JP2000174200A - Structure of multi-layer hybrid integrated circuit device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve mounting density of each part by laminating a plurality of printed board where parts such as various electronic parts are mounted to constitute a multi-layer hybrid integrated circuit device. SOLUTION: A plurality of metal spacers 9, 10, and 11 forming intervals among printed boards are provided at a part inside the outer peripheral surface of printed board, among printed boards 1, 2, and 3. The spacer is jointed with a solder to a terminal electrode pattern of both printed boards sandwiching the spacer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device in which various components are mounted on a circuit board. It relates to the manufacturing method.

[0002]

2. Description of the Related Art Generally, when a plurality of hybrid integrated circuit devices each having various components mounted on a circuit board are stacked in a multilayer manner and integrated with each other, a plurality of hybrid integrated circuit devices are provided between each printed circuit board. It is necessary to provide a gap of appropriate dimensions so that the various components mounted on each do not come into contact with each other.

Therefore, conventionally, for example, when a second-stage printed circuit board is stacked on a first-stage printed circuit board, the lower end of each of at least both left and right portions of the second-stage printed circuit board faces outward. A plurality of bent metal lead terminals are projected downward, and each of the lead terminals is soldered or the like so as to be electrically connected to various terminal electrode patterns on the second-stage printed circuit board. Then, the printed circuit board of the second stage is placed on the upper surface of the printed circuit board of the first stage, and the outward pieces at the lower ends of the lead terminals are connected to various terminals on the printed circuit board of the first stage. The electrode pattern is fixed by soldering or the like.

[0004]

However, as described above,
When the second-stage printed circuit board is mounted on the first-stage printed circuit board via outwardly bent lead terminals fixed to at least the left and right sides of the second-stage printed circuit board, The second-stage printed circuit board stacked on the first-stage printed circuit board is smaller than the first-stage printed circuit board by at least the left and right both sides of the lead terminals bent outward. In other words, the size of each printed circuit board stacked in a multilayer structure must be configured so as to become gradually smaller as the upper printed circuit board, so that the mounting density of various components becomes lower accordingly. was there.

Further, in the conventional structure, when the components mounted on each printed circuit board are increased, the gap between the printed circuit boards must be increased accordingly.
There was also a problem that the overall height was increased, resulting in an increase in size. An object of the present invention is to provide a structure of a multilayer hybrid integrated circuit device which has solved these problems and a method of manufacturing the same.

[0006]

In order to achieve this technical object, the structure of the present invention is a hybrid integrated circuit device formed by stacking a plurality of printed circuit boards on which various components such as electronic components are mounted in a multilayer manner. , A plurality of metal spacers forming gaps between the respective printed circuit boards are disposed in a portion inside the outer peripheral surface of each of the printed circuit boards among the respective printed circuit boards; Is soldered to terminal electrode patterns on both printed circuit boards sandwiching the spacer body. "

Further, the manufacturing method of the present invention includes a method of forming a plurality of terminal electrode patterns on a portion of a plurality of printed circuit boards on which various components such as an electronic component are mounted on a portion inside an outer peripheral surface of both front and back surfaces. Then, a metal spacer body is soldered to each of the terminal electrode patterns on the back surface of each of the printed circuit boards, and then the printed circuit boards are stacked such that each spacer body on the back surface faces downward. And soldering each spacer body to each terminal electrode pattern on the surface of each printed circuit board. "

[0008]

Operation and effect of the present invention
Since each printed circuit board can be connected to each other by a spacer body disposed at a portion inside the outer peripheral surface among the printed circuit boards, the size of each printed circuit board is reduced as in the above-described conventional printed circuit board. Without making it as small
It can be substantially the same, and in some cases, rather, the upper printed circuit board can be made larger.

Therefore, according to the present invention, there is an effect that the mounting density in the multilayer hybrid integrated circuit device can be greatly improved. In particular, as described in claim 2, by forming a through-hole in which a component mounted on the lower or upper printed board is fitted in the upper or lower printed board of each printed board. When a high component is mounted on each printed circuit board, the tall component can be disposed in the through hole, and it is possible to avoid increasing the distance between the printed circuit boards. Therefore, the height dimension of the multilayer hybrid integrated circuit device can be reduced, and the size, weight, and density of the device can be reduced.

Further, as described in claim 3, part or all of each spacer body on each printed circuit board is replaced by:
By arranging in the portion between the various components inside the outer peripheral surface of each printed circuit board, a blank portion between the various components mounted on the printed circuit board can be used for disposing the spacer body. Because it can be used, the width and length dimensions of each printed circuit board can be reduced by that much, further reducing the size and size
In addition to reducing the weight and increasing the density, the circuit pattern that runs between each spacer body and various components on each printed circuit board may be more difficult when the spacer bodies are arranged around the printed circuit board. Is also shorter and easier.

Further, according to the manufacturing method of the present invention, a plurality of printed circuit boards are stacked in advance after soldering a plurality of spacers to the back surface thereof, and the respective spacers are stacked on the lower printed circuit board. Just solder it,
Since the process is simpler than in the conventional case where the lead terminals are fixed to the outer peripheral portion of each printed circuit board, the manufacturing cost can be greatly reduced.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment of the present invention.
An embodiment will be described. In this figure, reference numerals 1, 2, 3
Indicates printed circuit boards stacked in a multilayer shape, and each of these printed circuit boards 1, 2, 3 has various components 4, 5, 6, such as electronic components, mounted thereon, and the printed circuit boards 1, 2, 3, and 6. The first stage printed circuit board 1 of 1, 2, and 3
Has a high component 7 mounted thereon.

The second of the printed circuit boards 1, 2, 3
The first-stage printed circuit board 1 includes the first-stage printed circuit board 1.
A through hole 8 into which the high component 7 fits is formed at a position corresponding to the high component 7 in FIG. At least on the left and right sides of the back surface (lower surface) of each of the printed circuit boards 1, 2, 3 is a metal spacer 9 having a size slightly higher than the height of the various components 3, 4, 5. , 1
A plurality of spacers 9, 10, 11 are arranged so as to be arranged at appropriate intervals along the left and right side surfaces.
Is the back surface (lower surface) of each of the printed circuit boards 1, 2, 3
Are fixed by soldering to various terminal electrode patterns (not shown) formed beforehand (each terminal electrode pattern is formed simultaneously when a circuit pattern is formed on each printed circuit board). .

The third printed circuit board 3 of the printed boards 1, 2, 3 is overlaid on the front surface (upper surface) of the second printed circuit board 2, and the respective spacers on the back surface (lower surface) thereof are arranged. Various terminal electrode patterns (not shown) formed in advance on the surface (upper surface) of the second-stage printed circuit board 2 (these terminal electrode patterns are formed simultaneously when a circuit pattern is formed on the printed circuit board). Is bonded by soldering.

Next, the second-stage printed circuit board 2 and the third-stage printed circuit board 3 are superimposed on the first-stage printed circuit board 1, and the back surface (lower surface) of the second-stage printed circuit board 2
Are connected to various terminal electrode patterns (not shown) formed in advance on the surface (upper surface) of the first-stage printed circuit board 1 (each terminal electrode pattern forms a circuit pattern on the printed circuit board). Are formed at the same time).

In the illustrated embodiment, a main printed circuit board 12 which is larger than the printed circuit boards 1, 2, 3 is used. The printed boards 1, 2, 3 stacked as described above are overlapped, and each spacer body 9 on the back surface (lower surface) of the first-stage printed circuit board 1 is formed in advance on the surface (upper surface) of the main printed circuit board 12. (Not shown) (each terminal electrode pattern is formed at the same time when a circuit pattern is formed on a main printed circuit board) by soldering. ing.

In this case, various components 13 are mounted on the main printed circuit board 12, and a plurality of metallic parts are provided on the back surface (lower surface) of the main printed circuit board 12, similarly to the printed circuit boards 1, 2 and 3. The individual spacer bodies 14 are fixed to terminal electrode patterns (not shown) formed in advance on the back surface (lower surface) of the main printed circuit board 12 by soldering,
Each of the spacers 14 is configured to be joined to a mother printed board 15 of an electric device or the like.

Further, by enlarging the main printed circuit board 12 and stacking the printed circuit boards 1, 2, 3 on the main printed circuit board 12, the entire printed circuit boards 1, 2, 3 are reduced.
As shown by the two-dot chain line, the package can be configured with the synthetic resin 16, so that the entire size of the package with the synthetic resin 16 is prevented from being larger than the main printed circuit board 12. You can.

With this configuration, the printed circuit boards 1, 2, 3 can be connected to each other by the spacers 10, 11 disposed at a portion inside the outer peripheral surface between them. The size of each of the printed circuit boards 1, 2, 3 can be made substantially the same without decreasing the size of the upper printed circuit board as in the conventional case described above. The printed circuit board 2 of the first stage is larger than the printed circuit board 1 of the first stage, and the printed circuit board 3 of the third stage is larger than the printed circuit board 2 of the second stage. You can make it bigger.

The tall components 7 mounted on the first-stage printed circuit board 1 can be fitted into the through holes 8 formed in the second-stage printed circuit board 2, so that the first It is possible to avoid that the distance between the printed circuit board 1 and the second-stage printed circuit board 2 must be increased in accordance with the height of the component 7. The multilayer hybrid integrated circuit device having the above-described configuration is manufactured by a method as described below.

That is, as shown in FIG. 4, a material substrate A set to a size capable of simultaneously producing a plurality of the first-stage printed circuit boards 1 is used. After forming various circuit patterns and terminal electrode patterns at each of the locations, various components are mounted by soldering, and the back surface (lower surface) thereof.
Next, as shown in FIG. 5, each spacer body 9 is fixed by soldering in the same manner as when various components are mounted by soldering. The first-stage printed circuit board 1 is manufactured by cutting each time.

The second-stage printed circuit board 2 and the third-stage printed circuit board 3 are manufactured in the same manner. And
After the third-stage printed circuit board 3 is stacked on the second-stage printed circuit board 2, each spacer body 11 on the back surface (lower surface) is connected to the terminal electrode pattern on the front surface (upper surface) of the second-stage printed circuit board 2. They are joined by soldering. Next, after stacking this on the first-stage printed circuit board 1, each spacer body 10 on the back surface (lower surface) of the second-stage printed circuit board 2 is connected to a terminal on the front surface (upper surface) of the first-stage printed circuit board 1. Bonding is performed by soldering to the electrode pattern.

On the other hand, as shown in FIG. 6, a material substrate B set to a size capable of simultaneously producing a plurality of the main printed circuit boards 12 is used. After forming various circuit patterns and terminal electrode patterns at each location,
Various components are mounted by soldering, and on the back surface (lower surface), as shown in FIG.
When mounting various components by soldering, they are fixed by soldering in the same manner.

Next, as shown in FIG. 8, the printed circuit boards 1, 2, 3 are placed on the surface (upper surface) of the material substrate B for the main printed circuit board 12 in a state of being superposed. Each spacer body 9 on the back surface (lower surface) of the first-stage printed circuit board 1 is joined by soldering to a terminal electrode pattern previously formed on the surface (upper surface) of the main printed circuit board 12, Next, the entirety of the three-layer printed circuit boards 1, 2, 3 is entirely sealed with a package body 16 using a synthetic resin, and then the material substrate B is cut into each of the main printed circuit boards 12. As a result, as shown in FIGS. 1 to 3, a plurality of multilayer hybrid integrated circuit devices each having a large main printed circuit board 12 at the bottom can be simultaneously manufactured at low cost. Kill.

In this case, in another manufacturing method, three printed boards 1, 2, 3 are fixed to each other by soldering and then soldered to each main printed board 12 on the material board B by soldering. Substrate B instead of sticking
, A first-stage printed circuit board 1 is fixed to each main printed circuit board 12, and a second-stage printed circuit board 2 is superposed and fixed on the first-stage printed circuit board 1. Printed circuit board 3 on the third stage
The three printed boards 1, 2, 3 are entirely sealed with a package 16 using a synthetic resin, and then the material board B is cut into each main printed board 12. It is good.

According to this another manufacturing method, the whole manufacturing can be performed as one unit of the material substrate B before the material substrate B is divided into the main printed circuit boards 12. There is an advantage that productivity can be improved. Next, FIG. 9 shows a second embodiment of the present invention. In the second embodiment, a first printed circuit board 1 on which various components 4 are mounted on one or both of upper and lower surfaces, and various components 5 are also mounted on one or both of upper and lower surfaces. The mounted second printed circuit board 2 is mounted on one or both of the upper and lower surfaces with respect to the upper surface of a main printed circuit board 15 having various components 13 mounted thereon and a plurality of spacers 14 provided on the lower surface. A plurality of spacers 9 soldered to the lower surface of the first printed circuit board 1 are soldered to the upper surface of the second printed circuit board 2 while being soldered to the lower surface of the second printed circuit board 2. When stacking the plurality of spacer bodies 10 so as to be soldered to the upper surface of the main printed board 12, each spacer body 9 in the first printed board 1 and the Some or all of the spacer member 10 in the printed circuit board 2 and is obtained by the arrangement say disposed a portion between the various components 4,5,13 of each printed circuit board 1, 2, 12.

The manufacturing method according to the second embodiment is the same as the manufacturing method according to the first embodiment. This second
As in the first embodiment, a part or all of the spacer bodies 9 and 10 connecting the printed boards 1, 2, and 12 are formed inside the outer peripheral surfaces of the printed boards 1, 2, and 12 respectively. By disposing the printed circuit boards 1, 2, and 12 between the various components 4, 5, and 13, a blank portion between the various components 4, 5, and 13 mounted on the printed circuit boards 1, 2, and 13 is removed by the spacer. Since it can be used for arranging the body, the width and length of each of the printed circuit boards 1, 2, 12 can be reduced by that much, and further reduction in size and weight and higher density can be achieved. In each of the printed circuit boards 1, 2, 12, the circuit pattern for routing between the spacers 9, 10 and various components is shorter than when all the spacers 9, 10 are arranged around the printed circuit board. And it becomes simple.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a hybrid integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is an enlarged vertical sectional front view of FIG.

FIG. 3 is a vertical sectional front view of the hybrid integrated circuit device according to the embodiment of the present invention;

FIG. 4 is a perspective view showing a material substrate for manufacturing a printed circuit board in the hybrid integrated circuit device.

FIG. 5 is a perspective view showing a state in which a spacer body is fixed to the material substrate of FIG. 4;

FIG. 6 is a perspective view showing a material substrate for manufacturing a main printed circuit board in the hybrid integrated circuit device.

FIG. 7 is a perspective view showing a state where a spacer body is fixed to the material substrate of FIG. 6;

FIG. 8 is a perspective view showing a state in which a multilayer hybrid integrated circuit device is mounted on the material substrate of FIG. 6;

FIG. 9 is an exploded perspective view of a hybrid integrated circuit device according to a second embodiment of the present invention.

[Explanation of symbols]

1, 2, 3 Printed circuit board 4, 5, 6 part 7 High height part 8 Through hole 9, 10, 11 Spacer body 12 Main printed circuit board 13 Parts 14 Spacer body A Material board for printed circuit board manufacture B Main Material substrate for manufacturing printed circuit boards

Claims (5)

[Claims] 1. A hybrid integrated circuit device comprising a plurality of printed circuit boards on which various components such as electronic components are mounted in a multi-layered form, wherein the printed circuit boards are located between inner sides of an outer peripheral surface of each printed circuit board. , A plurality of metal spacers forming gaps between each printed circuit board are arranged, and the spacers are soldered to terminal electrode patterns on both printed boards sandwiching the spacers. The structure of a multilayer hybrid integrated circuit device characterized by the above-mentioned. 2. A printed circuit board located at an upper stage or a lower stage of each of the printed circuit boards is provided with a through hole through which a component mounted on a printed circuit board located at a lower stage or an upper stage is fitted. 2. The structure of the multilayer hybrid integrated circuit device according to 1. 3. The multilayer hybrid according to claim 1, wherein a part or all of the spacers on each of the printed circuit boards are disposed in a portion between various components inside an outer peripheral surface of each of the printed circuit boards. Structure of an integrated circuit device. 4. A multilayer hybrid integrated circuit device wherein the lowermost printed circuit board of each printed circuit board is enlarged, and each printed circuit board stacked on the lowermost printed circuit board is packaged with a synthetic resin. Structure. 5. A plurality of terminal electrode patterns are formed on the inside of the outer peripheral surface of the front and back surfaces of each of a plurality of printed boards on which various components such as electronic components are mounted. A metal spacer body is soldered to each of the terminal electrode patterns on the back surface, and then the printed circuit boards are stacked so that the spacer bodies on the back surface face down. A method for manufacturing a multilayer hybrid integrated circuit device, comprising: soldering to each terminal electrode pattern on the surface of the multilayer hybrid integrated circuit device.