JPH0440426B2 - - Google Patents

Info

Publication number
JPH0440426B2
JPH0440426B2 JP58130892A JP13089283A JPH0440426B2 JP H0440426 B2 JPH0440426 B2 JP H0440426B2 JP 58130892 A JP58130892 A JP 58130892A JP 13089283 A JP13089283 A JP 13089283A JP H0440426 B2 JPH0440426 B2 JP H0440426B2
Authority
JP
Japan
Prior art keywords
plating
polybutylene terephthalate
particle size
titanium dioxide
average particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58130892A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6024379A (ja
Inventor
Seiichi Nakamura
Kiichi Yonetani
Shunei Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP58130892A priority Critical patent/JPS6024379A/ja
Publication of JPS6024379A publication Critical patent/JPS6024379A/ja
Publication of JPH0440426B2 publication Critical patent/JPH0440426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
JP58130892A 1983-07-20 1983-07-20 表面金属化ポリブチレンテレフタレート樹脂成形品の製法 Granted JPS6024379A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58130892A JPS6024379A (ja) 1983-07-20 1983-07-20 表面金属化ポリブチレンテレフタレート樹脂成形品の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58130892A JPS6024379A (ja) 1983-07-20 1983-07-20 表面金属化ポリブチレンテレフタレート樹脂成形品の製法

Publications (2)

Publication Number Publication Date
JPS6024379A JPS6024379A (ja) 1985-02-07
JPH0440426B2 true JPH0440426B2 (enrdf_load_stackoverflow) 1992-07-02

Family

ID=15045148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58130892A Granted JPS6024379A (ja) 1983-07-20 1983-07-20 表面金属化ポリブチレンテレフタレート樹脂成形品の製法

Country Status (1)

Country Link
JP (1) JPS6024379A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836267A (enrdf_load_stackoverflow) * 1971-09-13 1973-05-28
JPS5929309B2 (ja) * 1975-07-16 1984-07-19 松下電工株式会社 表面処理用基材の製法

Also Published As

Publication number Publication date
JPS6024379A (ja) 1985-02-07

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