JPH0445220B2 - - Google Patents

Info

Publication number
JPH0445220B2
JPH0445220B2 JP60010166A JP1016685A JPH0445220B2 JP H0445220 B2 JPH0445220 B2 JP H0445220B2 JP 60010166 A JP60010166 A JP 60010166A JP 1016685 A JP1016685 A JP 1016685A JP H0445220 B2 JPH0445220 B2 JP H0445220B2
Authority
JP
Japan
Prior art keywords
adhesive
dispensers
arm
dispenser
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60010166A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61171564A (ja
Inventor
Masayuki Seno
Gunji Kanemori
Yoshihiko Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60010166A priority Critical patent/JPS61171564A/ja
Publication of JPS61171564A publication Critical patent/JPS61171564A/ja
Publication of JPH0445220B2 publication Critical patent/JPH0445220B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60010166A 1985-01-22 1985-01-22 接着剤塗布装置 Granted JPS61171564A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60010166A JPS61171564A (ja) 1985-01-22 1985-01-22 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60010166A JPS61171564A (ja) 1985-01-22 1985-01-22 接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPS61171564A JPS61171564A (ja) 1986-08-02
JPH0445220B2 true JPH0445220B2 (enrdf_load_stackoverflow) 1992-07-24

Family

ID=11742694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60010166A Granted JPS61171564A (ja) 1985-01-22 1985-01-22 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPS61171564A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242473U (enrdf_load_stackoverflow) * 1988-09-16 1990-03-23
JPH0831677B2 (ja) * 1993-12-21 1996-03-27 株式会社精工舎 ポッティング装置
US6399425B1 (en) 1998-09-02 2002-06-04 Micron Technology, Inc. Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
KR101594083B1 (ko) 2009-08-04 2016-02-16 한화테크윈 주식회사 전자 부품 제조 장치
KR101132968B1 (ko) 2009-12-15 2012-04-20 세크론 주식회사 접착제 도포 장치

Also Published As

Publication number Publication date
JPS61171564A (ja) 1986-08-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term