JPH0437555B2 - - Google Patents

Info

Publication number
JPH0437555B2
JPH0437555B2 JP62205343A JP20534387A JPH0437555B2 JP H0437555 B2 JPH0437555 B2 JP H0437555B2 JP 62205343 A JP62205343 A JP 62205343A JP 20534387 A JP20534387 A JP 20534387A JP H0437555 B2 JPH0437555 B2 JP H0437555B2
Authority
JP
Japan
Prior art keywords
circuit board
pin
electrical
substrate
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62205343A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63138677A (ja
Inventor
Patoritsuku Shinpuson Jon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63138677A publication Critical patent/JPS63138677A/ja
Publication of JPH0437555B2 publication Critical patent/JPH0437555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
JP62205343A 1986-11-24 1987-08-20 電気的組立体 Granted JPS63138677A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US934297 1986-11-24
US06/934,297 US4764848A (en) 1986-11-24 1986-11-24 Surface mounted array strain relief device

Publications (2)

Publication Number Publication Date
JPS63138677A JPS63138677A (ja) 1988-06-10
JPH0437555B2 true JPH0437555B2 (US06252093-20010626-C00008.png) 1992-06-19

Family

ID=25465318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62205343A Granted JPS63138677A (ja) 1986-11-24 1987-08-20 電気的組立体

Country Status (4)

Country Link
US (1) US4764848A (US06252093-20010626-C00008.png)
EP (1) EP0268953B1 (US06252093-20010626-C00008.png)
JP (1) JPS63138677A (US06252093-20010626-C00008.png)
DE (1) DE3789938T2 (US06252093-20010626-C00008.png)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
GB8706610D0 (en) * 1987-03-19 1987-04-23 Smith Ind Plc Electrical components
FI89842C (fi) * 1989-04-12 1993-11-25 Nokia Mobira Oy Fjaedrande kontaktdon foer radiofrekventa signaler
FI84948C (fi) * 1989-04-12 1992-02-10 Nokia Mobira Oy Ytkontaktdon foer radiofrekventa signaler.
JPH088131B2 (ja) * 1989-08-25 1996-01-29 矢崎総業株式会社 可撓端子付フィルタコネクタ
JPH03124010A (ja) * 1989-10-08 1991-05-27 Murata Mfg Co Ltd 電子部品の端子
MY105486A (en) * 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
US5274099A (en) * 1989-12-20 1993-12-28 Aktiebolaget Hassle Therapeutically active fluoro substituted benzimidazoles
US5211565A (en) * 1990-11-27 1993-05-18 Cray Research, Inc. High density interconnect apparatus
DE4119741C1 (US06252093-20010626-C00008.png) * 1991-06-15 1992-11-12 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
US5237743A (en) * 1992-06-19 1993-08-24 International Business Machines Corporation Method of forming a conductive end portion on a flexible circuit member
US5248262A (en) * 1992-06-19 1993-09-28 International Business Machines Corporation High density connector
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
JP2739031B2 (ja) * 1992-12-08 1998-04-08 三菱電機株式会社 半導体装置用ソケット
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US6023103A (en) * 1994-11-15 2000-02-08 Formfactor, Inc. Chip-scale carrier for semiconductor devices including mounted spring contacts
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US5983493A (en) * 1993-11-16 1999-11-16 Formfactor, Inc. Method of temporarily, then permanently, connecting to a semiconductor device
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US6848173B2 (en) 1994-07-07 2005-02-01 Tessera, Inc. Microelectric packages having deformed bonded leads and methods therefor
US6429112B1 (en) * 1994-07-07 2002-08-06 Tessera, Inc. Multi-layer substrates and fabrication processes
KR100408948B1 (ko) * 1994-11-15 2004-04-03 폼팩터, 인크. 전자부품을 회로기판에 장착하는 방법
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5608966A (en) * 1994-12-14 1997-03-11 International Business Machines Corporation Process for manufacture of spring contact elements and assembly thereof
US5611696A (en) * 1994-12-14 1997-03-18 International Business Machines Corporation High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE)
US5537738A (en) * 1995-02-10 1996-07-23 Micron Display Technology Inc. Methods of mechanical and electrical substrate connection
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6000126A (en) * 1996-03-29 1999-12-14 General Dynamics Information Systems, Inc. Method and apparatus for connecting area grid arrays to printed wire board
US5989939A (en) * 1996-12-13 1999-11-23 Tessera, Inc. Process of manufacturing compliant wirebond packages
US6215196B1 (en) * 1997-06-30 2001-04-10 Formfactor, Inc. Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals
US6724203B1 (en) 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
GB2342509A (en) * 1998-10-05 2000-04-12 Standex Int Corp Surface mount reed switch having transverse feet formed from leads
JP4579361B2 (ja) * 1999-09-24 2010-11-10 軍生 木本 接触子組立体
US6545226B2 (en) * 2001-05-31 2003-04-08 International Business Machines Corporation Printed wiring board interposer sub-assembly
US20030070836A1 (en) * 2001-10-12 2003-04-17 Quint David W. PGA chip package and process for same
US20040000428A1 (en) * 2002-06-26 2004-01-01 Mirng-Ji Lii Socketless package to circuit board assemblies and methods of using same
US20050133928A1 (en) * 2003-12-19 2005-06-23 Howard Gregory E. Wire loop grid array package
DE102004021991B4 (de) * 2004-05-03 2006-06-14 Miele & Cie. Kg Elektronikgehäuse mit Steuerplatine für ein Haushaltgerät
US20060197232A1 (en) * 2005-02-25 2006-09-07 National University Of Singapore Planar microspring integrated circuit chip interconnection to next level
JP4988363B2 (ja) * 2007-01-24 2012-08-01 日立オートモティブシステムズ株式会社 トルクセンサ
EP2385910B2 (en) * 2009-01-06 2023-03-15 Johnson Controls Technology Company Headliner with integral wire harness

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511707B2 (US06252093-20010626-C00008.png) * 1972-04-15 1980-03-27
JPS6188471A (ja) * 1984-10-05 1986-05-06 松下電器産業株式会社 コネクタ−

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368114A (en) * 1965-07-06 1968-02-06 Radiation Inc Microelectronic circuit packages with improved connection structure
US3517438A (en) * 1966-05-12 1970-06-30 Ibm Method of packaging a circuit module and joining same to a circuit substrate
DE2119567C2 (de) * 1970-05-05 1983-07-14 International Computers Ltd., London Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung
US3877064A (en) * 1974-02-22 1975-04-08 Amp Inc Device for connecting leadless integrated circuit packages to a printed-circuit board
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US4155615A (en) * 1978-01-24 1979-05-22 Amp Incorporated Multi-contact connector for ceramic substrate packages and the like
JPS5511707U (US06252093-20010626-C00008.png) * 1978-07-10 1980-01-25
US4272140A (en) * 1979-12-19 1981-06-09 Gte Automatic Electric Laboratories Incorporated Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
US4634199A (en) * 1985-01-22 1987-01-06 Itt Corporation Connector assembly for making multiple connections in a thin space
JPS6273650A (ja) * 1985-09-27 1987-04-04 Hitachi Ltd 電気部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511707B2 (US06252093-20010626-C00008.png) * 1972-04-15 1980-03-27
JPS6188471A (ja) * 1984-10-05 1986-05-06 松下電器産業株式会社 コネクタ−

Also Published As

Publication number Publication date
US4764848A (en) 1988-08-16
DE3789938T2 (de) 1994-12-01
JPS63138677A (ja) 1988-06-10
EP0268953B1 (en) 1994-06-01
EP0268953A3 (en) 1990-03-14
EP0268953A2 (en) 1988-06-01
DE3789938D1 (de) 1994-07-07

Similar Documents

Publication Publication Date Title
JPH0437555B2 (US06252093-20010626-C00008.png)
US5210939A (en) Lead grid array integrated circuit
US5367435A (en) Electronic package structure and method of making same
US5491597A (en) Gimbal flexure and electrical interconnect assembly
US8232632B2 (en) Composite contact for fine pitch electrical interconnect assembly
JP4658772B2 (ja) 集積回路パッケージを製造する方法
KR970011620B1 (ko) 집적회로 칩 캐리어
US6224396B1 (en) Compliant, surface-mountable interposer
US6086386A (en) Flexible connectors for microelectronic elements
US4827611A (en) Compliant S-leads for chip carriers
JP4703942B2 (ja) ランド・グリッド・アレイ・コネクタのためのキャリア
US6663399B2 (en) Surface mount attachable land grid array connector and method of forming same
JP3162677B2 (ja) 多点導電シート
US5610436A (en) Surface mount device with compensation for thermal expansion effects
JP4528245B2 (ja) 集積回路パッケージ
JP2010040253A (ja) コネクタ及び該コネクタを備えた電子部品
JP4528246B2 (ja) マルチチップ集積回路パッケージ
JP2006080556A5 (US06252093-20010626-C00008.png)
JP4988132B2 (ja) 低コストかつ高信頼性適用のための高信頼性インタポーザ
US6339534B1 (en) Compliant leads for area array surface mounted components
US6200141B1 (en) Land grid array connector
US20040127072A1 (en) Connector efficiently forming a standoff region
JP2811295B2 (ja) 垂直型プローブカード
US6459592B1 (en) Circuit assembly including VLSI package
US10985480B2 (en) Transformation connector