JPH0439226B2 - - Google Patents

Info

Publication number
JPH0439226B2
JPH0439226B2 JP61109932A JP10993286A JPH0439226B2 JP H0439226 B2 JPH0439226 B2 JP H0439226B2 JP 61109932 A JP61109932 A JP 61109932A JP 10993286 A JP10993286 A JP 10993286A JP H0439226 B2 JPH0439226 B2 JP H0439226B2
Authority
JP
Japan
Prior art keywords
oxide film
etching
thickness
scribe line
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61109932A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62265727A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP61109932A priority Critical patent/JPS62265727A/ja
Publication of JPS62265727A publication Critical patent/JPS62265727A/ja
Publication of JPH0439226B2 publication Critical patent/JPH0439226B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
JP61109932A 1986-05-14 1986-05-14 Ｉｃ部品の製造方法 Granted JPS62265727A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61109932A JPS62265727A (ja) 1986-05-14 1986-05-14 Ｉｃ部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61109932A JPS62265727A (ja) 1986-05-14 1986-05-14 Ｉｃ部品の製造方法

Publications (2)

Publication Number Publication Date
JPS62265727A JPS62265727A (ja) 1987-11-18
JPH0439226B2 true JPH0439226B2 (enFirst) 1992-06-26

Family

ID=14522763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61109932A Granted JPS62265727A (ja) 1986-05-14 1986-05-14 Ｉｃ部品の製造方法

Country Status (1)

Country Link
JP (1) JPS62265727A (enFirst)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5622899A (en) * 1996-04-22 1997-04-22 Taiwan Semiconductor Manufacturing Company Ltd. Method of fabricating semiconductor chips separated by scribe lines used for endpoint detection

Also Published As

Publication number Publication date
JPS62265727A (ja) 1987-11-18

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