JP2009224654A - Package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package which enables securing an electronic component mounting area, without fail, facilitates operation of filling an under fill into a gap between the area and the bottom face of the electronic component mounted in the area, and meets the demand for miniaturization. <P>SOLUTION: Another package P2 is mounted on the package P1, and the package P1 includes: a plate package body 2, having a front surface 3 and a back surface 4 of rectangular shapes, in a plan view, and is made of a lamination of a plurality of ceramic layers (insulating materials) s1 and s2; the electronic component mounting area 5 situated at the center of the front surface 3 of the package body 2; and a plurality of projections 8 formed on the peripheral side of the surface 3 of package body 2, that is other than the mounting area 5. Each of the projections 8 is composed of a conductor W, and the like. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a package in which another package is mounted on the upper side, and an electronic component can be easily mounted on the surface of the package, and the package can also be reduced in size.

  The lower layer side and upper layer side ceramic packages having a box shape as a whole and having cavities inside are laminated, and the circuit element mounted on the lower layer ceramic package and the crystal resonator element mounted on the upper layer ceramic package are mutually connected. A crystal oscillator made conductive through electrode pads of both packages to be connected is used. In such a crystal oscillator, when an upper-layer crystal resonator (ceramic package) on which a crystal resonator element is mounted is mounted on a lower-layer ceramic package, in order to prevent a coupling phenomenon between the two packages, When the position of the electrode pad is changed, the directionality is restricted when mounting the crystal resonator.

In order to prevent the coupling phenomenon and to eliminate the restriction of directionality when the crystal resonator (ceramic package) is mounted, two electrode pads and a dummy electrode that are electrically connected to the crystal resonator element on the outer bottom surface of the crystal resonator on the upper layer side There has been proposed a crystal oscillator in which a pad and a ground electrode pad are arranged, and two electrode pads corresponding to the electrode pad and a ground electrode pad are arranged on the upper surface of a lower ceramic package (see Patent Document 1). .
JP 2003-158441 A (pages 1 to 7, FIGS. 1 to 4)

By the way, with the downsizing of the package, it has become more difficult to secure a mounting area for an electronic component to be mounted such as a crystal resonator on the bottom surface of the cavity. Therefore, for example, making the thickness of the side wall surrounding the periphery of the cavity thinner is also being studied. However, in a package formed by laminating a plurality of ceramic layers, the thinning of the side wall surrounding the cavity has a manufacturing limit and may increase the cost.
Furthermore, even if a package with a thin sidewall is obtained, the underfill is sufficient to seal the connecting conductors between the bottom surface of the cavity and the bottom surface of the electronic component mounted above the cavity. There is also a problem that it becomes difficult to sufficiently fill the agent and to effectively perform the cleaning work associated with the mounting.

  The present invention solves the problems described in the background art, can surely secure a mounting area for electronic components, and an underfill agent filling operation is performed between the area and the bottom surface of the electronic component mounted thereon. It is an object of the present invention to provide a package that can be easily made and can be made compact.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problems, the present invention provides a package for mounting an electronic component, wherein the surface on which the electronic component is mounted is a flat surface, and another package is mounted above the peripheral side of the surface. And forming a plurality of convex portions including at least one convex portion made of a conductor for conducting electrical connection.
That is, a package according to the present invention (Claim 1) is a package in which another package is mounted on the upper side, and has a rectangular front surface and back surface in a plan view, and a flat package body made of an insulating material. An electronic component mounting area disposed at a central portion of the surface of the package body, and a plurality of protrusions formed on a peripheral side of the surface of the package body excluding the mounting area. At least one of the parts is made of a conductor.

According to this, the electronic component mounting area is arranged at the center of the surface of the flat package body, and a plurality of convex portions including a convex portion made of at least one conductor are formed on the peripheral side of the surface. Yes. Therefore, even if the package body is reduced in size, the electronic component mounting area can be secured with a sufficient area in the central portion of the surface of the package body, and another package mounted above the package through the convex portion made of a conductor. Can be conducted.
In addition, since a space is located between the plurality of convex portions on the peripheral side of the surface of the package body, the space is used to provide an underscore between the mounting area and the bottom surface of the electronic component mounted thereon. It is possible to sufficiently fill the filling agent or to effectively perform a cleaning operation performed after that. Therefore, it is possible to obtain a package adapted for downsizing and high performance including low profile.

The insulating material constituting the package body is, for example, a high-temperature fired ceramic such as alumina, a low-temperature fired ceramic such as glass-ceramic, or an epoxy resin.
The “peripheral side” refers to a portion of the surface of the package main body excluding the electronic component mounting area that occupies the “central portion”.
Furthermore, the electronic component mounting area is a region filled with an underfill agent filled between the surface of the package body and the bottom surface of the electronic component to be mounted.
Further, the convex portion made of a conductor includes a metallized layer made of W or Mo when the insulating material of the package body is a high-temperature fired ceramic, and in the case of the low-temperature fired ceramic or the resin, Cu or A metallized layer made of Ag or the like is included, and an Ag brazing layer or the like is laminated thereon, and a Ni plating layer and an Au plating layer are covered on the entire surface thereof.

Further, the protrusions other than the conductor are made of ceramic or resin, and in the case of ceramic, formed by printing a plurality of layers of paste made of the same or the same kind of ceramic as the ceramic that forms the package main body. In this case, it is formed by applying or printing the same type of resin as the resin forming the package body.
In addition, the other package is formed on the upper surface of the package main body, on the convex portion made of the conductor and the solder disposed on the other convex portion, and on each of the back surfaces of the other package. It is stacked and mounted so as to be conductive with this package via the terminal electrode. Such another package is not limited to a single package, and includes a plurality of packages that are conductively stacked.

Further, the present invention includes a package (claim 2) in which the height of the convex portion is higher than the height of the electronic component mounted in the mounting area.
According to this, since the height of the plurality of convex portions is higher than the height of the electronic component mounted on the mounting area on the surface of the package body, the electronic component mounted on the package hits the bottom surface of another package and deforms. And can be prevented from being damaged. As a result, the performance of the mounted electronic component can be reliably guaranteed.
The height of the electronic component includes the thicknesses of the terminal electrode on the bottom surface of the electronic component, the solder bonded thereto, and the surface terminal electrode on the package body side.
Further, the electronic component includes an IC element, a crystal resonator, a piezoelectric resonator, and the like.

Furthermore, the present invention includes a package (Claim 3) in which the plurality of convex portions are formed along a pair of opposing sides among the four sides of the surface of the package body.
According to this, among the four sides of the surface of the package main body, a space sandwiched between these convex portions is formed on a pair of sides where a plurality of convex portions are not formed. Thus, an operation of sufficiently filling the underfill agent between the mounting area and the bottom surface of the electronic component mounted thereon can be easily performed.
The present invention also includes a package (claim 4) in which the plurality of convex portions are formed at four corners on the surface of the package body.
According to this, since every four sides of the surface of the package body excluding the vicinity of the four corners, a space is formed between the convex portions standing on both ends of each side. An operation of sufficiently filling the underfill agent between the mounting area and the bottom surface of the electronic component mounted thereon can be easily performed.

In addition, in the present invention, any one of the convex portions made of the conductor is formed on the surface of the package body and is electrically connected to the surface terminal electrode connected to the electronic component mounted in the mounting area. A package (claim 5) is also included.
According to this, since the electronic component mounted in the mounting area of the package and the convex portion made of the conductor are conducted through the surface terminal electrode, the electronic component is mounted separately from the electronic component. It is possible to easily establish conduction with the electronic component.
The convex portion formed of the surface terminal electrode and the conductor is a surface wiring formed on the surface of the package body, which can be conducted through a wiring layer or via conductor formed in the package body. Via, it is possible to conduct.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a perspective view showing a package P1 according to an embodiment of the present invention, another package P2 mounted thereon, and a cover plate L that seals an opening of a cavity 5 of the other package P2. 2 is a partial sectional view taken along line XX in FIG. 1, and FIG. 3 is a vertical sectional view of the package P1.
As shown in FIGS. 1 to 3, the package P <b> 1 is formed by laminating a plurality of ceramic (insulating material) layers s <b> 1 and s <b> 2. The package body 2, the electronic component mounting area 5 disposed at the center of the surface 3, and four (plural) formed at the four corners on the peripheral side of the surface 3 of the package body 2 excluding the mounting area 5 And a convex portion 8.

The ceramic layers s1 and s2 forming the package body 2 are made of a high-temperature fired ceramic such as alumina or a low-temperature fired ceramic such as glass-ceramic. Incidentally, the size of the package body 2 is 3.2 mm × 2.5 mm × 0.5 mm.
In addition, in the electronic component mounting area (hereinafter simply referred to as a mounting area) 5 disposed in the central portion of the package body 2, four surface terminal electrodes 6 connected to electronic components to be mounted later are formed, Four back terminal electrodes 7 are formed in the vicinity of the four corners of the back surface 4 of the package body 2. As shown in FIG. 3, the back surface terminal electrode 7 and the front surface terminal electrode 6 are connected via a via conductor v penetrating the ceramic layers s1 and s2 and a wiring layer 13 formed between the ceramic layers s1 and s2. , They can conduct each other. The front surface terminal electrode 6, the back surface terminal electrode 7, the wiring layer 13, and the via conductor v are made of W, Mo, or an alloy based on one of these.

Further, as shown in FIG. 2, the four convex portions 8 are formed on the surface 3 of the package body 2, and are formed of a metallized layer 9 made of W or Mo, an Ag brazing layer 10 laminated thereon, and these Are formed of conductors of an Ni plating layer 11 and an Au plating layer 12 that are coated on the periphery thereof, and the whole has a substantially rectangular parallelepiped shape. As shown in FIG. 3, the convex portion 8 can be electrically connected to the front surface terminal electrodes 6 and the rear surface terminal electrodes 7 in the mounting area 5 via the via conductors v and the wiring layers 13 penetrating the ceramic layers s1 and s2. It is said that.
As shown in FIG. 3, the height h of each convex portion 8 is the thickness of the surface terminal electrode 6 in the real layer area 5, the solder to be described later on these, and the height of the electronic component mounted via this. And the height of the terminal electrode on the bottom surface is set to be higher than the total height.

As shown in FIG. 1, another package P2 mounted above the package P1 includes a package body 14 having a front surface 15 and a back surface 16, an opening in the front surface 15, and a cavity comprising four side surfaces 19 and a bottom surface 20. 18, terminal electrodes 21 formed at the four corners of the bottom surface 20, and back terminal electrodes 22 formed at the four corners of the back surface 16. On a surface 15 of the package body 14 of another package P2, a metal strip 17 for sealing having a rectangular frame shape in plan view is formed along each side.
The package body 14 is formed by laminating a flat ceramic layer and a rectangular frame ceramic layer. The sealing metal band 17 is made of W or Mo, and after electronic parts are mounted in the cavity 18, the metal band 17 is joined to the metal lid plate L via solder, which will be described later. Is sealed.
Furthermore, as shown in FIG. 4, each terminal electrode 21 and each back terminal electrode 22 can be conducted through via conductors v that penetrate the bottom side of the package body 14.

The lid plate L is made of 42 alloy (Fe-42 wt% Ni), Kovar (Fe-29 wt% Ni-17 wt% Co), 196 alloy (Cu-2.3 wt% Fe-0.03 wt% P), and the like. As shown in FIG. 1, the planar view is a rectangular flat plate.
The packages P1 and P2 as described above are stacked as follows.
As shown in FIG. 4, for example, an electronic component C <b> 1 such as an IC is mounted in the mounting area 5 of the package P <b> 1 via each surface terminal electrode 6 and solder 23.
Next, an underfill agent (not shown) is filled and solidified between the surface 3 in the mounting area 5 and the bottom surface of the electronic component C1, and the connection conductors such as the surface terminal electrode 6 and the solder 23 are sealed from the outside. To do. Since there is a space between the adjacent convex portions 8 and 8 during such filling, the filling operation is facilitated.
On the other hand, in a cavity 18 of another package P2, for example, an electronic component C2 such as a crystal resonator is mounted on each terminal electrode 21 via solder 25.

Next, as shown in FIG. 4, after placing the solder 24 on each convex portion 8 of the package P <b> 1 having the actual layer area 5 on which the electronic component C <b> 1 is mounted and sealed with an underfill agent. As shown by the arrow in FIG. 1, the other package P2 having the cavity 18 in which the electronic component C2 is mounted is mounted. At this time, the height h of each convex portion 8 is the sum of the thickness of each surface terminal electrode 6, the thickness of the solder 23, the height of the electronic component C1, and the thickness of the bottom terminal electrode (not shown). Therefore, the electronic component C1 does not come into contact with the back surface 16 of the package body 14 of another package P2.
Next, as shown in the arrows of FIG. 1 and FIG. 4, the solder 26 is placed on the sealing metal strip 17 of another package P2, and the lid plate F is placed thereon.

Further, as indicated by the arrows in FIG. 4, the solder plates 24 and 26 are melted at a predetermined temperature and then solidified while pressing the cover plate F and the packages P1 and P2 along the thickness direction.
As a result, as shown in FIG. 4, another package P2 is mounted above the package P1, and the electronic parts mounted in the connection conductor portion of the electronic component C1 mounted in the former mounting area 5 or the latter cavity 18 are mounted. A package stack U in which the component C2 is sealed from the outside is manufactured.
In the package laminate U, the electronic components C1 and C2 are connected to the terminal electrodes 6 and 21 of the packages P1 and P2, the via conductors v, the conductor protrusions 8, the wiring layer 13, and the back electrodes 7 and 22, respectively. Thus, conduction with a printed circuit board (not shown) on which the multilayer body U is mounted is possible.

Moreover, according to the lower-layer side package P1 of the present invention, the convex portions 8 higher than the height of the electronic component C1 mounted in the mounting area 5 are provided in the vicinity of the four corners of the peripheral portion on the surface 3 of the package body 2. A space is formed between the projecting and adjacent convex portions 8 and 8. For this reason, an operation of easily filling the underfill agent between the surface 3 in the mounting area 5 and the bottom surface of the electronic component C1 can be performed, and the subsequent cleaning operation can be easily performed. Visual recognition is possible. Further, since a side wall for forming a cavity as in the prior art is not required, the mounting area 5 can be easily secured, and the need for downsizing including a reduction in height can be easily met.
Therefore, according to the packages P1 and P2 and the package stack U including these, the operations of the electronic components C1 and C2 can be accurately performed, so that the reliability can be improved.

The package P1 according to the present invention was manufactured as follows.
First, a two-layer green sheet containing alumina powder was manufactured, and a conductive paste containing W powder was filled in via holes formed at predetermined positions in these to form the unfired via conductor v. Next, the same conductive paste as described above is screen-printed on at least one of the front and back surfaces of the two-layer green sheet, and the unfired terminal electrode 6, wiring layer 13, back terminal electrode 7, and convex A metallized layer 9 of part 8 was formed. Further, these two green sheets were laminated and pressure-bonded, and then fired at a predetermined temperature to obtain the package body 2. Then, after forming the Ag brazing layer 10 on each of the metallized layers 9 located at the four corners on the surface 3 of the package body 2, electrolytic Ni plating and electrolytic Au plating are sequentially applied to these surfaces, and the Ni plating layer 11 is formed. And Au plating layer 12 was covered. As a result, the package P1 of the present invention shown in FIGS. 1 to 3 was obtained.

FIG. 5 is a perspective view showing a package P1a which is a modified form of the package P1. The package P1a includes the same package body 2, a mounting area 5 having a plurality of front surface terminal electrodes 6, and a back surface terminal electrode 7.
As shown in FIG. 5, the package P <b> 1 a has convex portions 8 made of the same conductors at diagonal positions among the four corners on the peripheral side of the surface 3 of the package body 2, and ceramics at another diagonal position. And has a convex portion 29 having the same height as the convex portion 8. The protrusion 29 is fired after printing the same or similar ceramic paste sp of the ceramic layers s1 and s2 constituting the package body 2 around the four corners of the surface 3 of the package body 2 a plurality of times. It is formed with.

FIG. 6 is a perspective view showing a package P1b which is a different modification of the package P1. The package P1b also includes the same package body 2, a mounting area 5 having a plurality of front surface terminal electrodes 6, and a back surface terminal electrode 7.
As shown in FIG. 6, the package P <b> 1 b has the same convex portion 8 near one end of the short side located on the right side of the four corners on the peripheral side of the surface 3 of the package body 2, and near the other end. The projection 29 is made of the same ceramic as described above. On the other hand, along the short side on the left side in FIG. 5 on the surface 3 of the package body 2, there is a convex portion 28 that is rectangular in plan view and has an elongated rectangular shape as a whole. The convex portion 28 is made of a conductor having a cross-sectional structure similar to that of the convex portion 8.

Furthermore, FIG. 7 is a perspective view showing a package P1c which is a different form of the present invention. The package P1c also includes a package body 2 similar to the package P1s, a mounting area 5 having a plurality of front surface terminal electrodes 6, and a back surface terminal electrode 7.
As shown in FIG. 7, the package P1c has a convex portion 28 made of the same conductor as described above along the left short side of the peripheral side of the surface 3 of the package body 2, and the right side short in FIG. Along the side, there is a convex portion 30 that is made of ceramic, has a rectangular shape in plan view, and has an elongated rectangular parallelepiped shape as a whole. The convex portion 30 is also formed by printing the ceramic paste sp on the surface 3 of the package body 2 a plurality of times and then firing it.

FIG. 8 is a perspective view showing a package P1d which is a further different modification of the package P1. The package P1d also includes the same package body 2, a mounting area 5 having a plurality of front surface terminal electrodes 6, and a back surface terminal electrode 7.
As shown in FIG. 8, the package P1d is made of a conductor having the same cross-sectional structure at each of the four peripheral corners on the surface 3 of the package body 2, and has a circular plane and a substantially cylindrical shape as a whole. It has a convex portion 8r.

FIG. 9 is a perspective view showing a package P1e having a further different form.
The package P1e also includes a package body 2 similar to the package P1, a mounting area 5 having a plurality of front surface terminal electrodes 6, and a back surface terminal electrode 7.
As shown in FIG. 9, the package P1e is made of a conductor having the same cross-sectional structure along the short side on the left side of the peripheral side of the surface 3 of the package body 2, and has an elongated oval shape in plan view. And it has the convex part 28r which exhibits the flat oblong body as a whole. On the other hand, each corner (corner) on the right short side has a convex portion 8r made of the same conductor as described above, and a convex portion 29r made of ceramic, having a circular plane and a substantially cylindrical shape as a whole. Yes. The convex portion 29r is also obtained by printing and firing a ceramic paste in the same manner as described above.

Furthermore, FIG. 10 is a perspective view showing a package P1f which is another different form.
The package P1f also includes a package body 2 similar to the package P1, a mounting area 5 having a plurality of front surface terminal electrodes 6, and a back surface terminal electrode 7.
As shown in FIG. 10, the package P1f has a convex portion 28r made of the same conductor along the left short side of the peripheral side of the surface 3 of the package body 2, and has a right side on the short side. Along this, a convex portion 29r made of the same ceramic as described above is provided.

According to the packages P1b to P1f as described above, two to four convex portions 8 and 8r are provided at any one of four corners on the surface 3 of the package body 2 or a pair of short sides facing each other on the surface 3. , 28, 28r, 29, 29r, 30, 30r, and at least one convex portion 8, 8r, 28, 28r is made of a conductor.
Moreover, the height (h) of the convex portions 8r, 28, 28r, 29, 29r, 30, 30r is also set higher than the height of the electronic component C1 mounted in the mounting area 5. Further, since the convex portions 8, 8r, 28, 28r made of a conductor and the surface terminal electrode 6 in the mounting area 5 are electrically connected in the same manner as described above, after mounting the electronic component C1 in the mounting area 5, The underfill agent can be easily filled from between the convex portions 8, 8r, 28, 28r, 29, 29r, 30, 30r, the cleaning operation associated with the mounting can be easily performed, and the inspection is also performed reliably. be able to.
The number of the surface terminal electrodes 6 provided in the mounting area 5 is adjusted according to the number of convex portions made of a conductor. Alternatively, a part of the surface terminal electrode 6 may be electrically independent, and the remaining surface terminal electrode 6 and the convex portion made of a conductor may be the same number.

The present invention is not limited to the package of each form described above.
For example, the package body of the present invention and another package may be made of a low-temperature fired ceramic such as glass-ceramic, or may be made of an epoxy resin or the like. The convex part formed on the peripheral side of the surface of the package body is a convex part mainly made of a conductor such as Cu or Ag, a convex part made of the ceramic, or a convex part made of a resin similar to the above resin. Also, it is possible to achieve the same effect as described above.
In addition, the package body of the present invention and another package may have a form in which the plan view is substantially square (rectangular).

Furthermore, on the surface of the package main body, the surface terminal electrode in the mounting area and the convex portion made of a conductor are electrically connected to each other through a surface wiring layer formed on the surface of the package main body. It is good also as a form.
Further, the package body of another package is also in the form of a flat plate like the package of the present invention, and a plurality of the above-mentioned four corners on the surface or a pair of short sides or long sides facing each other on the surface. It is good also as what formed the same convex part.
In addition, the convex portion is substantially semicircular or substantially D-shaped in plan view, and the arc-shaped curved surface is arranged to face the mounting area side located at the center of the surface of the package body. It is good also as a form.

The perspective view which shows the package of one form by this invention, another package mounted on it, and the cover plate which seals the opening part of the cavity of this another package. The fragmentary sectional view in alignment with the arrow of the XX in FIG. The vertical sectional view of the said package. The vertical sectional view which shows the laminated body which mounted another package on the said package. The perspective view which shows the package which is a deformation | transformation form of the said package. The perspective view which shows the package which is a different deformation | transformation form of the said package. The perspective view which shows the package of a different deformation | transformation form. Furthermore, the perspective view which shows the package which is a different deformation | transformation form. Furthermore, the perspective view which shows the package which is a different form. The perspective view which shows the package which is another different form.

Explanation of symbols

2 ……………………………… Package body 3 ……………………………… Front side 4 ……………………………… Back side 5 ……………… ……………… Mounting area 6 ……………………………… Surface terminal electrode 8,8r, 28,28r ……… Convex part 29,29r, 30,30r… Ceramic (insulation) P1, P1a to P1f ……… Package P2 ………………………… Another package h ……………………………… Height C1, C2 …… ……………… Electronic parts s1, s2 …………………… Ceramic layer (insulating material)

Claims (5)

A package with another package on top,
A flat package body made of an insulating material having a rectangular front surface and back surface in plan view;
An electronic component mounting area disposed at the center of the surface of the package body,
Of the surface of the package body, comprising a plurality of convex portions formed on the peripheral side excluding the mounting area,
Of the plurality of convex portions, at least one is made of a conductor.
Package characterized by that. The height of the convex portion is higher than the height of the electronic component mounted in the mounting area.
The package according to claim 1. The plurality of convex portions are formed along a pair of opposing sides among the four sides of the surface of the package body.
The package according to claim 1 or 2, wherein The plurality of convex portions are formed at four corners on the surface of the package body.
The package according to claim 1 or 2, wherein Any of the convex portions made of the conductor is formed on the surface of the package body, and is electrically connected to the surface terminal electrode connected to the electronic component mounted in the mounting area.
The package according to any one of claims 1 to 4, characterized in that:

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