JPH0444425B2 - - Google Patents
Info
- Publication number
- JPH0444425B2 JPH0444425B2 JP62322036A JP32203687A JPH0444425B2 JP H0444425 B2 JPH0444425 B2 JP H0444425B2 JP 62322036 A JP62322036 A JP 62322036A JP 32203687 A JP32203687 A JP 32203687A JP H0444425 B2 JPH0444425 B2 JP H0444425B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- dam bar
- mold
- external
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32203687A JPS63296256A (ja) | 1987-12-18 | 1987-12-18 | 樹脂封止型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32203687A JPS63296256A (ja) | 1987-12-18 | 1987-12-18 | 樹脂封止型半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57147459A Division JPS5936955A (ja) | 1982-08-25 | 1982-08-25 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63296256A JPS63296256A (ja) | 1988-12-02 |
| JPH0444425B2 true JPH0444425B2 (nl) | 1992-07-21 |
Family
ID=18139205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32203687A Granted JPS63296256A (ja) | 1987-12-18 | 1987-12-18 | 樹脂封止型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63296256A (nl) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5070039A (en) * | 1989-04-13 | 1991-12-03 | Texas Instruments Incorporated | Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal |
| KR19990001715A (ko) * | 1997-06-17 | 1999-01-15 | 윤종용 | 개선된 리드프레임 및 이를 이용한 반도체 패키지 제조방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5461874A (en) * | 1977-10-14 | 1979-05-18 | Plessey Inc | Punching lead frame for semiconductor package |
| JPS5737865A (en) * | 1980-08-20 | 1982-03-02 | Nec Corp | Lead frame for integrated circuit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4878764U (nl) * | 1971-12-28 | 1973-09-27 | ||
| JPS5277654U (nl) * | 1975-12-09 | 1977-06-09 |
-
1987
- 1987-12-18 JP JP32203687A patent/JPS63296256A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5461874A (en) * | 1977-10-14 | 1979-05-18 | Plessey Inc | Punching lead frame for semiconductor package |
| JPS5737865A (en) * | 1980-08-20 | 1982-03-02 | Nec Corp | Lead frame for integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63296256A (ja) | 1988-12-02 |
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