JPH044398Y2 - - Google Patents

Info

Publication number

JPH044398Y2

JPH044398Y2 JP6498386U JP6498386U JPH044398Y2 JP H044398 Y2 JPH044398 Y2 JP H044398Y2 JP 6498386 U JP6498386 U JP 6498386U JP 6498386 U JP6498386 U JP 6498386U JP H044398 Y2 JPH044398 Y2 JP H044398Y2

Authority

JP

Japan

Prior art keywords

electrode

back electrode

thin film

transparent

insulating layer

Prior art date

1986-04-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000000758 substrate Substances 0.000 claims description 28
• 239000010409 thin film Substances 0.000 claims description 25
• 238000000605 extraction Methods 0.000 claims description 22
• 239000007769 metal material Substances 0.000 claims description 16
• 230000008018 melting Effects 0.000 claims description 14
• 238000002844 melting Methods 0.000 claims description 14
• 239000000956 alloy Substances 0.000 claims description 12
• 229910045601 alloy Inorganic materials 0.000 claims description 12
• 239000007772 electrode material Substances 0.000 claims description 2
• 239000010410 layer Substances 0.000 description 26
• 230000015556 catabolic process Effects 0.000 description 20
• 239000011521 glass Substances 0.000 description 19
• 239000000463 material Substances 0.000 description 7
• 239000011159 matrix material Substances 0.000 description 7
• 239000006059 cover glass Substances 0.000 description 6
• 230000002093 peripheral effect Effects 0.000 description 5
• 238000007740 vapor deposition Methods 0.000 description 5
• 230000008020 evaporation Effects 0.000 description 4
• 238000001704 evaporation Methods 0.000 description 4
• 239000010408 film Substances 0.000 description 4
• 239000011295 pitch Substances 0.000 description 4
• 238000004544 sputter deposition Methods 0.000 description 4
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 229910052782 aluminium Inorganic materials 0.000 description 2
• 229910052797 bismuth Inorganic materials 0.000 description 2
• 229910052793 cadmium Inorganic materials 0.000 description 2
• 230000006378 damage Effects 0.000 description 2
• 238000000151 deposition Methods 0.000 description 2
• 229910052745 lead Inorganic materials 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 238000012986 modification Methods 0.000 description 2
• 230000004048 modification Effects 0.000 description 2
• 229910052718 tin Inorganic materials 0.000 description 2
• 229910052719 titanium Inorganic materials 0.000 description 2
• 229910052725 zinc Inorganic materials 0.000 description 2
• 229910052804 chromium Inorganic materials 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000002474 experimental method Methods 0.000 description 1
• 239000012530 fluid Substances 0.000 description 1
• 230000004927 fusion Effects 0.000 description 1
• 229910052738 indium Inorganic materials 0.000 description 1
• 238000002347 injection Methods 0.000 description 1
• 239000007924 injection Substances 0.000 description 1
• 238000010030 laminating Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 230000001681 protective effect Effects 0.000 description 1
• 229920002545 silicone oil Polymers 0.000 description 1
• 239000002356 single layer Substances 0.000 description 1
• 239000007779 soft material Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000009966 trimming Methods 0.000 description 1