JPH0444425B2 - - Google Patents

Info

Publication number
JPH0444425B2
JPH0444425B2 JP62322036A JP32203687A JPH0444425B2 JP H0444425 B2 JPH0444425 B2 JP H0444425B2 JP 62322036 A JP62322036 A JP 62322036A JP 32203687 A JP32203687 A JP 32203687A JP H0444425 B2 JPH0444425 B2 JP H0444425B2
Authority
JP
Japan
Prior art keywords
resin
dam bar
mold
external
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62322036A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63296256A (ja
Inventor
Yoshiharu Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP32203687A priority Critical patent/JPS63296256A/ja
Publication of JPS63296256A publication Critical patent/JPS63296256A/ja
Publication of JPH0444425B2 publication Critical patent/JPH0444425B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP32203687A 1987-12-18 1987-12-18 樹脂封止型半導体装置の製造方法 Granted JPS63296256A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32203687A JPS63296256A (ja) 1987-12-18 1987-12-18 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32203687A JPS63296256A (ja) 1987-12-18 1987-12-18 樹脂封止型半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57147459A Division JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS63296256A JPS63296256A (ja) 1988-12-02
JPH0444425B2 true JPH0444425B2 (enrdf_load_stackoverflow) 1992-07-21

Family

ID=18139205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32203687A Granted JPS63296256A (ja) 1987-12-18 1987-12-18 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS63296256A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5070039A (en) * 1989-04-13 1991-12-03 Texas Instruments Incorporated Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
KR19990001715A (ko) * 1997-06-17 1999-01-15 윤종용 개선된 리드프레임 및 이를 이용한 반도체 패키지 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4878764U (enrdf_load_stackoverflow) * 1971-12-28 1973-09-27
JPS5277654U (enrdf_load_stackoverflow) * 1975-12-09 1977-06-09
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages
JPS5737865A (en) * 1980-08-20 1982-03-02 Nec Corp Lead frame for integrated circuit

Also Published As

Publication number Publication date
JPS63296256A (ja) 1988-12-02

Similar Documents

Publication Publication Date Title
US5359761A (en) Method of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a terminal frame
JPH0371785B2 (enrdf_load_stackoverflow)
JPH0444425B2 (enrdf_load_stackoverflow)
JPH08167687A (ja) 光結合素子用リードフレーム及びこれを用いた光結合素子の製造方法
JPS60261163A (ja) リードフレームの製造方法
JP2001217270A (ja) 電子部品の製造方法及び製造装置
JPH05299455A (ja) 半導体装置の製造方法
EP0535882B1 (en) Method of processing a semiconductor chip package
JP2866816B2 (ja) リードフレーム
JP2826508B2 (ja) 半導体装置の製造装置
JPS5921050A (ja) 半導体装置の製造方法
JPH11330112A (ja) 半導体装置の製造方法およびトランスファモールド装置
JPS63302545A (ja) 樹脂封止型半導体リ−ドフレ−ム
JP3566812B2 (ja) 半導体装置の製造方法
JPH0493057A (ja) 電子部品用リードフレーム及びこれを用いた電子部品の製造方法
JPH0722561A (ja) 半導体装置用リードフレーム及びこれを用いた半導体装置の製造方法
JPS6150379B2 (enrdf_load_stackoverflow)
JPS63293022A (ja) モ−ルド方法およびその方法に用いるモ−ルド型
JPH04324970A (ja) 半導体装置のリードフレームの製造方法
JPH0464256A (ja) 半導体装置の製造方法
JPH08124950A (ja) 半導体装置の製造方法
JPH02205061A (ja) リードフレーム
JPH05291327A (ja) 半導体装置の製造方法
JPS61215028A (ja) モ−ルド金型およびそれを用いた半導体装置の製造方法
JPH0368162A (ja) リード切断方法