JP3129273B2 - Inductor array - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor array in which a plurality of inductors are arranged, and more particularly, to an inductor array capable of reducing a mounting area.

[0002]

2. Description of the Related Art As one of conventional electronic component arrays, there is an inductor array 61 having a plurality of inductors 62 as shown in FIG.
In the case of the inductor array 61, the inductors (inductance elements) 62 are arranged in parallel with the array base 61a such that one end is led out to one long side surface and the other end is led to the other long side surface. Have been. These inductors 62 are connected to input / output terminals of an IC (integrated circuit) 63 and the like to exhibit a noise removing function and the like.

As shown in FIG. 8, the inductor array 61 and the IC (integrated circuit) 63 are usually mounted at different positions on the same wiring board 64, respectively, as shown in FIG.
The required electrical connection is made by the printed wiring 65. Such an inductor array is very useful because the same effect as mounting a large number of inductors can be obtained by mounting only one on the wiring board. However, recently, the mounting density of electronic components on the wiring board 64 has become increasingly higher, and a situation occurs in which the mounting space (mounting area) of the inductor array 61 connected to the input / output terminals of the IC 63 is insufficient. Has been reached.

An object of the present invention is to solve the above problems and to provide an inductor array capable of saving a mounting area.

[0005]

According to a first aspect of the present invention, there is provided an inductor array in which a plurality of inductors are disposed in an array base, and one end of each inductor is connected to a surface of the array base. the other end is led respectively to the rear surface of the array substrate, and short-circuit conductor which is connected in parallel to each inductor, with is provided on the array substrate to each inductor, inductors and inductor
And a short-circuit conductor connected in parallel to the
Ri Contact is disposed independently in the array substrate, the connecting portion between the one end and the shorting member of the inductor, and one of the connecting portion of the other end and the shorting member inductor, the surface of the array substrate or backside is exposed to, by cutting the exposed portion of the connection portion, it is characterized by parallel connection of the inductor and shorting member is configured to be released.

In the case of the inductor array of the present invention, each of the inductors disposed on the array substrate has one end led out to the front surface of the array substrate and the other end led out to the back surface of the array substrate. The ICs can be mounted on either one of the front and back surfaces of the array base and mounted on the wiring board in such a manner that the other side is joined (connected) to the wiring board. Therefore, since the inductor array is mounted in the same position as the ICs, etc., it is not necessary to provide a separate layout space for mounting the inductor array, and the mounting area of the wiring board is reduced. It becomes possible to do.

[0007] Since each inductor is shorted by the shorting conductor connected in parallel, it is as it does not function as an inductor, connected to the IC such inductor
If it is necessary to function as an inductor, disconnect the connection between the inductor and the short-circuit conductor before or after mounting, and eliminate the parallel connection between the inductor and the short-circuit conductor to easily function as an inductor. thing
Becomes possible. On the other hand, for inductors that do not need to be connected to ICs, it is not necessary to cut the connection between the inductor and the short-circuit conductor, and the inductor and the short-circuit conductor may be left connected in parallel.

According to a second aspect of the present invention, the connecting portion between the one end of the inductor and the short-circuiting conductor and the connecting portion between the other end of the inductor and the short-circuiting conductor are both exposed. And

In a case where both the connection between the one end of the inductor and the short-circuit conductor and the connection between the other end of the inductor and the short-circuit conductor are exposed, the IC
As for the inductor to be connected to the type, it is possible to disconnect both the connection portions and completely separate the short-circuit conductor from the inductor. Then, by completely separating the short-circuit conductor from the inductor, it becomes possible to prevent the stray capacitance due to the short-circuit conductor from being applied to the inductor.

Further, the inductor array according to claim 3 is characterized in that the parallel connection of the predetermined inductor and the short-circuit conductor is released by cutting the exposed portion of the connection portion.

By cutting the exposed portion of the connecting portion and releasing the parallel connection of the predetermined inductor and the short-circuiting conductor,
Mounting on a wiring board or the like can be performed immediately, and the present invention can be made more effective.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and features thereof will be described in more detail. FIG.
FIG. 1 is a perspective view showing an entire inductor array according to an embodiment.

As shown in FIG. 1, in an inductor array 1 of this embodiment, a large number of inductors (inductance elements) are arranged in an array substrate 3 having a square planar shape.
2 are arranged in a vertical and horizontal arrangement, and for each inductor 2, a short-circuit conductor 4 connected in parallel with the inductor 2.
Are arranged.

Each inductor 2 of the inductor array 1 has:
One end 2a is led out to the surface 3a of the array base 3, and the other end 2a
b is led out to the back surface 3 b of the array base 3. Also,
One end 4 a of the short-circuit conductor 4 is also led out to the front surface 3 a of the array base 3, and the other end 4 b is led out to the back surface 3 b of the array base 3.

A connecting portion 5 for electrically connecting one end 2a of the inductor 2 and one end 4a of the short-circuiting conductor 4 is formed on the front surface 3a of the array base 3. A connecting portion 6 for electrically connecting the other end 2b of the second 2 to the other end 4b of the short-circuiting conductor 4;
The inductor 2 and the short-circuit conductor 4 are connected in parallel. In addition, connection bumps 7 and 8 as external terminals for connection with the outside are provided at substantially the center of the connection part 5 and the connection part 6, respectively.

In the case of the inductor array 1 of this embodiment, when the inductors 2 and the short-circuit conductors 4 are connected in parallel, all the inductors 2 are short-circuited by the short-circuit conductors 4. Does not function as an inductance element.

However, as shown in FIG.
By disconnecting both or one of the connecting portions 5 and 6 exposed on the front surface 3a and the back surface 3b of the inductor 2 to release the parallel connection between the inductor 2 and the short-circuiting conductor 4, the inductor 2 has an inductance It functions as an element.

As a specific method for cutting the connection portions 5 and 6, as shown in FIG. 2A, a method of cutting only the middle between the left end of the connection portion 5 on the front surface 3a side and the connection bump 7 is used. As shown in FIG. 2B, a method of cutting only the middle between the left end of the connection portion 6 on the back surface 3b side and the connection bump 8, as shown in FIG. 2C, the front surface 3a side and the back surface 3b
3A, a method of cutting both the left end of the connection portions 5 and 6 and the middle of the connection bumps 7 and 8, as shown in FIG. 3A, a form of cutting only the left end of the connection portion 5 on the surface 3a side,
As shown in FIG. 3B, only the left end of the connecting portion 6 on the back surface 3b side is cut off. As shown in FIG.
Various methods such as a method of cutting both left ends of the connection portions 5 and 6 on the front surface 3a side and the back surface 3b side can be adopted.

As shown in FIG. 2 (c) or FIG. 3 (c), when both the connecting portions 5 and 6 are cut off,
The short-circuit conductor 4 is completely separated from the inductor 2, and the stray capacitance due to the short-circuit conductor 4 is prevented from being applied to the inductor 2. In addition, as a specific method used for cutting the connection parts 5 and 6, a method of irradiating a position where the connection parts 5 and 6 are to be cut with a laser beam to remove them, a method of sandblasting, and the like are given.

As described above, in the case of the inductor array 1 of this embodiment, as shown in FIG. 4, for example, as shown in FIG. Is implemented, and then mounting is performed.

Further, the inductor array 1 of this embodiment
In the case of (1), connection bumps 7 and 8 as external terminals for connection with the outside are provided on the front surface 3a and the back surface 3b of the array base 3, respectively, and the connection bumps 7 and 8 are connected by the inductor 2 or the short-circuit conductor 4. It is configured to be.

As shown in FIG. 5, the connection bump 7 is a ball-shaped connection array formed on the back surface 9a of the IC 9 to be connected using a BGA (ball grid array) type external connection terminal system. It is formed at a position corresponding to the bump 10. The connection bump 8 is formed at a position corresponding to a connection bump (not shown) on the surface of the wiring board to be mounted.

For mounting the inductor array 1 on a wiring board, for example, as shown in FIG. 5, an IC 9 is overlaid on the surface 3a of the array substrate 3, the connection bumps 7 and the connection bumps 10 are aligned, and soldering is performed. 6, the array substrate 3 is placed on the wiring substrate 11 so that the back surface 3b of the array substrate 3 faces the surface of the wiring substrate 11 as shown in FIG. After the alignment of the connection bumps of the wiring board 11 (FIG. 5) with the connection bumps, the bonding is performed by a method such as soldering.

Therefore, the inductor array 1 and the IC 9
Are mounted so as to be substantially overlapped at the same position on the surface of the wiring board 11, so that it is not necessary to provide a separate layout space for mounting the inductor array 1.

As shown in FIG. 4, the input / output terminal of the IC 9 (FIG. 5) corresponding to the inductor 2 (22) whose connection 5 or the connection 6 has been cut is connected to the inductor 2
(22) is connected, and the short-circuit conductor 4 is connected to the input / output terminal of the IC 9 (FIG. 5) corresponding to the inductor 2 in which the connection 5 or the connection 6 has not been cut.

Next, the inductor array 1 of this embodiment
A method of manufacturing the device will be described. In manufacturing the inductor array 1 of this embodiment, as shown in FIG. 7, ceramic green sheets 12 to 17 on which necessary conductor patterns are formed are prepared. As the ceramic green sheet, a material made of a ceramic material having an insulating property (in some cases, a ceramic material having magnetism) is used.

The ceramic green sheet 12 includes a linear conductor pattern serving as the connecting portion 5, a via hole 18 forming the short-circuit conductor 4, and the lower green sheet 1.
Via holes 19 are formed for electrical connection to the holes 3.

The ceramic green sheet 13 includes, as necessary conductor patterns, the inductor 2, for example, an arc-shaped conductor pattern 20 and a short-circuit conductor 4.
Are formed, and a via hole 19 for electrical connection with the lower green sheet 14 is formed.

Further, the ceramic green sheets 14, 1
Similarly, arc conductor patterns 20 forming the inductor 2 and via holes 18 and 19 forming the short-circuit conductors 4 are formed as necessary conductor patterns in the conductors 5 and 16.

In the ceramic green sheet 17, necessary conductor patterns include a linear conductor pattern serving as the connecting portion 6, a via hole 18 forming the short-circuiting conductor 4, and the upper green sheet 16. Hole 19 is formed for electrical connection.

In FIG. 7, after the conductor patterns to be the connection portions 5 and the connection portions 6 are formed on the sheets 12 and 17, lamination and pressure bonding described below are performed. Alternatively, the conductor pattern may be formed after pressing, compression and firing. In FIG. 7, the inductor 1
Although only the number of conductor patterns is illustrated, it goes without saying that the number of conductor patterns in each green sheet is the same as the arrangement of the inductors 2 (FIG. 1 and the like).

Then, the ceramic green sheet 1
After superimposing 2 to 17 in the order shown in FIG.
Crimping is performed under predetermined conditions. Thus, the arc-shaped conductor patterns 20 are connected in a coil shape to form the inductor 2, and the via holes 18 are connected to form the short-circuit conductor 4.

Then, after baking it, connecting bumps 7 and 8 are formed on the obtained array substrate 3 (FIG. 1) to obtain a multilayer inductor array 1 as shown in FIG.

In the above embodiment, the number of inductors 2 to be arranged in one inductor array 1 is not specified, but the number of inductors 2 can be increased or decreased according to the application. There is no special restriction on the position where each inductor 2 is disposed, and the position where the inductor 2 is disposed can be determined according to the application. In the above embodiment,
Although the case where only the inductor 2 is provided in the inductor array 1 has been described, other elements such as a resistance element may be provided together with the inductor 2.

In the above embodiment, the case where the positions of the connection bumps 7 and 8 are substantially at the center of the connection portions 5 and 6 has been described. However, the position of the connection bumps 7 and 8 is not limited to the center. The right ends of the parts 5 and 6, that is, the positions of the one end 2a and the other end 2b of the inductor 2 may be used.

Further, in the above embodiment, the case where both the connecting portions 5 and 6 are exposed has been described. However, in the inductor array of the present invention, the connecting portions 5 and 6 are exposed.
It is also possible to configure so that only one of the six is exposed and cut at only one location. Further, in the present invention, the connection portions 5 and 6 may be cut after being mounted on the IC 9 or the wiring board 11.

In other respects, the present invention is not limited to the above embodiment, but relates to the shape and material of the conductor pattern for forming the inductor, the number and form of sheets laminated on the array substrate, the material of the sheet, and the like. Various applications and modifications can be made within the scope of the invention.

[0038]

According to the inductor array of the present invention (inventions 1, 2 and 3), one end of a plurality of inductors disposed on the array base is led out to the surface of the array base, and the other end is arranged on the array base. The ICs to be connected are attached to either one of the front and back surfaces of the array base, and the other surface is joined (connected) to the wiring board. It can be implemented. Therefore, since the inductor array is mounted in the same position as the ICs, etc., it is not necessary to provide a separate layout space for mounting the inductor array, and the mounting area of the wiring board is reduced. It becomes possible to do.

Each inductor is connected to a short-circuit connected in parallel.
Shorted by the grounding conductor.
Does not function as an inductor, but connects to ICs to
If it is necessary to function as a
Before or after mounting the connection between the inductor and the short-circuit conductor
Functioning effectively as an inductor
It is possible to make it. On the other hand, it is necessary to connect with ICs
For inductors without conductors, the inductor and short-circuit conductor
It is not necessary to disconnect the connection of
The conductors may be left connected in parallel.

Further, as in the inductor array according to the second aspect, both the connection portion between one end of the inductor and the short-circuiting conductor and the connection portion between the other end of the inductor and the short-circuiting conductor are exposed. For the inductors to be connected to the ICs, it is possible to disconnect both the connecting portions and completely separate the short-circuit conductor from the inductors. As a result, it is possible to prevent stray capacitance due to the short-circuit conductor from being applied to the inductor.

Further, as in the inductor array according to the third aspect, the exposed portion of the connection portion is cut and the parallel connection of the predetermined inductor and the short-circuiting conductor is released in advance, so that it is immediately mounted on a wiring board or the like. Can be performed, and the present invention can be made more effective.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an inductor array according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a specific example of a cutting mode of a connection portion connecting an inductor and a short-circuit conductor of an inductor array according to an embodiment of the present invention.

FIG. 3 is a schematic diagram showing a specific example of a cutting mode of a connecting portion connecting an inductor and a short-circuit conductor of an inductor array according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a state in which a connecting portion for connecting the inductor and the short-circuiting conductor of the inductor array according to the embodiment of the present invention is cut off.

FIG. 5 is a perspective view showing a positional relationship when an inductor array and an IC to be connected according to an embodiment of the present invention are stacked;

FIG. 6 is a perspective view showing a mounted state of the inductor array according to the embodiment of the present invention.

FIG. 7 is a perspective view showing one step of a method for manufacturing an inductor array according to one embodiment of the present invention.

FIG. 8 is a perspective view showing a mounting state of a conventional inductor array.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Inductor array 2 Inductor 2a One end of inductor 2b The other end of inductor 3 Array base 3a Front surface of array base 3b Back surface of array base 4 Short-circuit conductor 4a One end of short-circuit conductor 4b The other end of short-circuit conductor 5, 6 Connection part 7 , 8 connection bump 9 IC 9a back surface of IC 10 connection bump 11 wiring board 12-17 ceramic green sheet 18, 19 via hole 20 conductor pattern 22 inductor functioning as an inductance element

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01F 27 / 00,27 / 28 H01F 17/00 H01L 23/12

Claims (3)

(57) [Claims] A plurality of inductors are provided in an array base, one end of each inductor is led out to the front side of the array base, and the other end is led out to the back side of the array base, and connected in parallel to each inductor. Short-circuit conductors are provided on the array base for each inductor,
Inductor and short-circuit conductor connected in parallel with the inductor
Are independently provided in the array substrate.
And one of a connection portion between one end of the inductor and the short-circuiting conductor, and a connection portion between the other end of the inductor and the short-circuiting conductor,
An inductor array, which is exposed on the front surface or the back surface of the array base, and is configured so that parallel connection between the inductor and the short-circuit conductor is released by cutting the exposed portion of the connection portion. 2. The device according to claim 1, wherein both the connection between the one end of the inductor and the short-circuit conductor and the connection between the other end of the inductor and the short-circuit conductor are exposed. Inductor array. 3. Cutting the exposed portion of the connection portion,
3. The inductor array according to claim 1, wherein a predetermined connection between the predetermined inductor and the short-circuiting conductor is released.