JPH0443565B2 - - Google Patents
Info
- Publication number
- JPH0443565B2 JPH0443565B2 JP28154085A JP28154085A JPH0443565B2 JP H0443565 B2 JPH0443565 B2 JP H0443565B2 JP 28154085 A JP28154085 A JP 28154085A JP 28154085 A JP28154085 A JP 28154085A JP H0443565 B2 JPH0443565 B2 JP H0443565B2
- Authority
- JP
- Japan
- Prior art keywords
- camera body
- flexible
- printed circuit
- circuit board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001971 elastomer Polymers 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Camera Bodies And Camera Details Or Accessories (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28154085A JPS62141525A (ja) | 1985-12-14 | 1985-12-14 | カメラに対するフレキシブルプリント基板の実装構造 |
| US06/938,998 US4711548A (en) | 1985-12-14 | 1986-12-08 | Assembly structure of printed circuit boards for camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28154085A JPS62141525A (ja) | 1985-12-14 | 1985-12-14 | カメラに対するフレキシブルプリント基板の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62141525A JPS62141525A (ja) | 1987-06-25 |
| JPH0443565B2 true JPH0443565B2 (OSRAM) | 1992-07-17 |
Family
ID=17640597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28154085A Granted JPS62141525A (ja) | 1985-12-14 | 1985-12-14 | カメラに対するフレキシブルプリント基板の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62141525A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2541968B2 (ja) * | 1987-03-26 | 1996-10-09 | オリンパス光学工業株式会社 | カメラの電気実装ユニツト |
-
1985
- 1985-12-14 JP JP28154085A patent/JPS62141525A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62141525A (ja) | 1987-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2846751B2 (ja) | 回路基板に対するフレキシブルケーブルの接続装置 | |
| US4711548A (en) | Assembly structure of printed circuit boards for camera | |
| US4894022A (en) | Solderless surface mount card edge connector | |
| JP3925615B2 (ja) | 半導体モジュール | |
| JPH0334388A (ja) | 圧着プリント配線板モジュール | |
| JP2013540371A5 (OSRAM) | ||
| CN209710612U (zh) | 一种多层电路板结构和终端设备 | |
| US6739878B1 (en) | Pressure point contact for flexible cable | |
| US5708568A (en) | Electronic module with low impedance ground connection using flexible circuits | |
| JP2002063952A (ja) | 圧縮コネクタ | |
| JPH0443565B2 (OSRAM) | ||
| JPH0443564B2 (OSRAM) | ||
| JPH0435092A (ja) | 多層配線基板およびその製造方法 | |
| JPH0521266Y2 (OSRAM) | ||
| JPH0119413Y2 (OSRAM) | ||
| JPH05315721A (ja) | プリント配線板およびそのコネクタ | |
| JPH01208892A (ja) | フレキシブルプリント配線板の接続構造 | |
| JP3056185B1 (ja) | エラストマコネクタ | |
| JPS6311772Y2 (OSRAM) | ||
| JP3456186B2 (ja) | 電気接続箱 | |
| JP2004531037A (ja) | 電子デバイス用の電気的接続装置 | |
| JPS6023903Y2 (ja) | 電気接続体 | |
| JPH0552075B2 (OSRAM) | ||
| JPH0140132Y2 (OSRAM) | ||
| JP2001185837A (ja) | 配線基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |