JPS5812736B2 - hand clasp - Google Patents
hand claspInfo
- Publication number
- JPS5812736B2 JPS5812736B2 JP49119963A JP11996374A JPS5812736B2 JP S5812736 B2 JPS5812736 B2 JP S5812736B2 JP 49119963 A JP49119963 A JP 49119963A JP 11996374 A JP11996374 A JP 11996374A JP S5812736 B2 JPS5812736 B2 JP S5812736B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- semiconductor device
- hole
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【発明の詳細な説明】
本発明は樹脂封止形半導体装置用リードフレームの形状
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the shape of a lead frame for a resin-sealed semiconductor device.
従来の樹脂封止型半導体装置としては、複数本のリード
を金属板より一体的に打ち抜いて形成したリードフレー
ムの１本のリード先端部に半導体素子を取り付け、該素
子の電極部と上記リードフレームの他のリードとをコネ
クタ線によって接続し、更に上記素子取り付け部分を樹
脂封止して成る樹脂封止型半導体装置が一般によ《知ら
れている。In a conventional resin-encapsulated semiconductor device, a semiconductor element is attached to the tip of one lead of a lead frame formed by integrally punching out multiple leads from a metal plate, and the electrode part of the element and the lead frame are attached. A resin-sealed semiconductor device is generally known, in which the semiconductor device is connected to other leads by a connector wire, and the element mounting portion is sealed with resin.
また素子取付部のリードを他のリードよりも太くし、取
り付け部でない他の一端を封止樹脂外部に取り出し放熱
効果を期待した放熱板つき樹脂封止型半導体装置もよく
知られている。Also, a resin-sealed semiconductor device with a heat sink is well known, in which the lead at the element mounting portion is made thicker than the other leads, and the other end, which is not the mounting portion, is taken out of the sealing resin and is expected to have a heat dissipation effect.
しかるに、該放熱板つき半導体装置において、リードフ
レームを構成する金属と封止体を構成する樹脂とは通常
の場合、化学的な接合部をもち得ない。However, in the semiconductor device with a heat sink, the metal forming the lead frame and the resin forming the sealing body usually cannot have a chemical bond.
リード金属は封正体上部及び下部を形成する樹脂間にあ
った、該二者の機械的力のみによって支持されている。The lead metal is supported only by the mechanical force between the resins forming the upper and lower parts of the enclosure.
従って、リード金属と樹脂間には隙間が形成され封止効
果が減少する可能性が存在した。Therefore, there was a possibility that a gap would be formed between the lead metal and the resin, reducing the sealing effect.
また、この隙間はリード線幅の大きな放熱板つきリード
と樹脂間に特に現われやすい傾向をもっていた。In addition, this gap tends to appear particularly between the lead with a heat sink and the resin, which has a large lead wire width.
また、樹脂封止時に該隙間が存在しないときでも、外部
リード成形時に隙間を広げる方向に応力が加わって隙間
が形成される。Further, even when the gap does not exist during resin sealing, a gap is formed due to stress applied in the direction of widening the gap during external lead molding.
更に外部リード形成時にさえも隙間ができないときでも
、以後の高温熱処理時のリード金属と樹脂間の熱膨張係
数差によって隙間は形成される。Furthermore, even if a gap is not formed during the formation of the external lead, the gap will be formed due to the difference in thermal expansion coefficient between the lead metal and the resin during subsequent high-temperature heat treatment.
該隙間を有する樹脂封止型半導体装置は、その素子部を
外気と直接、接触せしめその結果装置の信頼性が著しく
そこなわれる。In a resin-sealed semiconductor device having such a gap, its element portion comes into direct contact with the outside air, and as a result, the reliability of the device is significantly impaired.
本発明は上述したリード金属と樹脂間の隙間を減少せし
め半導体装置の信頼性の向上を計ろうとするものである
。The present invention aims to improve the reliability of a semiconductor device by reducing the gap between the lead metal and the resin described above.
本発明の特徴は、リードフレーム上に半導体素子が搭載
されて樹脂封止されてなる樹脂封止型半導体装置におい
て、複数のリードの内の１本が他より幅広に形成され、
この幅広に形成されたリード先端に半導体素子が搭載さ
れ、かつこの幅広に形成されたリードのみの封止樹脂の
表面の近傍の部分の孔が設けられ、かつこの孔の両側に
各々残余ｉるこのリードの部分の幅は他のリードの幅よ
り広く、この孔には封止樹脂が埋積されている樹脂封止
型半導体装置にある。The present invention is characterized in that in a resin-sealed semiconductor device in which a semiconductor element is mounted on a lead frame and sealed with resin, one of the plurality of leads is formed wider than the others;
A semiconductor element is mounted on the tip of this wide lead, and a hole is provided in the vicinity of the surface of the sealing resin of only this wide lead, and each of the remaining holes is provided on both sides of this hole. The width of this lead portion is wider than the width of other leads, and the hole is filled with a sealing resin in a resin-sealed semiconductor device.
本発明によれば、孔に樹脂が埋積されることによって樹
脂とこの幅広リードとのはく離が起こらず、さらに幅広
リードの孔の両側に残余するリードの部分の幅がなお他
のリードより広いので幅広リードの本来の目的である放
熱性はほとんど犠牲にならない。According to the present invention, since the resin is filled in the hole, separation between the resin and the wide lead does not occur, and furthermore, the width of the portion of the lead remaining on both sides of the hole of the wide lead is still wider than that of the other leads. Therefore, heat dissipation, which is the original purpose of wide leads, is hardly sacrificed.
次に図面を参照して本発明をその実施例により詳細に説
明する。Next, the present invention will be explained in detail by means of examples thereof with reference to the drawings.
第１図ａは組立前の従来用いられてきたリードフレーム
、第１図ｂは組立前の本発明になるリードフレームの一
例の平面図を各々示す。FIG. 1a shows a plan view of a conventionally used lead frame before assembly, and FIG. 1b shows a plan view of an example of the lead frame of the present invention before assembly.
１は素子の搭載部で２のリード部を介して放熱板３に通
じている。Reference numeral 1 denotes an element mounting portion which communicates with a heat sink 3 via lead portions 2.
更に素子搭載部１はリード細枝部６ａ，６ｂ・・・・・
・ｓ６ｇによって囲まれ、これら先端部には素子電極部
からのリードが結線される。Furthermore, the element mounting portion 1 has lead thin branch portions 6a, 6b...
- Surrounded by s6g, and leads from the element electrode section are connected to these tips.
これらリード細枝部は外部リード部７ａ，７ｂ・・・・
・・，７８へと通じこれらリード部を横切って樹脂流れ
止め部４が形成される。These lead branch parts are external lead parts 7a, 7b...
..., 78, and a resin flow stopper portion 4 is formed across these lead portions.
これらは樹脂封止後、切断除去されて素子電極部から外
部リードへの電流経路は完成する。After resin sealing, these are cut and removed to complete the current path from the element electrode section to the external lead.
しかるに、本発明においては放熱板３と素子搭載部１と
を連絡するリード部２に第１ｂ図に示す如《円形の孔５
をあける。However, in the present invention, the lead portion 2 connecting the heat sink 3 and the element mounting portion 1 is provided with a circular hole 5 as shown in
Open.
しかるのち通常の封止枝術によって第２ａ図の如《樹脂
封止体９が完成する。Thereafter, the resin-sealed body 9 as shown in FIG. 2a is completed by a conventional sealing technique.
更に樹脂流れ止め部４をリードフレーム本体から切断し
パリ部８を除去、最後に樹脂本体９より露出せしリード
部６ａ，６ｂ・・・・・・６ｇ及び放熱部３をａ−ａ’
線に沿って折曲げることによって第４図に示すように本
発明の半導体装置は完成する。Furthermore, the resin flow prevention part 4 is cut from the lead frame main body, the spring part 8 is removed, and finally the lead parts 6a, 6b, .
By bending along the lines, the semiconductor device of the present invention is completed as shown in FIG.
しかるに本発明の半導体装置は第３図の横断面図に示す
如《リード部２の孔５によってペレット搭載側樹脂部と
非搭載側樹脂部とが通じている。However, in the semiconductor device of the present invention, as shown in the cross-sectional view of FIG. 3, the pellet mounting side resin part and the non-pellet mounting side resin part communicate with each other through the hole 5 of the lead part 2.
本来樹脂部９とリードフレームとの接触は化学的結合に
よらず機械的結合によっている。Originally, the contact between the resin part 9 and the lead frame is not based on chemical bonding but on mechanical bonding.
従って従来のリードフレームの形状では外部的な応力、
一例として前述したようにａ−ａ’線に沿ってリード部
を折曲げるとき樹脂部とリードフレーム間に隙間を生ぜ
しめる応力が働く結果リード細枝部６ａｙ６ｂ・・・・
・・６ｇ及び橋梁部２の樹脂部とリードフレーム間に外
部雰囲気を通ぜしめる程度の隙間を生じしめる恐れがあ
る。Therefore, in the conventional lead frame shape, external stress
As an example, as mentioned above, when the lead part is bent along the a-a' line, stress is exerted that creates a gap between the resin part and the lead frame, resulting in the lead branch parts 6ay6b...
. . 6g, there is a risk of creating a gap between the resin part of the bridge part 2 and the lead frame, which is large enough to allow the external atmosphere to pass through.
これに反して本発明においては、孔５を樹脂によってう
める結果ペレツト搭載側樹脂部と非搭感側樹脂部とが連
続し、従来のものに見出された外部応力によるリードフ
レームと樹脂部との隙間の発生はより減少する。On the contrary, in the present invention, as a result of filling the hole 5 with resin, the resin part on the pellet loading side and the resin part on the non-boarding side are continuous, and the lead frame and resin part are separated by the external stress found in the conventional one. The occurrence of gaps is further reduced.
とりわけ放熱部を有するリード部２と樹脂部との密着性
が向上し搭載素子が直接外気にさらされることはより減
少する。In particular, the adhesion between the lead part 2 having the heat dissipating part and the resin part is improved, and the direct exposure of the mounted element to the outside air is further reduced.
従って本発明になるリードフレームを用いた半導体装置
の耐水性は向上し樹脂封止型半導体装置としての信頼性
は改善される。Therefore, the water resistance of the semiconductor device using the lead frame of the present invention is improved, and the reliability as a resin-sealed semiconductor device is improved.
なお、リード部２の孔５は円形である必要はなく第２図
ｂ１０の如《長円形でもよい。Note that the hole 5 of the lead portion 2 does not have to be circular, but may be oval as shown in FIG. 2b10.
第１図ａ，ｂは従来の樹脂封止型半導体装置用のリード
フレーム及び本発明に用いるリードフレームの平面図、
第２図ａは封止完了時における本発明を用いた封正体の
横断面図の一例、第２図ｂは本発明の他の一例の放熱板
近傍部分図、第３図は第２図ａのＡ−κ′視断面図、第
４図は本発明の封止型半導体装置の斜視図である。
１・・・素子搭載部、２・・リード部、３・・・放熱板
、４・・・樹脂流れ止め部、５・・・円形孔、６・・・
リード細枝部、７・・・外部リード部、８・・・パリ部
、９・・・樹脂封止体、１０・・・長円形孔。1a and 1b are plan views of a conventional lead frame for a resin-sealed semiconductor device and a lead frame used in the present invention,
FIG. 2a is an example of a cross-sectional view of the sealing body using the present invention when sealing is completed, FIG. 2b is a partial view of another example of the present invention near the heat sink, and FIG. 3 is FIG. FIG. 4 is a perspective view of the sealed semiconductor device of the present invention. DESCRIPTION OF SYMBOLS 1...Element mounting part, 2...Lead part, 3...Radiation plate, 4...Resin flow prevention part, 5...Circular hole, 6...
Lead thin branch portion, 7... External lead portion, 8... Paris portion, 9... Resin sealing body, 10... Oval hole.
Claims (1)
止されてなる樹脂封止型半導体装置において、複数のリ
ードの内の１本が他より幅広に形成され、該幅広に形成
されたリード先端に前記半導体素子が搭載され、かつ該
幅広に形成されたリードのみの封止樹脂の表面の近傍の
部分に孔が設けられ、かつ該孔の両側に各々残余せる該
リードの部分の幅は前記他のリードの幅より広く、該孔
には前記封止樹脂が埋積されていることを特徴とする樹
脂封止型半導体装置。1. In a resin-sealed semiconductor device in which a semiconductor element is mounted on a lead frame and sealed with resin, one of the plurality of leads is formed wider than the others, and the tip of the wide lead A hole is provided in the vicinity of the surface of the sealing resin on which the semiconductor element is mounted and only the wide lead is formed, and the width of the lead portion remaining on both sides of the hole is equal to the width of the lead other than that described above. A resin-sealed semiconductor device characterized in that the hole is wider than the width of the lead, and the hole is filled with the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49119963A JPS5812736B2 (en) | 1974-10-17 | 1974-10-17 | hand clasp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49119963A JPS5812736B2 (en) | 1974-10-17 | 1974-10-17 | hand clasp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5145977A JPS5145977A (en) | 1976-04-19 |
| JPS5812736B2 true JPS5812736B2 (en) | 1983-03-10 |
Family
ID=14774522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49119963A Expired JPS5812736B2 (en) | 1974-10-17 | 1974-10-17 | hand clasp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812736B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01131335A (en) * | 1987-08-21 | 1989-05-24 | Elf France | Disk brake caliper support-mounting device and wheel brake |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5651328Y2 (en) * | 1976-08-18 | 1981-12-01 | ||
| JPS55107251A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Electronic part and its packaging construction |
| JPS55107250A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Electronic part, electronic part module and lead frame used for them |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4934278A (en) * | 1972-07-28 | 1974-03-29 |
-
1974
- 1974-10-17 JP JP49119963A patent/JPS5812736B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4934278A (en) * | 1972-07-28 | 1974-03-29 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01131335A (en) * | 1987-08-21 | 1989-05-24 | Elf France | Disk brake caliper support-mounting device and wheel brake |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5145977A (en) | 1976-04-19 |
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