JP2676921B2 - Noise filter mounting structure - Google Patents

Noise filter mounting structure

Info

Publication number
JP2676921B2
JP2676921B2 JP1152800A JP15280089A JP2676921B2 JP 2676921 B2 JP2676921 B2 JP 2676921B2 JP 1152800 A JP1152800 A JP 1152800A JP 15280089 A JP15280089 A JP 15280089A JP 2676921 B2 JP2676921 B2 JP 2676921B2
Authority
JP
Japan
Prior art keywords
ground
conductor
noise filter
substrate
noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1152800A
Other languages
Japanese (ja)
Other versions
JPH0318113A (en
Inventor
幸夫 坂本
敏己 金子
秀俊 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15548430&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2676921(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP1152800A priority Critical patent/JP2676921B2/en
Publication of JPH0318113A publication Critical patent/JPH0318113A/en
Application granted granted Critical
Publication of JP2676921B2 publication Critical patent/JP2676921B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Filters And Equalizers (AREA)

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、電子回路、特にデジタル回路におけるノイ
ズ防止のためのフィルタ群を基板に取付ける構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a filter group for preventing noise in an electronic circuit, particularly a digital circuit, on a substrate.

［従来の技術と課題］ 電子回路、特にデジタル回路のノイズ対策として採用
されている方法の一つに信号導体路とグランド導体との
間をノイズフィルタ、一般にはバイパスコンデンサを介
して接続して高周波成分のノイズをグランド導体に逃が
して除去する方法が知られている。バイパスコンデンサ
としては、例えば第４図（ａ）に示すチップ型三端子コ
ンデンサ10がある。三端子コンデンサ10は、両端部に信
号電極（Ａ），（Ｂ）及び中央部にグランド電極（Ｃ）
が形成されている。第４図（ｂ）にチップ型三端子コン
デンサ10の等価回路図を示す。[Prior Art and Problems] One of the methods adopted as a measure against noise in electronic circuits, especially digital circuits, is to connect a signal conductor path and a ground conductor through a noise filter, generally a bypass capacitor, for high frequency. A method is known in which component noise is released to the ground conductor and removed. As the bypass capacitor, for example, there is a chip type three-terminal capacitor 10 shown in FIG. 4 (a). The three-terminal capacitor 10 has signal electrodes (A) and (B) at both ends and a ground electrode (C) at the center.
Are formed. FIG. 4 (b) shows an equivalent circuit diagram of the chip type three-terminal capacitor 10.

ところで、ノイズフィルタが、コネクタの近傍に配置
して使用される場合、コネクタの各ピン毎に三端子コン
デンサ10が１個接続されることが多い。このとき、三端
子コンデンサ10は従来第５図（ａ）に示すように、整列
配置され、密集した状態で基板11に取付けられる。即
ち、第５図（ｂ）に示すようにグランド導体12a,12b,12
c及び信号導体路13a,13bは基板11の上面に形成されてい
て、信号導体路13a,13bは平行に整列配置され、かつ対
向している。信号導体路13bは右側でコネクタ（図示せ
ず）と接続されている。グランド導体12cは三端子コン
デンサ10のグランド電極（Ｃ）と電気的に接続されるも
ので、グランド導体12a,12b間を架橋している。グラン
ド導体12cは、アセンブリ工程で信号導体路13a,13bとの
間に半田ブリッジを発生させず、しかも三端子コンデン
サ10のグランド電極（Ｃ）と電気的接続が確実に行なえ
るだけの幅を有している。三端子コンデンサ10は、信号
導体路13aと信号電極（Ａ）との間、信号導体路13bと信
号電極（Ｂ）との間、及びグランド導体12cとグランド
電極（Ｃ）との間に半田を介して接続されている。By the way, when the noise filter is arranged near the connector and used, one three-terminal capacitor 10 is often connected to each pin of the connector. At this time, as shown in FIG. 5 (a), the three-terminal capacitors 10 are conventionally arranged in a line and mounted on the substrate 11 in a dense state. That is, as shown in FIG. 5 (b), the ground conductors 12a, 12b, 12
c and the signal conductor paths 13a and 13b are formed on the upper surface of the substrate 11, and the signal conductor paths 13a and 13b are aligned in parallel and face each other. The signal conductor path 13b is connected on the right side to a connector (not shown). The ground conductor 12c is electrically connected to the ground electrode (C) of the three-terminal capacitor 10, and bridges the ground conductors 12a and 12b. The ground conductor 12c does not generate a solder bridge between the signal conductor paths 13a and 13b during the assembly process, and has a width sufficient to ensure electrical connection with the ground electrode (C) of the three-terminal capacitor 10. doing. The three-terminal capacitor 10 has solder between the signal conductor path 13a and the signal electrode (A), between the signal conductor path 13b and the signal electrode (B), and between the ground conductor 12c and the ground electrode (C). Connected through.

ところが、以上の取付け構造では、グランド導体12c
の幅が三端子コンデンサ10の寸法、特に長さの制約から
細長くならざるを得ず、このような細長い線形状をした
導体は、いわゆるコイルとしての機能を有する。従っ
て、各三端子コンデンサ10のグランド電極（Ｃ）間及び
グランド電極（Ｃ）とグランド導体12a,12b間にそれぞ
れインダクタンスL2,L3,L4,L5,L1,L6が発生し、これら
インダクタンスL1〜L6は三端子コンデンサ10のグランド
電極（Ｃ）に直列に入る。第５図（ａ）の等価回路を第
５図（ｃ）に示す。However, in the above mounting structure, the ground conductor 12c
The width of the three-terminal capacitor is inevitably elongated due to the dimension of the three-terminal capacitor 10, especially the restriction of the length, and such an elongated linear conductor functions as a so-called coil. Therefore, inductances L2, L3, L4, L5, L1 and L6 are generated between the ground electrodes (C) of the three-terminal capacitors 10 and between the ground electrodes (C) and the ground conductors 12a and 12b, respectively, and these inductances L1 to L6. Enters in series with the ground electrode (C) of the three-terminal capacitor 10. An equivalent circuit of FIG. 5 (a) is shown in FIG. 5 (c).

このため、三端子コンデンサ10の高周波ノイズ除去作
用が阻害されてフィルタ特性が充分発揮されない場合が
あった。また、インダクタンスL1〜L6は電流の変化di/d
tによってＬ・di/dtのノイズ電圧を生じさせ、しかも、
この電流の変化di/dtはインダクタンスL1〜L6を介して
全ての三端子コンデンサ10に影響を与えるため、いわゆ
る共通インピーダンスノイズを発生させるという問題点
があった。For this reason, the high-frequency noise removing action of the three-terminal capacitor 10 may be hindered and the filter characteristics may not be sufficiently exhibited. In addition, the inductances L1 to L6 change the current di / d
A noise voltage of L · di / dt is generated by t, and moreover,
This change in current di / dt affects all of the three-terminal capacitors 10 via the inductances L1 to L6, which causes a problem of generating so-called common impedance noise.

本発明の課題は、高密度に実装されたノイズフィルタ
群のフィルタ特性が充分発揮できる取付け構成を提供す
ることにある。An object of the present invention is to provide a mounting structure capable of sufficiently exhibiting the filter characteristics of a high density mounted noise filter group.

［課題を解決するための手段］ 以上の課題を解決するために、本発明に係るノイズフ
ィルタの取付け構造は、基板の一方の面に整列配置され
た信号導体路がグランド導体の両側に対向して形成され
ていて、ノイズフィルタが、前記信号導体路とノイズフ
ィルタの両端に設けられた信号電極とを電気的に接続す
るように、かつ、ノイズフィルタの中央部に設けられた
グランド電極と前記グランド導体とを電気的に接続する
ように整列配置し、基板の他方の面にグランド補助導体
が前記グランド導体と基板の厚み方向に対向して形成さ
れていて、前記グランド導体とグランド補助導体とが、
前記整列配置されたノイズフィルタの直下の基板部分又
は前記整列配置されたノイズフィルタ間の基板部分のい
ずれか一方の基板部分であって、かつ、前記整列配置さ
れたノイズフィルタのグランド電極の近傍に設けたスル
ーホールによって電気的に接続された構造を成している
ことを特徴とする。[Means for Solving the Problems] In order to solve the above problems, in the noise filter mounting structure according to the present invention, the signal conductor paths aligned on one surface of the substrate face each other on both sides of the ground conductor. And a noise filter electrically connected between the signal conductor path and the signal electrodes provided at both ends of the noise filter, and the ground electrode provided at the center of the noise filter and Arranged so as to electrically connect to the ground conductor, a ground auxiliary conductor is formed on the other surface of the substrate so as to face the ground conductor in the thickness direction of the substrate, and the ground conductor and the ground auxiliary conductor. But,
Any one of the substrate portion directly below the aligned noise filters or the substrate portion between the aligned noise filters, and in the vicinity of the ground electrode of the aligned noise filters. It is characterized in that it has a structure that is electrically connected by the provided through holes.

［作 用］ 即ち、ノイズフィルタのグランド電極は、グランド導
体からすぐにグランド補助導体に電気的に接続されるこ
とになるので、グランド導体に発生するインダクタンス
の影響はほとんど受けなくなる。替わりに、ノイズフィ
ルタのグランド電極はグランド補助導体に発生するイン
ダクタンスの影響を受けることになるが、このグランド
補助導体は、ノイズフィルタが取り付けられている面の
反対面に形成されていて、ノイズフィルタの信号電極距
離に関係なく独立してその幅を広くできるので、ノイズ
フィルタのグランド電極に直列に入っているインダクタ
ンスＬの数値は極めて小さいものにでき、高周波ノイズ
除去作用を阻害せず、また、ノイズ電圧も小さいものに
なる。[Operation] That is, since the ground electrode of the noise filter is electrically connected from the ground conductor to the ground auxiliary conductor immediately, it is hardly affected by the inductance generated in the ground conductor. Instead, the ground electrode of the noise filter will be affected by the inductance generated in the ground auxiliary conductor, but this ground auxiliary conductor is formed on the surface opposite to the surface on which the noise filter is mounted. Since the width can be independently increased irrespective of the signal electrode distance of, the numerical value of the inductance L in series with the ground electrode of the noise filter can be made extremely small, and the high frequency noise removing action is not hindered. The noise voltage is also small.

［実施例］ 以下、本発明に係るノイズフィルタの取付け構造の実
施例をその取付け方法と共に図面に従って説明する。本
実施例では、ノイズフィルタとして第４図に示すチップ
型三端子コンデンサ10を使用し、この三端子コンデンサ
10が５個整列配置された場合について説明する。[Embodiment] An embodiment of a mounting structure for a noise filter according to the present invention will be described below with reference to the accompanying drawings together with its mounting method. In this embodiment, the chip type three-terminal capacitor 10 shown in FIG. 4 is used as a noise filter.
The case where five 10's are aligned will be described.

まず、第１図に示すように、基板１の上面にグランド
導体2a及びグランド導体2aの左右に信号導体路3a,3bを
形成する（第１図中実線斜線で示す）。信号導体路3a及
び3bは平行に整列配置され、かつ対向して形成されてい
る。図示されていないが、例えば信号導体路3aは左側で
IC等の電子回路素子と正続され、信号導体路3bは右側で
コネクタと接続されている。グランド導体2aの幅は、第
５図で示した従来のグランド導体12cの幅と同じ幅であ
り、アセンブリ工程で信号導体路3a,3bとの間に半田ブ
リッジを発生させず、しかも後で載置される三端子コン
デンサ10のグランド電極（Ｃ）に接続するために足りる
幅である。First, as shown in FIG. 1, a ground conductor 2a and signal conductor paths 3a, 3b are formed on the upper surface of the substrate 1 and on the left and right of the ground conductor 2a (indicated by the solid-line diagonal lines in FIG. 1). The signal conductor paths 3a and 3b are arranged in parallel and are opposed to each other. Although not shown, for example, the signal conductor path 3a is on the left side.
It is directly connected to an electronic circuit element such as an IC, and the signal conductor path 3b is connected to the connector on the right side. The width of the ground conductor 2a is the same as the width of the conventional ground conductor 12c shown in FIG. 5, so that a solder bridge is not generated between the signal conductor paths 3a and 3b in the assembly process, and it is mounted later. The width is sufficient to connect to the ground electrode (C) of the three-terminal capacitor 10 placed.

一方、基板１の下面には、グランド導体2b,2c及びグ
ランド補助導体2dを形成する（第１図中点線斜線で示
す）。グランド補助導体2dはグランド導体2b,2c間を架
橋して、グランド導体2aとスルーホール５を介して電気
的に接続されている。On the other hand, the ground conductors 2b and 2c and the ground auxiliary conductor 2d are formed on the lower surface of the substrate 1 (shown by dotted diagonal lines in FIG. 1). The ground auxiliary conductor 2d bridges between the ground conductors 2b and 2c and is electrically connected to the ground conductor 2a through the through hole 5.

グランド補助導体2dの幅は従来と同様の幅とされてい
るグランド導体2aよりかなり広く、通常は三端子コンデ
ンサ10の長さよりも広い幅が採用される。スルーホール
５はめっき等によって形成される。The width of the ground auxiliary conductor 2d is considerably wider than that of the ground conductor 2a, which has the same width as the conventional one, and is usually wider than the length of the three-terminal capacitor 10. The through hole 5 is formed by plating or the like.

次に、第２図に示すように、三端子コンデンサ10を整
列配置して取付け、信号導体路3aと信号電極（Ａ）との
間、信号導体路3bと信号電極（Ｂ）との間、及びグラン
ド導体2aとグランド電極（Ｃ）との間を半田６を介して
電気的に接続すると共に三端子コンデンサ10を固定す
る。Next, as shown in FIG. 2, the three-terminal capacitors 10 are aligned and attached, and between the signal conductor path 3a and the signal electrode (A), between the signal conductor path 3b and the signal electrode (B), Also, the ground conductor 2a and the ground electrode (C) are electrically connected via the solder 6, and the three-terminal capacitor 10 is fixed.

以上の方法により、第３図に示すノイズフィルタの取
付け構造が形成される。即ち、グランド導体2a及び信号
導体路3a,3bの上に半田６を介して三端子コンデンサ10
が置かれ、グランド導体2aは、整列配置された三端子コ
ンデンサ10間の基板１の部分であって、かつ、三端子コ
ンデンサ10のグランド電極（Ｃ）の近傍に設けられてい
るスルーホール５を介して下面に形成されているグラン
ド補助導体2dに電気的に接続されている構造になってい
る。従って、三端子コンデンサ10のグランド電極（Ｃ）
はグランド導体2aを介してすぐにグランド補助導体2dに
電気的に接続されることになり、グランド導体2aに発生
するインダクタンスの影響はほとんど受けず、替わって
グランド補助導体2dに発生するインダクタンスの影響を
受けることになる。このため、本発明の等価回路は第５
図（ｃ）に示す等価回路と同じものとなるが、グランド
補助導体2dは広い幅を確保できるのでインダクタンスL1
〜L6の数値の小さいものが得られ、フィルタの高周波ノ
イズ除去作用を阻害せず、また、ノイズ電圧も小さいも
のになる。By the above method, the mounting structure of the noise filter shown in FIG. 3 is formed. That is, the three-terminal capacitor 10 is placed on the ground conductor 2a and the signal conductor paths 3a and 3b through the solder 6.
And the ground conductor 2a is a portion of the substrate 1 between the three-terminal capacitors 10 that are aligned and the through-hole 5 provided in the vicinity of the ground electrode (C) of the three-terminal capacitor 10 is provided. The structure is such that it is electrically connected to the ground auxiliary conductor 2d formed on the lower surface thereof. Therefore, the ground electrode (C) of the three-terminal capacitor 10
Is immediately electrically connected to the ground auxiliary conductor 2d via the ground conductor 2a, and is hardly affected by the inductance generated in the ground conductor 2a. Instead, it is affected by the inductance generated in the ground auxiliary conductor 2d. Will be received. Therefore, the equivalent circuit of the present invention is the fifth circuit.
Although it is the same as the equivalent circuit shown in FIG. 7C, the inductance of the inductance L1 is large because the ground auxiliary conductor 2d can secure a wide width.
A small value of ~ L6 is obtained, which does not hinder the high frequency noise removing action of the filter, and the noise voltage is also small.

なお、本発明に係るノイズフィルタの取付け構造は前
記実施例に限定するものではなく、その要旨の範囲内で
種々に変更することができる。The mounting structure of the noise filter according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist.

実施例では上面のグランド導体2aと下面のグランド補
助導体2dを電気的に接続するためにスルーホールを利用
したが、これに限らず、例えばホールにしかめ端子を設
けるなどの手法によって上下の電気接続を行なってもよ
い。In the embodiment, the through hole is used to electrically connect the ground conductor 2a on the upper surface and the ground auxiliary conductor 2d on the lower surface, but the invention is not limited to this, and the upper and lower electrical connections may be made by, for example, providing a frown terminal in the hole. May be performed.

また、実施例では下面のグランド補助導体2dと同じ面
にグランド導体2b,2cを形成しているものを示したが、
グランド導体2b,2cが上面に形成されたものであっても
よい。In the embodiment, the ground conductors 2b and 2c are formed on the same surface as the ground auxiliary conductor 2d on the lower surface.
The ground conductors 2b and 2c may be formed on the upper surface.

［発明の効果］ 本発明によれば、グランド補助導体の幅をノズルフィ
ルタの信号電極間距離に関係なく独立して広くできるの
で、グランド補助導体が有するインダクタンスは極めて
小さいものとなる。この幅の広いグランド補助導体にノ
イズフィルタのグランド電極を電気的に接続できるの
で、ノイズフィルタのグランド電極に直列に入っている
インダクタンスＬの数値も極めて小さいものになり、ノ
イズフィルタの高周波ノイズ除去作用を阻害しない。[Effect of the Invention] According to the present invention, the width of the ground auxiliary conductor can be independently increased regardless of the distance between the signal electrodes of the nozzle filter, so that the inductance of the ground auxiliary conductor is extremely small. Since the ground electrode of the noise filter can be electrically connected to this wide ground auxiliary conductor, the numerical value of the inductance L in series with the ground electrode of the noise filter becomes extremely small, and the high frequency noise removing action of the noise filter is achieved. Does not hinder.

また、電流の変化di/dtによって生ずるノイズ電圧Ｌ
・di/dtもインダクタンスＬの値が極めて小さいので実
用上無視でき、共通インピーダンスノイズの問題も解決
する。Also, the noise voltage L caused by the current change di / dt
・ Di / dt also has an extremely small value of the inductance L, so it can be practically ignored and solves the problem of common impedance noise.

この結果、ノイズフィルタの本来のフィルタ特性が充
分発揮できるノイズフィルタの取付け構造が提供され
る。As a result, there is provided a noise filter mounting structure capable of sufficiently exhibiting the original filter characteristics of the noise filter.

【図面の簡単な説明】[Brief description of the drawings]

第１図、第２図は本発明の一実施例であるノイズフィル
タの取付け構造を説明する平面図、第３図は第２図のＸ
−Ｘ′の垂直断面図である。第４図（ａ）はチップ型ノ
イズフィルタの外観を示す斜視図、第４図（ｂ）はその
等価回路図である。第５図（ａ）、第５図（ｂ）は従来
のチップ型ノイズフィルタの取付け構造を説明する平面
図、第５図（ｃ）はその等価回路図である。 １……基板、2a,2b,2c……グランド導体、2d……グラン
ド補助導体、3a,3b……信号導体路、５……スルーホー
ル、10……ノイズフィルタ（チップ型三端子コンデン
サ）、（Ａ），（Ｂ）……信号電極、（Ｃ）……グラン
ド電極。1 and 2 are plan views for explaining the mounting structure of the noise filter according to the embodiment of the present invention, and FIG. 3 is the X of FIG.
It is a vertical sectional view of -X '. FIG. 4 (a) is a perspective view showing the appearance of the chip type noise filter, and FIG. 4 (b) is an equivalent circuit diagram thereof. 5 (a) and 5 (b) are plan views for explaining the conventional mounting structure of the chip type noise filter, and FIG. 5 (c) is an equivalent circuit diagram thereof. 1 ... Board, 2a, 2b, 2c ... Ground conductor, 2d ... Ground auxiliary conductor, 3a, 3b ... Signal conductor path, 5 ... Through hole, 10 ... Noise filter (chip type three-terminal capacitor), (A), (B) ... Signal electrode, (C) ... Ground electrode.

フロントページの続き (56)参考文献 特開 昭62−247516（ＪＰ，Ａ) 実開 昭63−84924（ＪＰ，Ｕ) 実開 昭62−96825（ＪＰ，Ｕ) 実開 昭60−133698（ＪＰ，Ｕ)Continuation of front page (56) References JP 62-247516 (JP, A) actual opening 63-84924 (JP, U) actual opening 62-96825 (JP, U) actual opening 60-133698 (JP , U)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】基板表面上に形成されたグランド導体とそ
の両側に形成された信号導体路との間を電気的に接続し
ている、両端部に信号電極を設けると共に中央部にグラ
ンド電極を設けたチップ型三端子ノイズフィルタの取付
け構造において、 基板の一方の面に整列配置された信号導体路がグランド
導体の両側に対向して形成されていて、ノイズフィルタ
が、前記信号導体路とノイズフィルタの両端に設けられ
た信号電極とを電気的に接続するように、かつ、ノイズ
フィルタの中央部に設けられたグランド電極と前記グラ
ンド導体とを電気的に接続するように整列配置し、基板
の他方の面にグランド補助導体が前記グランド導体と基
板の厚み方向に対向して形成されていて、前記グランド
導体とグランド補助導体とが、前記整列配置されたノイ
ズフィルタの直下の基板部分又は前記整列配置されたノ
イズフィルタ間の基板部分のいずれか一方の基板部分で
あって、かつ、前記整列配置されたノイズフィルタのグ
ランド電極の近傍に設けたスルーホールによって電気的
に接続された構造を成していることを特徴とするノイズ
フィルタの取付け構造。1. A ground electrode formed on the surface of a substrate and a signal conductor path formed on both sides of the ground conductor are electrically connected to each other. In the mounting structure of the provided chip-type three-terminal noise filter, the signal conductor paths aligned on one surface of the substrate are formed facing each other on both sides of the ground conductor. Arranged so as to electrically connect to the signal electrodes provided at both ends of the filter, and to electrically connect the ground electrode provided at the center of the noise filter and the ground conductor, and the substrate. A ground auxiliary conductor is formed on the other surface of the ground conductor so as to face the ground conductor in the thickness direction of the substrate, and the ground conductor and the ground auxiliary conductor are arranged in alignment. Through a through hole provided in the vicinity of the ground electrode of the aligned noise filter, which is one of the substrate portion immediately below the filter and the substrate portion between the aligned noise filters. Mounting structure for a noise filter, which is characterized in that the structures are connected together.
JP1152800A 1989-06-14 1989-06-14 Noise filter mounting structure Expired - Lifetime JP2676921B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1152800A JP2676921B2 (en) 1989-06-14 1989-06-14 Noise filter mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1152800A JP2676921B2 (en) 1989-06-14 1989-06-14 Noise filter mounting structure

Publications (2)

Publication Number Publication Date
JPH0318113A JPH0318113A (en) 1991-01-25
JP2676921B2 true JP2676921B2 (en) 1997-11-17

Family

ID=15548430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1152800A Expired - Lifetime JP2676921B2 (en) 1989-06-14 1989-06-14 Noise filter mounting structure

Country Status (1)

Country Link
JP (1) JP2676921B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5290523A (en) 1992-03-13 1994-03-01 Edward Koppelman Method and apparatus for upgrading carbonaceous fuel
US5493259A (en) * 1992-10-13 1996-02-20 The Whitaker Corporation High voltage, low pass filtering connector with multiple ground planes
EP0800338B1 (en) * 1996-04-04 2001-05-30 Gunter Langer Devices for minimising electromagnetic radiation in printed circuit boards and other electronic circuit carriers
JP2005044871A (en) * 2003-07-24 2005-02-17 Tdk Corp Three terminal feed-through capacitor
KR101152463B1 (en) 2008-03-19 2012-06-01 다이킨 고교 가부시키가이샤 Coating composition for forming high dielectric film and high dielectric film
US8934216B2 (en) 2008-12-22 2015-01-13 Daikin Industries, Ltd. Composition for forming high dielectric film for film capacitor
EP2527393A1 (en) 2010-01-20 2012-11-28 Daikin Industries, Ltd. High-dielectric film
CN103119671B (en) 2010-09-22 2016-10-12 大金工业株式会社 Membrane capacitance film and membrane capacitance
WO2016052303A1 (en) 2014-09-30 2016-04-07 日本ゼオン株式会社 Film capacitor
US11352469B2 (en) 2017-01-31 2022-06-07 Daikin Industries. Ltd. Fluororesin film
US11845839B2 (en) 2017-11-08 2023-12-19 Daikin Industries, Ltd. Film
US11891489B2 (en) 2018-02-28 2024-02-06 Zeon Corporation Film for capacitor and method of producing same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133698U (en) * 1984-02-15 1985-09-06 キヤノン株式会社 Board mounting structure
JPS6296825U (en) * 1985-12-06 1987-06-20
JPS62247516A (en) * 1986-04-18 1987-10-28 株式会社村田製作所 Chip composite parts for lc
JPH046259Y2 (en) * 1986-09-30 1992-02-20
JPS6384924U (en) * 1986-11-22 1988-06-03

Also Published As

Publication number Publication date
JPH0318113A (en) 1991-01-25

Similar Documents

Publication Publication Date Title
US5023753A (en) Printed circuit
JP2676921B2 (en) Noise filter mounting structure
US4782311A (en) Three terminal filter
JPH0318112A (en) Fitting structure for chip type noise filter
JP2882994B2 (en) Printed board with capacitors mounted
WO1986003365A1 (en) Wiring structure of a terminal circuit
JPH06349678A (en) Feed-through type capacitor, electronic device using it, and its mounting method
JPH07120915B2 (en) Mounting structure for chip type noise filter
JPH0451602A (en) Dielectric filter
JPH0817300B2 (en) Noise filter mounting structure
JPS62108594A (en) Hybrid integrated circuit
JP2000244128A (en) Multilayer printed wiring board and packaging structure of chip-type three-terminal noise filter using the same
JPH0897036A (en) Electronic circuit board
JP2758816B2 (en) EMI measures for multilayer printed circuit boards
JPH09190923A (en) Printed inductor
US4807036A (en) Complex circuit component for a video signal circuit in a television receiver set
JP4460855B2 (en) filter
JPH0648954Y2 (en) Electromagnetic filter composite parts
JPH0318114A (en) Fitting structure and adapter for noise filter
JPS645877Y2 (en)
JPH0629773A (en) Mounting method for surface acoustic wave circuit device
JPH0741176Y2 (en) Printed wiring board
JPH07202374A (en) Printed circuit board pattern
JPH0349524A (en) Circuit protected against static electricity
KR100425632B1 (en) Microwave Hybrid Integrated Circuits