JPH0442136B2 - - Google Patents
Info
- Publication number
- JPH0442136B2 JPH0442136B2 JP60015526A JP1552685A JPH0442136B2 JP H0442136 B2 JPH0442136 B2 JP H0442136B2 JP 60015526 A JP60015526 A JP 60015526A JP 1552685 A JP1552685 A JP 1552685A JP H0442136 B2 JPH0442136 B2 JP H0442136B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- peeling
- index table
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 79
- 238000001514 detection method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015526A JPS61178172A (ja) | 1985-01-31 | 1985-01-31 | ウエハ−の自動剥離装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015526A JPS61178172A (ja) | 1985-01-31 | 1985-01-31 | ウエハ−の自動剥離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61178172A JPS61178172A (ja) | 1986-08-09 |
| JPH0442136B2 true JPH0442136B2 (pt) | 1992-07-10 |
Family
ID=11891250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60015526A Granted JPS61178172A (ja) | 1985-01-31 | 1985-01-31 | ウエハ−の自動剥離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61178172A (pt) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2599712B2 (ja) * | 1987-03-28 | 1997-04-16 | 三菱マテリアル株式会社 | ウエーハ剥離装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
| JPS58223561A (ja) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | ポリツシングマシン |
-
1985
- 1985-01-31 JP JP60015526A patent/JPS61178172A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
| JPS58223561A (ja) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | ポリツシングマシン |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61178172A (ja) | 1986-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |