JPH04367091A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH04367091A JPH04367091A JP3142071A JP14207191A JPH04367091A JP H04367091 A JPH04367091 A JP H04367091A JP 3142071 A JP3142071 A JP 3142071A JP 14207191 A JP14207191 A JP 14207191A JP H04367091 A JPH04367091 A JP H04367091A
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- card
- bending
- dam
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000000565 sealant Substances 0.000 claims description 13
- 230000002265 prevention Effects 0.000 claims description 6
- 238000005452 bending Methods 0.000 abstract description 17
- 230000006355 external stress Effects 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 5
- 230000035882 stress Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000008393 encapsulating agent Substances 0.000 description 9
- 101100075513 Oryza sativa subsp. japonica LSI3 gene Proteins 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ＩＣカードの実装技術
に係わり、細長いＬＳＩを組込んでなるＩＣカードに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to IC card mounting technology, and more particularly to an IC card incorporating an elongated LSI.
【０００２】0002
【従来の技術】通常、ＩＣカードにおいては、基板に取
付けたＬＳＩを封止剤で封止（コ−テイング）する構成
となっている。また、封止剤の充填時に封止剤が他の場
所に流れ出さないようにＬＳＩの配設位置の周囲に封止
剤流れ防止用ダムを形成した状態で前記ＬＳＩを封止剤
で封止するようになっている。2. Description of the Related Art Generally, an IC card has a structure in which an LSI mounted on a substrate is sealed (coated) with a sealant. In addition, the LSI is sealed with the encapsulant while forming a dam to prevent the encapsulant from flowing around the LSI installation position so that the encapsulant does not flow out to other places when the encapsulant is filled. It is supposed to be done.
【０００３】従来、この種のＩＣカ−ドにおいては、封
止剤流れ防止用ダムは、ＩＣカ−ドの曲げに対する強度
的な物については考慮されておらず、細長いＬＳＩを組
込んだ場合であっても、封止剤流れ防止用ダムのＬＳＩ
の長辺方向に沿う部分の幅寸法と短辺方向に沿う部分の
幅寸法とも同じ幅寸法となっている。[0003] Conventionally, in this type of IC card, the dam for preventing the sealant from flowing has not taken into consideration the strength against bending of the IC card, and when an elongated LSI is incorporated. Even if the LSI of the dam for preventing the flow of sealant
The width dimension of the part along the long side direction and the width dimension of the part along the short side direction are both the same width dimension.
【０００４】このため、面積が大きく、細長いＬＳＩを
使用したＩＣカードでは、携帯時等において曲げ等の外
部応力が加わった場合、ＬＳＩに直接曲げ応力が作用し
、ＬＳＩが割れるという問題があった。[0004] For this reason, IC cards that have a large area and use elongated LSIs have a problem in that when external stress such as bending is applied during carrying, etc., the bending stress acts directly on the LSI, causing the LSI to crack. .
【０００５】[0005]
【発明が解決しようとする課題】上記のように、従来の
ＩＣカ−ドにおいては、封止剤流れ防止用ダムが曲げに
対する強度の向上に積極的に利用されておらず、面積が
大きく、細長いＬＳＩを使用したＩＣカードでは曲げ等
の外部応力により、ＬＳＩが割れるという問題があった
。[Problems to be Solved by the Invention] As mentioned above, in conventional IC cards, the dam for preventing the sealant from flowing is not actively used to improve the strength against bending, and the area is large. IC cards using elongated LSIs have a problem in that the LSIs break due to external stress such as bending.
【０００６】本発明は、上記事情に基づきなされたもの
で、細長いＬＳＩを使用したＩＣカードにおいて、簡単
な構成でありながら、曲げ等の外部応力によるＬＳＩの
割れを防止できるようにしたＩＣカードを提供すること
を目的とする。The present invention has been made based on the above-mentioned circumstances, and provides an IC card that uses an elongated LSI and has a simple structure, yet can prevent the LSI from cracking due to external stress such as bending. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】本発明は上記課題を解決
するために、基板に細長いＬＳＩを取付けて該ＬＳＩを
封止剤で封止するとともに、該ＬＳＩの配設位置の周囲
に封止剤の流出を防止する矩形枠状の封止剤流れ防止用
ダムを有してなるＩＣカードにおいて、前記封止剤流れ
防止用ダムのＬＳＩの長辺方向に沿う部分の幅寸法を短
辺方向に沿う部分の幅寸法より広くしたものである。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention attaches an elongated LSI to a substrate, seals the LSI with a sealant, and seals the area around the location where the LSI is installed. In an IC card having a rectangular frame-shaped encapsulant flow prevention dam that prevents the flow of the encapsulant, the width of the portion of the encapsulant flow prevention dam along the long side direction of the LSI is defined as the width dimension in the short side direction. It is wider than the width of the part along.
【０００８】[0008]
【作用】上記のように、封止剤流れ防止用ダムのＬＳＩ
の長辺方向に沿う部分の幅寸法を短辺方向に沿う部分の
幅寸法より広くしたことにより、この部分の剛性が高く
なり、面積が大きく、細長いＬＳＩを使用したＩＣカー
ドであっても、ＬＳＩに直接曲げ応力が作用することが
なく、曲げ等の外部応力に強くなり、ＬＳＩが割れ難く
なる。[Operation] As mentioned above, the LSI of the dam for preventing the flow of sealant
By making the width of the part along the long side wider than the width of the part along the short side, the rigidity of this part is increased, and even if the IC card has a large area and uses a long and thin LSI, Bending stress does not directly act on the LSI, making it resistant to external stress such as bending, and making the LSI less likely to crack.
【０００９】[0009]
【実施例】図１および図２は、本発明のＩＣカード１の
モジュールを示すもので、図中２は基板であり、この基
板２には細長いＬＳＩ３が搭載され、ＬＳＩ３のボンデ
イングワイヤ３ａ…が基板２にプリントされた図示しな
いパタ−ンに接続された状態となっている。[Embodiment] FIGS. 1 and 2 show a module of an IC card 1 according to the present invention. In the figures, 2 is a board, and a long and thin LSI 3 is mounted on this board 2, and bonding wires 3a of the LSI 3 are connected to each other. It is connected to a pattern (not shown) printed on the board 2.
【００１０】また、前記ＬＳＩ３は封止剤４で封止（コ
−テイング）され保護されている。ＬＳＩ３の配設位置
の周囲には、所定の隙間を存して囲繞するように矩形枠
状の封止剤流れ防止用ダム５が設けられ、封止剤４が流
出しないようになっている。Further, the LSI 3 is sealed (coated) and protected with a sealant 4. A rectangular frame-shaped encapsulant flow prevention dam 5 is provided around the LSI 3 with a predetermined gap therebetween to prevent the encapsulant 4 from flowing out.
【００１１】封止剤流れ防止用ダム５のＬＳＩ３の長辺
方向に沿う部分５ａ，５ａの幅寸法Ｗ１ は、従来の幅
寸法と同じである短辺方向に沿う部分５ｂ，５ｂの幅寸
法Ｗ２より広く（Ｗ１ ＞Ｗ２ ）となっており、長辺
方向に沿う部分５ａ，５ａの剛性が従来に増して強くな
っている。The width dimension W1 of the portions 5a, 5a of the sealant flow prevention dam 5 along the long side direction of the LSI 3 is the same as the width dimension W2 of the portions 5b, 5b along the short side direction, which is the same as the conventional width dimension. It is wider (W1 > W2), and the rigidity of the portions 5a, 5a along the long side direction is stronger than before.
【００１２】そして、図３に示すようにＩＣカード１に
曲げ力が加わっても、本発明のＩＣカード１は、ダム５
の部分の剛性が高いためＬＳＩ３に直接曲げ応力が作用
することがなく、曲げ等の外部応力に強くなり、ＬＳＩ
が割れ難くなる。As shown in FIG. 3, even if a bending force is applied to the IC card 1, the IC card 1 of the present invention
Because the rigidity of the part is high, bending stress does not act directly on LSI3, and it is strong against external stress such as bending, and the LSI
becomes difficult to break.
【００１３】[0013]
【発明の効果】以上説明したように本発明によれば、封
止剤流れ防止用ダムのＬＳＩの長辺方向に沿う部分の幅
寸法を短辺方向に沿う部分の幅寸法より広くしたことに
より、この部分の剛性が高くなり、面積が大きく、細長
いＬＳＩを使用したＩＣカードであっても、ＬＳＩに直
接曲げ応力が作用することがなく、曲げ等の外部応力に
強くなり、ＬＳＩが割れ難くなるといった効果を奏する
。As explained above, according to the present invention, the width of the portion of the sealant flow prevention dam along the long side of the LSI is made wider than the width of the portion along the short side. , the rigidity of this part is high, and even if the IC card has a large area and uses a long and thin LSI, bending stress will not be applied directly to the LSI, making it resistant to external stress such as bending, and making the LSI less likely to break. It has the effect of becoming.
【図１】本発明のＩＣカードモジュールの概略的平面図
。FIG. 1 is a schematic plan view of an IC card module of the present invention.
【図２】図１のＡ−Ａ線に沿う断面図。FIG. 2 is a sectional view taken along line A-A in FIG. 1.
【図３】ＩＣカ−ドに曲げ力が加わった時の状態を示す
断面図。FIG. 3 is a sectional view showing a state when bending force is applied to the IC card.
１…ＩＣカード、２…基板、３…ＬＳＩ、３ａ…ボンデ
イングワイヤ、４…封止剤、５…封止剤流れ防止用ダム
、５ａ…長辺方向に沿う部分、５ｂ…短辺方向に沿う部
分。1... IC card, 2... Substrate, 3... LSI, 3a... Bonding wire, 4... Sealing agent, 5... Dam for preventing sealant flow, 5a... Portion along the long side direction, 5b... Along the short side direction part.
Claims (1)
Ｉを封止剤で封止するとともに、該ＬＳＩの配設位置の
周囲に封止剤の流出を防止する矩形枠状の封止剤流れ防
止用ダムを有してなるＩＣカードにおいて、前記封止剤
流れ防止用ダムのＬＳＩの長辺方向に沿う部分の幅寸法
を短辺方向に沿う部分の幅寸法より広くしたことを特徴
とするＩＣカード。[Claim 1] An elongated LSI is mounted on a board, and the LSI
In the IC card, the LSI is sealed with a sealant and has a rectangular frame-shaped sealant flow prevention dam that prevents the sealant from flowing around the location where the LSI is disposed. An IC card characterized in that the width of the dam for preventing the flow of a stop agent along the long side direction of the LSI is wider than the width of the part along the short side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3142071A JPH04367091A (en) | 1991-06-13 | 1991-06-13 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3142071A JPH04367091A (en) | 1991-06-13 | 1991-06-13 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04367091A true JPH04367091A (en) | 1992-12-18 |
Family
ID=15306758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3142071A Pending JPH04367091A (en) | 1991-06-13 | 1991-06-13 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04367091A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10054873A1 (en) * | 2000-11-06 | 2002-05-29 | Mada Marx Datentechnik Gmbh | Manufacture of contactless chip card with coil antenna, surrounds chip with cast dam which is subsequently filled to complete chip encapsulation |
-
1991
- 1991-06-13 JP JP3142071A patent/JPH04367091A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10054873A1 (en) * | 2000-11-06 | 2002-05-29 | Mada Marx Datentechnik Gmbh | Manufacture of contactless chip card with coil antenna, surrounds chip with cast dam which is subsequently filled to complete chip encapsulation |
| DE10054873C2 (en) * | 2000-11-06 | 2002-10-17 | Mada Marx Datentechnik Gmbh | Contactless chip card and method for producing such a chip card |
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