JP3055483B2 - Hybrid integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit comprising a multilayer printed circuit board on which electronic components are mounted.
In particular, the present invention relates to a hybrid integrated circuit that is suitable for mounting a high-frequency high-output semiconductor element.

[0002]

2. Description of the Related Art As a prior art of a hybrid integrated circuit on which a high-power semiconductor element is mounted, for example, Japanese Utility Model Laid-Open Publication No.
In the publication, as shown in FIG. 4, a part of a conductor layer configured as a ground plane of a multilayer printed wiring board is exposed,
A structure has been proposed in which the ground plane of the semiconductor element and the ground plane of the multilayer printed wiring board are connected by through holes 43, and at the same time, the ground plane of the multilayer printed wiring board and the metal casing 44 are connected by metal bolts 45.

[0003] For example, Japanese Patent Application Laid-Open No. 63-292660 discloses a multi-layer printed wiring board which does not require a radiator requiring a large mounting area and improves the mounting density of electronic components. An exposed portion of the metal base layer is provided on a laminated body obtained by laminating the provided insulating plate and the metal base layer, and an electronic component that generates heat is closely attached to the exposed portion of the metal base layer, so that a multilayer that enhances the heat radiation effect Printed wiring boards have been proposed. FIG. 5 is a perspective view showing a configuration of a multilayer printed wiring board described in the above-mentioned Japanese Patent Application Laid-Open No. 63-292660. Referring to FIG. 5, an exposed portion 56 of a metal base layer is provided on a multilayer printed wiring board 55 having a metal base layer in which an insulating plate provided with a wiring layer and a metal base layer are laminated, and heat is generated in the exposed portion 56. The electronic component 52 to be mounted is closely attached. In the figure, 67 ₁ , 67 ₂ , 68 ₁
To 68 ₇ insulating plate provided with a wiring layer, 69 _1, 69 ₂ is a metal base layer, a metal base layer 96 ₁ on both surfaces or one surface to the metal base layer with a multilayer printed circuit board 65, 69 ₂
Is formed by cutting or the like.

[0004]

However, in such a structure, the core material of the multilayer wiring board is a thin metal plate.
There is a problem that sagging and burrs occur, the periphery of the hole of the wiring board and the through hole rises, the surface smoothness is deteriorated, and the warpage is easily generated.

[0005] As described above, the above-mentioned prior art has the following problems.

(1) The first problem is that when a hybrid integrated circuit in which a high-power semiconductor element is mounted is formed, the semiconductor element cannot sufficiently radiate heat.

The reason is that the connection between the heat sink for heat dissipation of the high-power semiconductor element and the ground plane of the housing is made only through holes passing through the internal insulating layer and the conductor layer of the multilayer printed wiring board. Depending on.

(2) The second problem is that when a hybrid integrated circuit in which a high-frequency semiconductor element is mounted is configured, high-frequency characteristics may deteriorate due to insufficient grounding of the circuit. It is.

The reason is that the connection between the ground plane of the high-frequency semiconductor element and the ground plane of the hybrid integrated circuit is made only by the through-holes, and the effect of the capacitive and inductive loads of the through-holes between the two ground planes. Receive. Also, the number and size of the through holes that can be configured are restricted by the circuit pattern.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a hybrid integrated circuit having a high frequency and a high output, in which the reliability of the circuit is improved by improving the heat dissipation of the circuit. It is an object of the present invention to provide a hybrid integrated circuit having improved high-frequency characteristics by improving grounding characteristics of the integrated circuit.

[0011]

A hybrid integrated circuit according to the present invention, which achieves the above object, comprises a multilayer printed circuit board on which a circuit is formed, an electric component such as a chip resistor and a chip capacitor mounted on the circuit board, and a heat radiator. In a hybrid integrated circuit composed of semiconductor elements assembled in a package having a heat sink, a part of a conductor layer configured as a ground plane of the multilayer printed wiring board is exposed in a stacking direction,
Wherein is the heat sink of the semiconductor element is exposed in said conductor layer
And a structure in which the conductor layer is partially exposed from the back surface of the multilayer printed wiring board and is directly connected to the ground plane of the housing.

[Outline of the Invention] An outline of the present invention will be described below. According to the present invention, the multilayer printed wiring board has a laminated structure in which the ground conductor surface (8 in FIG. 1B) is exposed on the bottom surface (b 'side in FIG. 1B), and It has a structure processed by cutting or the like so that the conductor surface is exposed on the surface (b side in FIG. 1B).

With such a structure, a high-frequency, high-output semiconductor element is assembled into a package (1 in FIG. 1) with a heat sink (7 in FIG. 1B), and the heat sink portion is exposed to the ground conductor surface on the surface. And the same ground conductor surface exposed on the back surface is directly connected to the ground surface (11 in FIG. 1B) of the housing (4 in FIG. 1).

As described above, according to the present invention, a heat sink for heat radiation of a package including a high-frequency high-power semiconductor element is brought into direct contact with a ground conductor surface exposed on a surface formed on a multilayer printed circuit board of a hybrid integrated circuit. A common ground conductor surface, which is laminated and exposed in a step-like shape on the back surface of the multilayer printed wiring board, is attached directly to the ground surface of the housing. The heat sink for heat dissipation of the high-power semiconductor and the ground plane of the housing are directly connected through a common ground conductor surface, and a heat radiation effect close to the state where the heat sink and the ground plane of the housing are directly connected is obtained, and the grounding of the circuit is improved. Be improved.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

[0016]

Embodiment 1 FIG. 1A is a perspective view showing a configuration of an embodiment of the present invention, and FIG. 1B is aa 'of FIG. 1A.
It is a figure which shows the cross section of a line.

Referring to FIG. 1, in a hybrid integrated circuit according to an embodiment of the present invention, a multilayer printed wiring board formed from a plurality of insulating layers and conductive layers, and a circuit formed on a surface conductive layer 10 are provided. It is composed of a pattern 3, a chip component 2 mounted on the circuit pattern 3, and a package 1 on which a high-frequency high-output semiconductor element is mounted.

The ground conductor layer 8 of the multilayer printed wiring board is
It is exposed to a size that allows the package 1 to be fitted by cutting or the like from the front surface (direction b in FIG. 1B).

At the same time, the ground conductor layer 8 is exposed by a laminated structure having a step from the back surface (b 'direction in FIG. 1B).

The package 1 has a structure in which a heat sink 7 for heat radiation is provided on the bottom surface.

Next, the operation (assembly) of the embodiment of the present invention will be described in detail with reference to FIG.

The package 1 on which the high-frequency high-power semiconductor element is mounted is mounted on the surface of a multilayer printed wiring board (b in FIG. 1B).
Direction), and the heat sink 7 is brought into contact with the ground conductor layer 8 for connection. At this time, the lead terminals 9 of the package are brought into contact with and connected to the circuit pattern 3 formed on the surface conductor layer 10. In the hybrid integrated circuit having the above-described configuration, the grounding conductor surface 8 on the bottom surface and the grounding conductor surface 8 laminated and exposed on the step are brought into contact with and connected to the grounding surface 12 of the housing.

The connection between the ground conductor surface on the bottom surface and the bottom conductor and the connection between the ground conductor surface and the ground conductor surface on the bottom surface of the hybrid integrated circuit are made through holes 6.

In order to explain this embodiment in more detail, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, one embodiment of the present invention is:
A circuit pattern 3 is formed on a surface conductor layer 10 of a multilayer printed wiring board formed from a plurality of insulating layers and conductor layers by processing such as etching, and chip components 2 such as chip resistors and chip capacitors are mounted on the pattern. Is configured. In the figure, 4 is a housing, 5 is a package insertion hole (hole), 6 is a through hole, 7 is a heat sink, 8 is a grounding conductor surface, 9 is a lead terminal, 10 is a surface conductor layer, 11
Denotes a ground plane, and 12 denotes a ground conductor plane.

The package 1 on which the high-frequency high-output semiconductor device is mounted has a heat sink 7 on the bottom surface and a lead terminal 9 on the side surface, and is made of ceramic or plastic.

The package 1 is fitted into a portion where the ground conductor surface 8 is exposed by cutting or the like from the surface of the multilayer printed wiring board, and a heat sink 7 is mounted on the ground conductor surface 8 and a lead terminal 9 is mounted on the surface. It is connected to the circuit pattern 3 of the conductor layer 10 and fixed by soldering or the like.

The housing 4 is provided with an insertion pit 5 by processing (for example, drilling a hole) for receiving the hybrid integrated circuit, and the surface of the insertion pit 5 is provided with a conductor surface 12 for grounding.

FIG. 2 is a diagram for explaining a method of manufacturing a hybrid integrated circuit according to one embodiment of the present invention.

Referring to FIG. 2A, first, an insulating layer 22 and a conductive layer 21 having the same dimensions are further provided on one side of a double-sided substrate in which conductive layers 23 and 25 are adhered to both sides of an insulating layer 24 with copper foil or the like. Are bonded with an adhesive such as a pre-plate. At the same time, the insulating layer 26 and the conductor layer 27 each having a size smaller than that of the substrate are bonded in the same manner. Here, a circuit pattern is formed on the conductor layers 21 and 23 by etching or the like.

Next, a through hole 28 (corresponding to 6 in FIG. 1) is formed in the multilayer printed wiring board thus formed.
2B, an insertion hole 29 is formed by cutting or the like on a part of the multilayer printed wiring board in a state where the conductor layer 25 (corresponding to 8 in FIG. 1) is exposed on the surface, as shown in FIG. 2B. .

The package 1 on which the high-frequency high-power semiconductor element is mounted is inserted into the insertion hole 29, and the heat sink 7 for heat radiation of the package 1
Is fixed by soldering or the like so that the contact is made with the circuit pattern surface 21.

In the present embodiment, the hybrid integrated circuit is formed by the steps shown in FIG. 2, and the grounding conductor surface 11 of this hybrid integrated circuit is connected to the ground plane 1 of the housing 4 as shown in FIG.
2 so that it contacts.

In one embodiment of the present invention having such a structure, heat generated from the semiconductor element is dissipated together with heat radiation via the through-holes formed in the ground conductor surface and the bottom surface as described in the prior art. Dissipates heat directly through the ground conductor surface.

[0035]

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along the line bb 'of FIG. 3A.

The circuit arrangement on the surface layer of the multilayer printed circuit board of the hybrid integrated circuit is such that the high-frequency circuit section 3 shown in FIG.
2 and the low-frequency circuit unit 33, the multilayer structure of the multilayer printed wiring board is formed by exposing the ground conductor surface of the high-frequency circuit unit 32 as shown in FIG. through holes of the part 34 _{1-34 4}
There are shorter than the through holes 35 _1, 35 ₂ of the other part.

With the above structure, it is possible to enhance the grounding of the circuit and to reduce the inductance component due to the through hole.

[0038]

As described above, according to the present invention, the following effects can be obtained.

(1) The first effect of the present invention is to improve the heat dissipation of the hybrid integrated circuit. Thereby, the reliability of the hybrid integrated circuit can be improved.

The reason is that, in the present invention, for a semiconductor element which is a heat source of a hybrid integrated circuit, a heat sink of a package is directly connected to a conductor layer serving as a ground plane, and at the same time, this conductor layer is connected to a ground plane of a housing. It is possible to connect.

(2) A second effect of the present invention is that the grounding at high frequencies of the hybrid integrated circuit is improved.
Thereby, the characteristics and performance of the hybrid integrated circuit can be improved.

The reason for this is that, in the present invention, the portion constituting the high-frequency circuit of the hybrid integrated circuit can be directly connected to the grounding surface of the housing by exposing the grounding surface on the bottom surface. by.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of the present invention;
(A) is a perspective view, (B) is a cross-sectional view along the line aa ′ of (A).

FIG. 2 is a diagram for explaining a method of manufacturing a hybrid integrated circuit according to one embodiment of the present invention in the order of steps.

3A and 3B are diagrams showing a configuration of another embodiment of the present invention, in which FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line bb ′ of FIG. 3A.

FIG. 4 is a diagram illustrating an example of a configuration according to the related art.

FIG. 5 is a diagram showing another configuration example of the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package which mounted high frequency high power semiconductor element 2 Chip resistor and chip capacitor 3 Circuit pattern 4 Housing 5 Package insertion resistance 6 Through hole 7 Heat sink 8 Grounding conductor surface 9 Lead terminal 10 Surface conductor layer 11 Grounding surface 12 Grounding conductor surface

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/46 H05K 7/20 H05K 1/18

Claims (5)

(57) [Claims] A multilayer printed wiring board on which a circuit is formed;
In a hybrid integrated circuit including an electric component such as a chip resistor and a chip capacitor mounted on the board and a semiconductor element assembled in a package having a heat sink for heat dissipation, the hybrid integrated circuit is configured as a ground plane of the multilayer printed wiring board. that the part of the conductor layer is exposed in the stacking direction, the heat sink of the semiconductor element is exposed in said conductor layer
A hybrid integrated circuit having a structure in which the conductor layer is directly connected to the ground surface of the housing while being directly connected to the ground surface of the multilayer printed wiring board while partially exposing the conductor layer from the back surface of the multilayer printed wiring board. 2. The hybrid integrated circuit according to claim 1, wherein a circuit portion constituting a high-frequency circuit of the hybrid integrated circuit has a structure in which a conductor layer below the circuit portion is exposed on the surface. . 3. A multilayer printed wiring board having a laminated structure in which a ground conductor surface is partially exposed on a back surface side, and said ground conductor surface is partially exposed on a front surface side. A heat sink is attached so as to directly contact the ground conductor surface exposed on the front surface, and the ground conductor surface exposed on the back surface is directly connected to a ground surface of a housing. A hybrid integrated circuit characterized by: 4. A process for cutting a part of the surface of the multilayer printed wiring board so that the ground conductor surface is exposed,
The back surface has a structure in which the same ground conductor surface as the ground conductor surface partially exposed on the front surface side is exposed on the back surface side by changing the size of the substrate to be laminated. Item 7. The hybrid integrated circuit according to Item 3. 5. A back surface of the multilayer printed wiring board has a step structure, the ground conductor surface exposed on the back surface is directly connected to a ground surface of the housing, and a ground surface of the step portion is connected to the housing. 4. The hybrid integrated circuit according to claim 3, wherein the hybrid integrated circuit is fitted in a groove provided in the body and is connected to a ground plane provided in the groove.