FIG. 1). The signal conductor paths 4a and 4b are connected to the terminal portions 3a. 3b. The through hole 5 is formed by plating or the like. Although not shown, for example, the signal conductor path 4a is connected to an electronic circuit element such as an IC on the left side, and the signal conductor path 4b is connected to an electronic circuit element such as an IC on the left side.
is connected to the connector on the right side.
次に、第２図に示すように、絶縁体６ａ． ６ｂをグラ
ンド導体部２ａ及び端子部３ａ， ３ｂに被覆する。即
ち、絶縁体６ａ． ６ｂはグランド導体部２Ｂをギャッ
プ７を有して被覆する。このギャップ７は三端子コンデ
ンサ１０のグランド電極（Ｃ）用接続部分となる。Next, as shown in FIG. 2, the insulator 6a. 6b is coated on the ground conductor portion 2a and terminal portions 3a and 3b. That is, the insulator 6a. 6b covers the ground conductor portion 2B with a gap 7 therebetween. This gap 7 becomes a connecting portion for the ground electrode (C) of the three-terminal capacitor 10.
ギャップ７の幅は、後で載置される三端子コンデンサ１
０のグランド電極（Ｃ）が接続されるのに足りる幅があ
ればよい。さらに、絶縁体６ａは、三端子コンデンサ１
０の信号電極（Ａ）用接続部分を除いて端子部３ａの右
側部を被覆している。同様にして、絶縁体６ｂは、端子
部３ｂの左側部を被覆している。The width of the gap 7 is determined by the width of the three-terminal capacitor 1 to be placed later.
It is sufficient if the width is sufficient to connect the ground electrode (C) of 0. Furthermore, the insulator 6a is a three-terminal capacitor 1
The right side of the terminal portion 3a is covered except for the connection portion for the signal electrode (A) of No. 0. Similarly, the insulator 6b covers the left side of the terminal portion 3b.
また、絶縁体６ａは端子部３ａとグランド導体部２ａと
の隙間に充填され、端子部３ａとグランド導体部２ａと
の間の絶縁をより確実なものにしている。同様の理由か
ら、絶縁体６ｂは端子部３ｂとグランド導体部２ａとの
隙間に充填されている。絶縁体６ａ． ６ｂの材料はエ
ポキシ樹脂等が使用される。Further, the insulator 6a is filled in the gap between the terminal portion 3a and the ground conductor portion 2a, thereby making the insulation between the terminal portion 3a and the ground conductor portion 2a more reliable. For the same reason, the insulator 6b is filled in the gap between the terminal portion 3b and the ground conductor portion 2a. Insulator 6a. Epoxy resin or the like is used as the material 6b.
さらに、第３図に示すように、三端子コンデンサ１０を
整列配置して取付け、端子部３ａと信号電極（Ａ）との
間、端子部３ｂと信号電極（Ｂ）との間、及び絶縁体６
ａ． ６ｂ一のギャップ７に露出しているグランド導体
部２ａとグランド電極（Ｃ）との間を半田８を介して電
気的に接続すると共に三端子コンデンサ１０を固定する
。Further, as shown in FIG. 3, the three-terminal capacitors 10 are arranged and attached, and the three-terminal capacitors 10 are arranged and installed between the terminal section 3a and the signal electrode (A), between the terminal section 3b and the signal electrode (B), and between the insulators. 6
a. The ground conductor portion 2a exposed in the gap 7 of the capacitor 6b is electrically connected to the ground electrode (C) via the solder 8, and the three-terminal capacitor 10 is fixed.
以上の方法により、第４図に示すノイズフィル夕の取付
け構造が形成される。即ち、端子部３ａ．３ｂ及びグラ
ンド導体部２ａ上に絶縁体６ａ， ６ｂが形成され、さ
らにこの絶縁体６ａ， ６ｂの上に半田８を介して三端
子コンデンサ１０が置かれている構造になっている。本
発明の等価回路は第１１図（Ｃ〉に示す等価回路と同じ
ものとなるが、グランド導体部２ａは広い幅を確保でき
るのでインダクタンスＬ１〜Ｌ６の数値の小さいものが
得られ、フィルタの高周波ノイズ除去作用を阻害せず、
また、ノイズ電圧も小さいものになる。By the above method, the noise filter mounting structure shown in FIG. 4 is formed. That is, the terminal portion 3a. 3b and the ground conductor portion 2a, and a three-terminal capacitor 10 is placed on the insulators 6a, 6b via solder 8. The equivalent circuit of the present invention is the same as the equivalent circuit shown in FIG. Does not interfere with noise removal effect,
Further, the noise voltage is also reduced.
第５図〜第８図は本発明についての他の実施例、即ち、
ノイズフィルタとして第５図に示すインサート型三端子
コンデンサ２１を使用した場合の実施例を示す。三端子
コンデンサ２１は１方向に信号電極（Ａ），（Ｂ）及び
グランド電極（Ｃ）を導出させ、グランド電極（Ｃ）を
中央にして両側に信号電極＜Ａ），（Ｂ）を配置してい
る。三端子コンデンサ２１の等価回路は第１０図（ｂ）
に示す等価回路と同じものである。この三端子コンデン
サ２１が５個整列配置された場合について説明する。第
６図に示すように、基板２２の上面にはグランド導体２
３及び端子部２４ａ， ２４ｂが形成されている（第６
図中実線斜線で示す）。端子部２４ａ， ２４ｂはグラ
ンド導体２３によって周囲を囲まれグランド導体部２３
ａの両側に平行に整列配置されかつ対向して形成されて
いる。5 to 8 show other embodiments of the present invention, namely:
An example will be shown in which the insert type three-terminal capacitor 21 shown in FIG. 5 is used as a noise filter. The three-terminal capacitor 21 has signal electrodes (A), (B) and a ground electrode (C) led out in one direction, and the signal electrodes <A) and (B) are arranged on both sides with the ground electrode (C) in the center. ing. The equivalent circuit of the three-terminal capacitor 21 is shown in Figure 10(b).
This is the same as the equivalent circuit shown in . A case where five three-terminal capacitors 21 are arranged in a row will be explained. As shown in FIG. 6, a ground conductor 2 is provided on the top surface of the board 22.
3 and terminal portions 24a, 24b are formed (sixth
(Indicated by solid diagonal lines in the figure). The terminal portions 24a and 24b are surrounded by the ground conductor 23.
They are arranged in parallel and facing each other on both sides of a.
グランド導体部２３ａ及び端子部２４ａ． ２４ｂには
、それぞれスルーホール２６， ２６． ２６が形成さ
れている。Ground conductor portion 23a and terminal portion 24a. 24b has through holes 26, 26. 26 is formed.
基板２２の下面には信号導体路２５ａ． ２５ｂが形成
されている（第５図中点線斜線で示す）。信号導体路２
５ａ及び２５ｂは平行に整列配置され、かつ対向して形
成され、端子部２４ａ， ２４ｂとスルーホール２６．
２６を介して電気的に接続されている。The lower surface of the substrate 22 has a signal conductor path 25a. 25b (shown by dotted diagonal lines in FIG. 5). Signal conductor path 2
5a and 25b are arranged parallel to each other and formed to face each other, and the terminal portions 24a, 24b and the through holes 26.
They are electrically connected via 26.
次に、第７図に示すように、絶縁体２７ａ， ２７ｂを
ギャップ２８を有してグランド導体部２３ａ及び端子部
２４ａ． ２４ｂに被覆する。このように形成された基
板２２上に、第８図に示すように、三端子コンデンサ２
１を整列配置して取付け、信号導体路２５ａのスルーホ
ール２６に信号電極（Ａ）を、信号導体路２５ｂのスル
ーホール２６に信号電極（Ｂ）を、さらにグランド導体
２４ａのスルーホール２６にグランド電極（Ｃ）をイン
サートして半田付けして電気的に接続すると共に三端子
コンデンサ２１を固定する。従って、三端子コンデンサ
２ｌのグランド電極（Ｃ）はグランド導体部２３ａに電
気的に接続されることになり、従来のものより幅の広い
グランド導体部２３ａによってインダクタンスＬの小さ
いものが得られ、フィルタの高周波ノイズ除去作用を阻
害せず、また、ノイズ電圧も小さいものが得られる。Next, as shown in FIG. 7, the insulators 27a and 27b are connected with a gap 28 between the ground conductor portion 23a and the terminal portion 24a. 24b. As shown in FIG. 8, a three-terminal capacitor 2 is placed on the substrate 22 formed in this way.
1 are aligned and attached, and the signal electrode (A) is connected to the through hole 26 of the signal conductor path 25a, the signal electrode (B) is connected to the through hole 26 of the signal conductor path 25b, and the ground is connected to the through hole 26 of the ground conductor 24a. The electrode (C) is inserted and soldered to electrically connect and fix the three-terminal capacitor 21. Therefore, the ground electrode (C) of the three-terminal capacitor 2l is electrically connected to the ground conductor part 23a, and the ground conductor part 23a, which is wider than the conventional one, has a small inductance L, and the filter The high-frequency noise removal effect of the filter is not inhibited, and the noise voltage is also small.
なお、本発明に係るノイズフィルタの取付け構造は前記
実施例に限定するものではなく、その要旨の範囲内で種
々に変更することができる。It should be noted that the mounting structure of the noise filter according to the present invention is not limited to the above-mentioned embodiments, and can be variously modified within the scope of the gist.
実施例では、端子部３ａ及び３ｂがグランド導体２によ
って周囲を囲まれたものを示したが、第９図に示すよう
に、基板３１の上面にグランド導体部３２ｂ， ３２ｃ
を形成し、グランド導体部３２ａは三端子コンデンサ１
０のグランド電極（Ｃ）に接続するためにグランド導体
部３２ｂ． ３２ｃ間を架橋するものであってもよい。In the embodiment, the terminal portions 3a and 3b are surrounded by the ground conductor 2, but as shown in FIG.
The ground conductor portion 32a forms a three-terminal capacitor 1.
0 ground conductor portion 32b. 32c may be bridged.
この場合、端子部３３ａ． ３３ｂ及びこれらに電気的
に接続される信号導体路３４ａ． ３４ｂは同じ面に形
成できる。絶縁体３５ａ， ３５ｂはギャップ３６を有
してグランド導体部３２ａ及び端子部３３ａ． ３３ｂ
を被覆している。In this case, the terminal portion 33a. 33b and signal conductor paths 34a.33b and electrically connected thereto. 34b can be formed on the same surface. The insulators 35a, 35b have a gap 36 between the ground conductor portion 32a and the terminal portions 33a. 33b
is covered.
さらに、三端子コンデンサｌＯのグランド電極（Ｃ）と
グランド導体部２ａを接続するためのグランド電極用接
続部分は、必ずしもギャップ７である必要はなく、グラ
ンド電極（Ｃ）の接続に最低限必要な大きさの部分が確
保されていればその形状は問わない。Furthermore, the ground electrode connection part for connecting the ground electrode (C) of the three-terminal capacitor lO and the ground conductor part 2a does not necessarily have to be the gap 7, but the minimum necessary for connecting the ground electrode (C). The shape does not matter as long as the size of the part is secured.
発明の効果
本発明によれば、端子部及びグランド導体部が絶縁体に
よって被Ｎされているので、端子部とグランド導体部と
の間隔を小さくすることができ、そのためグランド導体
の幅を従来のものより広くできるので、グランド導体部
が有するインダクタンスは極めて小さいものとなる。こ
の幅の広いグランド導体部にノイスフィルタのグランド
電極を、電気的に接続できるので、ノイズフィルタのグ
ランド電極に直列に入っているインダクタンスＬの数値
も極めて小さいものになり、ノイズフィルタの高周波ノ
イズ除去作用を阻害しない。Effects of the Invention According to the present invention, since the terminal portion and the ground conductor portion are covered with an insulator, the distance between the terminal portion and the ground conductor portion can be reduced, and therefore the width of the ground conductor can be reduced compared to the conventional width. Since the ground conductor can be made wider than the conventional one, the inductance of the ground conductor is extremely small. Since the ground electrode of the noise filter can be electrically connected to this wide ground conductor, the value of the inductance L in series with the ground electrode of the noise filter becomes extremely small, and the high-frequency noise of the noise filter can be removed. Does not inhibit the action.
また、電流の変化ｄｉ／ｄｔによって生ずるノイズ電圧
Ｌ−ｄｉ／ｄｔもインダクタンスＬの値が極めて小さい
ので実用上無視でき、共通インピーダンスノイズの問題
も解決する。Furthermore, the noise voltage L-di/dt caused by the change in current di/dt can be practically ignored since the value of the inductance L is extremely small, and the problem of common impedance noise is also solved.
この結果、ノイズフィルタの本来のフィルタ特性が充分
発揮できるノイズフィルタの取付け構造が提供される。As a result, a noise filter mounting structure is provided that allows the noise filter to fully exhibit its original filter characteristics.
第１図、第２図、第３図は本発明の一実施例であるノイ
ズフィルタの取付け構造を説明する平面図、第４図は第
３図のｘ−ｘ’の一部垂直断面図である。第５図、第６
図、第７図、第８図は他の実施例を示すもので、第５図
はインサート型ノイズフィルタの外観を示す斜視図、第
６図、第７図、第８図はその取付け構造を説明する平面
図である。
第９図は第２図で示した実施例の変形例を示す平面図で
ある。第１０図（ａ）はチップ型ノイズフィルタの外観
を示す斜視図、第１０図（ｂ）はその等価回路図である
。第１１図（ａ）、第１１図（ｂ）は従来のチップ型ノ
イズフィルタの取付け構造を説明する平面図、第１１図
（ｃ）はその等価回路図である。
１・・・基板、２・・・グランド導体、２ａ・・・グラ
ンド導体部、３ａ， ３ｂ・・・端子部、４ａ． ４ｂ
・・・信号導体路、５・・・スルーホール、６ａ． ６
ｂ・・・絶縁体、７・・・グランド電極用接続部分（ギ
ャップ）、１０・・・ノイスフィルタ（チップ型三端子
コンデンサ）、２１・・・ノイズフィルタ（インサート
型三端子コンデンサ）、２２・・・基板、２３・・・グ
ランド導体、２３ａ・・・グランド募体部、２４ａ．２
４ｂ−・一端子部、２５ａ．２５ｂ ＝−信号導体路、
２６・・・スルーホール、２７ａ．２７ｂ・・・絶縁体
、２８・・・グランド電極用接続部分（ギャップ）、３
１・・・基板、３２ａ，３２ｂ， ３２ｃ・・・グラン
ド導体部、３３ａ． ３３ｂ・・・端子部、３４ａ，３
４ｂ−信号導体路、３５ａ，３５ｂ−・絶縁体、３６・
・・グランド電極用接続部分（ギ〜ツプ）、（Ａ），（
Ｂ）・・・信号電極、（Ｃ）・・・グランド電極。Figures 1, 2, and 3 are plan views explaining the mounting structure of a noise filter according to an embodiment of the present invention, and Figure 4 is a partial vertical sectional view taken along line xx' in Figure 3. be. Figures 5 and 6
7 and 8 show other embodiments, FIG. 5 is a perspective view showing the external appearance of the insert type noise filter, and FIGS. 6, 7, and 8 show the mounting structure. FIG. 3 is a plan view for explanation. FIG. 9 is a plan view showing a modification of the embodiment shown in FIG. 2. FIG. 10(a) is a perspective view showing the external appearance of a chip type noise filter, and FIG. 10(b) is an equivalent circuit diagram thereof. FIGS. 11(a) and 11(b) are plan views illustrating the mounting structure of a conventional chip-type noise filter, and FIG. 11(c) is an equivalent circuit diagram thereof. DESCRIPTION OF SYMBOLS 1... Board, 2... Ground conductor, 2a... Ground conductor part, 3a, 3b... Terminal part, 4a. 4b
... Signal conductor path, 5... Through hole, 6a. 6
b... Insulator, 7... Connection part for ground electrode (gap), 10... Noise filter (chip type three-terminal capacitor), 21... Noise filter (insert type three-terminal capacitor), 22... ... Board, 23... Ground conductor, 23a... Ground recruitment section, 24a. 2
4b--One terminal portion, 25a. 25b =-signal conductor path,
26...Through hole, 27a. 27b... Insulator, 28... Connection portion for ground electrode (gap), 3
1... Substrate, 32a, 32b, 32c... Ground conductor portion, 33a. 33b...Terminal part, 34a, 3
4b-signal conductor path, 35a, 35b--insulator, 36-
・・Ground electrode connection part (gip), (A), (
B)...Signal electrode, (C)...Ground electrode.
Claims (1)
に形成された信号導体路との間を電気的に接続している
ノイズフィルタの取付け構造において、 信号導体路に電気的に接続している端子部がグランド導
体部の両側に対向して整列配置されていて、絶縁体がノ
イズフィルタと電気的に接続する部分を除いて前記グラ
ンド導体部及び端子部を被覆していて、さらに前記絶縁
体の上にノイズフィルタが整列配置されている構造を成
し、前記信号導体路が前記端子部を介してノイズフィル
タの両端に設けられた信号電極と電気的に接続されてい
て、かつノイズフィルタの中央部に設けられたグランド
電極が前記グランド導体部と電気的に接続されているこ
とを特徴とするノイズフィルタの取付け構造。1. In a noise filter mounting structure that electrically connects a ground conductor formed on the surface of a substrate and signal conductors formed on both sides of the ground conductor, a terminal electrically connected to the signal conductor. portions are arranged in alignment to face both sides of the ground conductor portion, an insulator covers the ground conductor portion and the terminal portion except for a portion electrically connected to the noise filter, and a portion of the insulator The noise filter has a structure in which the noise filter is arranged in a row above, the signal conductor path is electrically connected to the signal electrodes provided at both ends of the noise filter via the terminal part, and the noise filter is located at the center of the noise filter. 1. A mounting structure for a noise filter, characterized in that a ground electrode provided in the part is electrically connected to the ground conductor part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15280189A JPH0817300B2 (en) | 1989-06-14 | 1989-06-14 | Noise filter mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15280189A JPH0817300B2 (en) | 1989-06-14 | 1989-06-14 | Noise filter mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0318110A true JPH0318110A (en) | 1991-01-25 |
| JPH0817300B2 JPH0817300B2 (en) | 1996-02-21 |
Family
ID=15548453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15280189A Expired - Lifetime JPH0817300B2 (en) | 1989-06-14 | 1989-06-14 | Noise filter mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0817300B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5493259A (en) * | 1992-10-13 | 1996-02-20 | The Whitaker Corporation | High voltage, low pass filtering connector with multiple ground planes |
| EP0660649A3 (en) * | 1993-12-22 | 1996-10-23 | Murata Manufacturing Co | Mounting structure for electronic component. |
| US5781082A (en) * | 1994-09-14 | 1998-07-14 | Zexel Corporation | Power supply filter for preventing noise signal from entering power supply circuit |
-
1989
- 1989-06-14 JP JP15280189A patent/JPH0817300B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5493259A (en) * | 1992-10-13 | 1996-02-20 | The Whitaker Corporation | High voltage, low pass filtering connector with multiple ground planes |
| EP0660649A3 (en) * | 1993-12-22 | 1996-10-23 | Murata Manufacturing Co | Mounting structure for electronic component. |
| US5781082A (en) * | 1994-09-14 | 1998-07-14 | Zexel Corporation | Power supply filter for preventing noise signal from entering power supply circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0817300B2 (en) | 1996-02-21 |
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