JPH044522B2 - - Google Patents

Info

Publication number
JPH044522B2
JPH044522B2 JP56024329A JP2432981A JPH044522B2 JP H044522 B2 JPH044522 B2 JP H044522B2 JP 56024329 A JP56024329 A JP 56024329A JP 2432981 A JP2432981 A JP 2432981A JP H044522 B2 JPH044522 B2 JP H044522B2
Authority
JP
Japan
Prior art keywords
light
wafer
detector
electron beam
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56024329A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57139607A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP56024329A priority Critical patent/JPS57139607A/ja
Priority to US06/333,295 priority patent/US4589773A/en
Priority to DE19813151800 priority patent/DE3151800A1/de
Publication of JPS57139607A publication Critical patent/JPS57139607A/ja
Publication of JPH044522B2 publication Critical patent/JPH044522B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP56024329A 1981-02-23 1981-02-23 Position measuring equipment Granted JPS57139607A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56024329A JPS57139607A (en) 1981-02-23 1981-02-23 Position measuring equipment
US06/333,295 US4589773A (en) 1981-02-23 1981-12-22 Position detecting system
DE19813151800 DE3151800A1 (de) 1981-02-23 1981-12-29 Anordnung zum ermitteln der lage eines werkstuecks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56024329A JPS57139607A (en) 1981-02-23 1981-02-23 Position measuring equipment

Publications (2)

Publication Number Publication Date
JPS57139607A JPS57139607A (en) 1982-08-28
JPH044522B2 true JPH044522B2 (US06299757-20011009-C00006.png) 1992-01-28

Family

ID=12135136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56024329A Granted JPS57139607A (en) 1981-02-23 1981-02-23 Position measuring equipment

Country Status (3)

Country Link
US (1) US4589773A (US06299757-20011009-C00006.png)
JP (1) JPS57139607A (US06299757-20011009-C00006.png)
DE (1) DE3151800A1 (US06299757-20011009-C00006.png)

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US5218415A (en) * 1988-05-31 1993-06-08 Canon Kabushiki Kaisha Device for optically detecting inclination of a surface
JPH0267903A (ja) * 1988-09-02 1990-03-07 Canon Inc 光量調節装置
JPH032520A (ja) * 1990-04-20 1991-01-08 Hitachi Ltd 位置検出器
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US5179287A (en) * 1990-07-06 1993-01-12 Omron Corporation Displacement sensor and positioner
US5055664A (en) * 1990-08-06 1991-10-08 Eaton Corporation Optical distance measuring system using a position sensitive device and a ramp generator driven light source
US5113082A (en) * 1990-09-11 1992-05-12 Moshe Golberstein Electro-optical instrument with self-contained photometer
DE4039742A1 (de) * 1990-12-08 1992-06-11 Francotyp Postalia Gmbh Fluessigkeitsstrahl-druckvorrichtung fuer frankier- und wertstempelmaschinen
US5311271A (en) * 1992-01-21 1994-05-10 Dme/Golf, Inc. Golf course range finder
US5269070A (en) * 1992-10-19 1993-12-14 Thurston Wm H Instrument for measuring flatness or uniformity of curvature
US6271916B1 (en) * 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5530550A (en) * 1994-12-21 1996-06-25 Tencor Instruments Optical wafer positioning system
US5883710A (en) 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5576831A (en) * 1994-06-20 1996-11-19 Tencor Instruments Wafer alignment sensor
TW299035U (en) * 1994-07-11 1997-02-21 Barmag Barmer Maschf Co Ltd Method of optically measuring the surface of yarn packages
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
ATA107495A (de) * 1995-06-23 1996-06-15 Fercher Adolf Friedrich Dr Kohärenz-biometrie und -tomographie mit dynamischem kohärentem fokus
US5825482A (en) * 1995-09-29 1998-10-20 Kla-Tencor Corporation Surface inspection system with misregistration error correction and adaptive illumination
WO1997026529A1 (en) * 1996-01-19 1997-07-24 Phase Metrics Surface inspection apparatus and method
EP0979398B1 (en) * 1996-06-04 2012-01-04 KLA-Tencor Corporation Optical scanning system for surface inspection
JP4067602B2 (ja) * 1996-12-09 2008-03-26 富士通株式会社 高さ検査方法、それを実施する高さ検査装置
US5923427A (en) * 1997-07-10 1999-07-13 Banner Engineering Corporation Optical triangulation distance sensing system and method using a position sensitive detector and an automatic power controlled light source
US6956644B2 (en) * 1997-09-19 2005-10-18 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US20040057045A1 (en) * 2000-12-21 2004-03-25 Mehdi Vaez-Iravani Sample inspection system
US6201601B1 (en) 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US5929983A (en) * 1997-10-29 1999-07-27 International Business Machines Corporation Optical apparatus for determining the height and tilt of a sample surface
US6118113A (en) * 1998-03-02 2000-09-12 Hibbard; Earl Roger Focusing mirror control system and method for adjusting same
DE19814070B4 (de) * 1998-03-30 2009-07-16 Carl Zeiss Meditec Ag Verfahren und Anordnung zur Kohärenz-Tomographie mit erhöhter Transversalauflösung
EP0950881A3 (de) * 1998-04-17 2000-08-16 NanoPhotonics AG Verfahren und Vorrichtung zur automatischen relativen Justierung von Proben bezüglich eines Ellipsometers
US20050134841A1 (en) * 1998-09-18 2005-06-23 Mehdi Vacz-Iravani Sample inspection system
GB9824986D0 (en) * 1998-11-13 1999-01-06 Isis Innovation Non-contact topographical analysis apparatus and method thereof
DE19855478B4 (de) * 1998-12-01 2006-01-12 Steinbichler Optotechnik Gmbh Verfahren und Vorrichtung zur optischen Erfassung einer Kontrastlinie
JP2000346643A (ja) * 1999-06-09 2000-12-15 Hamamatsu Photonics Kk 光位置検出装置および距離センサ
DE10026830A1 (de) * 2000-05-30 2001-12-06 Zeiss Carl Jena Gmbh Optischer Sensor zur Messung des Abstands und/oder der Neigung einer Fläche
FR2814542B1 (fr) * 2000-09-22 2003-01-03 Schneider Electric Ind Sa Detecteur optique a emission regulee
US7004421B2 (en) * 2002-05-28 2006-02-28 Fuji Photo Film Co., Ltd. Inspection device of winding appearance of tape and improvement processing method for the same
CA2390072C (en) 2002-06-28 2018-02-27 Adrian Gh Podoleanu Optical mapping apparatus with adjustable depth resolution and multiple functionality
JP4072495B2 (ja) * 2003-12-15 2008-04-09 キヤノン株式会社 シート検出装置
DE102004025210B4 (de) * 2004-05-22 2011-07-21 Halang, Wolfgang, Prof. Dr. Dr., 58119 Optischer Analog-Wegsensor
DE102004032822A1 (de) * 2004-07-06 2006-03-23 Micro-Epsilon Messtechnik Gmbh & Co Kg Verfahren zur Verarbeitung von Messwerten
JP4785044B2 (ja) * 2006-01-13 2011-10-05 スタンレー電気株式会社 反射型光学センサ及び測定面の表面粗さ検出方法
KR100844280B1 (ko) 2006-12-26 2008-07-07 한국기초과학지원연구원 투과전자현미경용 홀더의 오차측정 장치 및 방법
NL1036125A1 (nl) * 2007-11-08 2009-05-11 Asml Netherlands Bv Lithographic apparatus and method.
US8638437B2 (en) 2008-02-14 2014-01-28 J.A. Woollam Co., Inc. System and method of aligning a sample
US8064055B2 (en) * 2008-02-14 2011-11-22 J.A. Woollam Co., Inc. System and method of aligning a sample
DE102009040081A1 (de) * 2008-09-04 2010-04-15 Micro-Epsilon Optronic Gmbh Verfahren zur Bewertung von Messwerten eines optischen Abstandssensors
US8983787B1 (en) 2008-12-12 2015-03-17 Martin M. Liphardt Method of evaluating data quality
JP2010185692A (ja) * 2009-02-10 2010-08-26 Hitachi High-Technologies Corp ディスク表面検査装置、その検査システム及びその検査方法
WO2013024102A1 (en) * 2011-08-16 2013-02-21 Leica Geosystems Ag Multi psd-arrangement and circuitry
JP6380160B2 (ja) * 2015-02-25 2018-08-29 三菱電機株式会社 真空ピンセット及び半導体装置の製造方法
US10541109B2 (en) * 2016-07-27 2020-01-21 Battelle Memorial Institute Sensing analytical instrument parameters, specimen characteristics, or both from sparse datasets

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DE1135182B (de) * 1957-10-31 1962-08-23 Zeiss Carl Fa Verfahren und Vorrichtung zur beruehrungsfreien Ermittlung der Abmasse von Gegenstaenden von einem Sollmass
US3909131A (en) * 1974-02-12 1975-09-30 United Technologies Corp Surface gauging by remote image tracking
JPS5593008A (en) * 1979-01-09 1980-07-15 Canon Inc Signal formation unit
US4226536A (en) * 1979-02-23 1980-10-07 Dreyfus Marc G Electro-optical contour measuring system
US4299491A (en) * 1979-12-11 1981-11-10 United Technologies Corporation Noncontact optical gauging system
US4326804A (en) * 1980-02-11 1982-04-27 General Electric Company Apparatus and method for optical clearance determination

Also Published As

Publication number Publication date
DE3151800A1 (de) 1982-09-09
DE3151800C2 (US06299757-20011009-C00006.png) 1987-04-16
US4589773A (en) 1986-05-20
JPS57139607A (en) 1982-08-28

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