JPH0438828B2 - - Google Patents
Info
- Publication number
- JPH0438828B2 JPH0438828B2 JP8204087A JP8204087A JPH0438828B2 JP H0438828 B2 JPH0438828 B2 JP H0438828B2 JP 8204087 A JP8204087 A JP 8204087A JP 8204087 A JP8204087 A JP 8204087A JP H0438828 B2 JPH0438828 B2 JP H0438828B2
- Authority
- JP
- Japan
- Prior art keywords
- content
- ingot
- electrical
- alloy
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- 239000000956 alloy Substances 0.000 claims description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005266 casting Methods 0.000 claims description 10
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 229910052726 zirconium Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000001556 precipitation Methods 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000005098 hot rolling Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 229910052719 titanium Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910006732 Si—Sn—Zn Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910006776 Si—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8204087A JPS63247320A (ja) | 1987-04-02 | 1987-04-02 | 電気・電子部品用銅合金の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8204087A JPS63247320A (ja) | 1987-04-02 | 1987-04-02 | 電気・電子部品用銅合金の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63247320A JPS63247320A (ja) | 1988-10-14 |
| JPH0438828B2 true JPH0438828B2 (enrdf_load_stackoverflow) | 1992-06-25 |
Family
ID=13763406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8204087A Granted JPS63247320A (ja) | 1987-04-02 | 1987-04-02 | 電気・電子部品用銅合金の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63247320A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2797846B2 (ja) * | 1992-06-11 | 1998-09-17 | 三菱伸銅株式会社 | 樹脂封止型半導体装置のＣｕ合金製リードフレーム材 |
| JP4556841B2 (ja) * | 2005-10-27 | 2010-10-06 | 日立電線株式会社 | 曲げ加工性に優れる高強度銅合金材およびその製造方法 |
| CN109022962B (zh) * | 2018-07-24 | 2019-12-24 | 东北轻合金有限责任公司 | 一种航空用铝合金扁铸锭及其制造方法 |
-
1987
- 1987-04-02 JP JP8204087A patent/JPS63247320A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63247320A (ja) | 1988-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |