JPH03191592A - Assembly structure of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To reduce a cost and to increase a mounting area by a method wherein a plurality of hybrid integrated circuit boards are piled up in a multistage manner by using a plurality of coaxial components as supports. CONSTITUTION:Each axial component 20, i.e., the component 20 which is provided with a main body part 20a having one out of element functions such as a resistance, a diode, an inductor and the like and which is provided with one set of lead parts 21, 21' mounted on both ends of the main body part 20a and used to supply and receive an electric signal to and from the outside, is used as an essential support when a plurality of hybrid integrated circuit boards 1, 2 are piled up in a multistage manner. Thereby, support members can be reduced, a cost can be reduced and a mounting area can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an assembly structure of a hybrid integrated circuit configured to superpose a plurality of hybrid integrated circuit boards in a multi-stage manner.
More specifically, the present invention relates to a hybrid integrated circuit assembly structure in which one or more hybrid integrated circuit boards are stacked on top of one hybrid integrated circuit board.

(Prior Art) In recent years, with the demand for higher functionality and smaller size of electronic devices, built-in electronic circuits have been frequently integrated into hybrid integrated circuits.

Correspondingly, the structure of hybrid integrated circuits has also become more complex. For example, conductor layers, passive element layers, and insulating layers are printed multiple times on the surface of hybrid integrated circuit boards made of alumina or other materials using thick film screen printing. However, there are structures in which the hybrid integrated circuit board is fired to form a multilayer structure, or in which electronic components and the like are mounted on both sides by providing through holes in the hybrid integrated circuit board.

Furthermore, as shown in FIGS. 5 to 8, there are various structures in which the hybrid integrated circuit boards are assembled into a single product by stacking a plurality of hybrid integrated circuit boards in multiple stages.

As one of such multistage polymerized hybrid integrated circuit boards, there is a product having a structure as shown in FIG. 5.

This hybrid integrated circuit board has electronic components 6.6a on both sides.
A lower hybrid integrated circuit board 1 on which is mounted and an upper hybrid integrated circuit board 2 are superimposed using a plug-in lead wire 3 as a support.

One end portion of a plurality of plug-in lead wires 3,3'... having lead portions 4 are passed through the lower hybrid integrated circuit board l, and are soldered and fixed to the hybrid integrated circuit board l with solder 5. There is.

Furthermore, the other ends of the plug-in lead wires 3.3'... are connected upwardly from the hybrid integrated circuit board 1 at an interval of symbol H to an upper hybrid integrated circuit on which electronic components 6.6a'... are mounted on both sides. It penetrates through the board 2 and is soldered and fixed to the upper hybrid integrated circuit board 2 with solder 5a.

Furthermore, there is also a product with a structure shown in FIG. 6, which is one of the hybrid integrated circuit boards that are polymerized in multiple stages.

This hybrid integrated circuit board includes a plurality of F-type lead frames 8
Insert the lower hybrid integrated circuit board l, which is configured as a dual line type by soldering and fixing it to the left and right ends of the board, and the upper hybrid integrated circuit board 2, which has electronic components 6, 6a', etc. mounted on both sides. It is constructed by soldering and fixing with wires 7, 7', . . . .

In addition, in the hybrid integrated circuit board superposed in multiple stages shown in FIG. 7, a plurality of double F-type lead frames 10, 10, . and are attached to both left and right ends of the upper hybrid integrated circuit board 2 and fixed by soldering.

In addition, in the hybrid integrated circuit board stacked in multiple stages as shown in FIG. 8, a plurality of F-type lead frames 8, 8', etc. are attached to both left and right ends of the lower hybrid integrated circuit board l and fixed by soldering. At the same time, support F-type lead frames ILII', which have bent portions 11a whose lower ends are bent, are attached to both left and right end portions of the upper hybrid integrated circuit board 2.

The bent portion 11a is fixed to the upper surface of the lower hybrid integrated circuit board 1 with solder 12.

The conventional multi-stage polymerized hybrid integrated circuit board configured as described above is highly functional, and since all the various electronic components are mounted on the board, the built-in volume is relatively small. It has become.

Incidentally, a plurality of plug-in lead wires 3. shown in FIGS. 5 and 6.
3'... and the insertion wires 7, 7'... are not only made of conductive material, but may also be made of non-conductive material such as resin.

(Problems to be Solved by the Invention) However, in the conventional hybrid integrated circuit board configured as described above, by separating the lower hybrid integrated circuit board l and the upper hybrid integrated circuit board 2 by an interval of symbol H, ,
Since they must overlap in two stages, in the cases shown in Figures 5 and 6, projections for locking are provided on the plug-in leads 3.3' and the plug-in wires 7.7'. In addition, in the case shown in FIG. 7, a special double F-type lead frame 1O110' in which the clip portions are molded in two places, the upper and lower parts, is required.
... is required, and in the case shown in Fig. 8, a support F-type lead frame 11,11', in which the bent portion 12 is molded, is required, which leads to an increase in the number of steps and cost. There was a clan point.

Furthermore, in the cases shown in FIGS. 7 and 8, double F
Since it is necessary to provide conductive lands for soldering the mold lead frames 10, 10', etc., the electronic components 6
．． Since the actual mounting area of 6a... becomes smaller and it is necessary to form a conductive pattern on the conductive land,
There was a problem in that the patterning of the electronic circuit became complicated.

In the case shown in FIG. 8, it is necessary to form conductive lands for soldering the bent portions 12 of the double F-type lead frames 11, 11', etc. to the surface of the hybrid integrated circuit board 1. There were problems in that the mounting area was reduced and the electronic circuit pattern became complicated.

The present invention has been made in view of the above circumstances, and it is possible to reduce the number of steps when a plurality of hybrid integrated circuit boards are superposed in a multi-tiered manner, and also to improve the packaging density and facilitate the design of electronic circuit patterns. In order to achieve the above object, the hybrid integrated circuit of the present invention The assembly structure is one in which a plurality of hybrid integrated circuit boards are stacked in multiple stages using axial parts.

In the present invention, the lead wires of the axial components that pass through the hybrid integrated circuit board can be used as input/output leads, if necessary.

(Function) This invention uses the electronic components mounted on the hybrid integrated circuit board as supports required when stacking a plurality of hybrid integrated circuit boards in a multi-tiered manner, so that the number of supporting members can be reduced. .

Further, since electrical connection between one hybrid integrated circuit board and another hybrid integrated circuit board can be made by the electronic components used as the pillars, the degree of freedom in electronic circuit design is improved.

In addition, even if it becomes necessary to partially change or add electronic circuits, the above-mentioned electronic components can be arbitrarily used as supports, and other new hybrid integrated circuit boards can be stacked in multiple stages on the base hybrid integrated circuit board. By doing so, you can respond effectively.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the assembled structure of a hybrid integrated circuit according to the present invention, FIG. 2 is a perspective view showing another embodiment, and FIGS. 3 and 4 are side views showing other embodiments. A diagram is shown.

The axial component 20 includes a main body 20a having at least one of element functions such as a resistor, a diode, an inductor, etc., and a set of leads attached to both ends of the main body 20a for exchanging electrical symbols with the outside. Part 21.21'...
It refers to something that has the following.

The axial component 20 may be, for example, a CR composite component in which a resistor R and a capacitor C are integrated into the main body 20a.

Electronic circuit patterns 23 are formed on both the front and back surfaces of the lower hybrid integrated circuit board 1, and electronic components 6.
6'... is implemented.

Conductor lands 22, 22', . .

The through hole 19 has at least an axial part 20.20.
'... has a diameter that allows the glued parts 21, 21'... to be inserted, and the conductor lands 22, 22'... and one end of the lead parts 21, 21'... are connected by solder 5. Fixed.

Axial parts 20.20'... lead part 21゜21
The other end of the upper hybrid integrated circuit board 2, on which electronic components 6, 6', etc. are mounted, like the lower hybrid integrated circuit board 1, and the electronic circuits on the front and back sides are connected through through holes etc. Conductor lands 22a, 22a installed near the
' is inserted into the through hole 19 of the conductor lands 22a, 22.
a'... are connected and fixed by solder 5a.

The connection angle between the lower hybrid integrated circuit board l and the upper hybrid integrated circuit board 2 by the axial parts 20, 20'...
The axial parts 20, 20'... and each circuit board 1
．． The two plane portions are configured to form a substantially right angle.

As described above, the lower hybrid integrated circuit board 1 and the upper hybrid integrated circuit board 2 are axial components 20, 20'...
The structure is such that the two stages are stacked together and electrically connected using the support as a support, so it is possible to use the plug-in type lead wire 3 or the two-stage clip type, which is required in conventional multi-stage hybrid integrated circuit boards. The lead wire 10 is no longer necessary, so raw materials can be reduced, and protrusions etc. to be formed on the substrate are no longer necessary, so processing labor and time can be reduced.

In addition, when the main body parts 20a, 20a'... use axial parts 20, 20', etc. having the same shape and dimensions as supports, it is possible to ensure uniform spacing between the upper and lower substrates, so that, for example, the inductor Electronic components 6a, such as ceramic resonators and the like, which are relatively difficult to miniaturize, can be easily mounted on the lower hybrid integrated circuit board l.

Furthermore, when electronic elements that function as inductors are mounted side by side on a board, they will be mutually influenced magnetically, but if one of the inductors 20 is placed as a support, then the hybrid integrated circuit board 1, the magnetic flux in the magnetic field of the electronic component 6a having a variable inductor function mounted on the lower hybrid integrated circuit board 1 and the magnetic flux in the magnetic field of the axial component 20 do not interfere. Therefore, it is important to prevent magnetic interference between the two sides.

Also, when a resistor with a large current capacity is mounted on a board, other electronic elements may be affected by thermal noise. However, by using the resistor as an axial component 20 for a support, Thermal influence on the electronic circuit above can be reduced, and the heat dissipation effect of the axial component 20 can be enhanced.

Next, a second embodiment of the present invention will be described based on FIG. 2.

In this embodiment, a single in-line type is formed by horizontally attaching clip-type lead wires 25, 25', etc. to the front and sides of the lower hybrid integrated circuit board l on which electronic components 6.6a are mounted. This is what I did.

An upper hybrid integrated circuit board 2 having axial components 20, 20', . . . as supports is superimposed on the upper left portion of the lower hybrid integrated circuit board I.

In addition, the lead wires 21. of the axial parts 20.20'...
21'... are soldered after penetrating each board, and unnecessary parts are cut and removed.

With this configuration, in the design stage of the electronic circuit pattern, any electronic circuit block is extracted from the entire electronic circuit, and this electronic circuit block is partially superposed as the upper hybrid integrated circuit board 2 to be attached to the board. The mounting density of parts has been improved and the size has been reduced, and after the upper hybrid integrated circuit board 2 is functionally resistance-trimmed using, for example, a laser trimmer, it can be mounted on the upper hybrid integrated circuit board 1 by partially overlapping it. Therefore, the degree of freedom in designing and adjusting electronic circuits and pattern placement can be improved.

Next, a third embodiment of the present invention will be described based on FIG.

In this embodiment, the lower hybrid integrated circuit board 1 and the upper hybrid integrated circuit board 2 are stacked in two stages by axial parts 20, 20', etc., and furthermore, the lower hybrid integrated circuit board 1 has both left and right side parts. In, clip type lead wire 8.8'...
It has a dual in-line configuration by mounting vertically.

Further, in the embodiment shown in the fourth case, the above-mentioned axial parts 20, 20', etc. are used as supports, and another hybrid integrated circuit board 28 is provided at the bottom.

As shown in the above embodiment, the axial parts 20, 20',
By considering ・ as a single packaged product and superimposing it on the base board in multiple stages, it is possible to improve the packaging density of electronic components and enhance the function as a hybrid integrated circuit.

In addition, the present invention uses axial parts 20.20' to
It is not limited to a step structure, but may be one in which the axial parts 20, 20', etc. are sequentially stacked as supports (in some cases, it may be used in combination with an insert type lead or a clip type lead). .

Furthermore, any number of supports made of the axial components 20, 20', etc. may be erected between the boards as required.

(Effects of the Invention) As described above, since the hybrid integrated circuit assembly structure of the present invention is configured as described above, it has the following effects.

■Since multiple hybrid integrated circuit boards are stacked in multiple stages using multiple axial components as supports, the plug-in lead wires and clip-type lead wires conventionally used for supports are no longer required, and the lead wires for the axial components are no longer required. Since it can also be used as an input/output lead, it has the excellent effect of reducing material costs and reducing costs.

■Because it uses axial components such as resistors, diodes, and inductors as pillars, there is no need to mount these electronic components on the board, which allows for a larger mounting area on the hybrid integrated circuit board, meeting the demand for miniaturization. It has the excellent effect of being able to

■Since electronic circuits can be divided into multiple functional blocks and electrical connections can be made using axial components, it is possible to easily adjust, add, or change functions, increasing the degree of freedom in design. Has excellent effects.

(2) When an axial component having an inductor function is used as a support, it has the excellent effect of preventing magnetic interference with the inductor mounted on the substrate surface.

■When using an axial component with a resistance function as a support, thermal noise emitted from the resistor can be avoided.
Since heat can also be dissipated, it has an excellent effect of improving the operational performance of the hybrid integrated circuit.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the assembled structure of a hybrid integrated circuit according to the present invention, FIG. 2 is a perspective view showing an embodiment of the circuit structure, and FIG.
FIG. 4 is a side view showing an embodiment of the circuit; FIG. 5 is a side view of a conventional multi-stage hybrid integrated circuit board with plug-in lead wires as supports; Fig. 6 is a side view of a conventional multi-stage hybrid integrated circuit board with a plug-in wire as a support, and Fig. 7 is a side view of a conventional multi-stage hybrid integrated circuit board with a double F-type lead frame as a support. 1 is a side view of a conventional multi-stage hybrid integrated circuit board using an F-type lead frame as a support. DESCRIPTION OF SYMBOLS 1... Lower stage hybrid integrated circuit board, 2... Upper stage hybrid integrated circuit board, 20... Axial component, 21... Lead part. Figure Figure Figure 3 Figure Figure Figure Figure

Claims (1)

[Claims] (1) An assembly structure of a hybrid integrated circuit characterized in that a plurality of hybrid integrated circuit boards are stacked in multiple stages using axial components.