JPH0436574B2 - - Google Patents

Info

Publication number
JPH0436574B2
JPH0436574B2 JP60294016A JP29401685A JPH0436574B2 JP H0436574 B2 JPH0436574 B2 JP H0436574B2 JP 60294016 A JP60294016 A JP 60294016A JP 29401685 A JP29401685 A JP 29401685A JP H0436574 B2 JPH0436574 B2 JP H0436574B2
Authority
JP
Japan
Prior art keywords
lsi
pellet
wiring board
carbon paste
conductive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60294016A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62154746A (ja
Inventor
Toshiharu Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP60294016A priority Critical patent/JPS62154746A/ja
Publication of JPS62154746A publication Critical patent/JPS62154746A/ja
Publication of JPH0436574B2 publication Critical patent/JPH0436574B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP60294016A 1985-12-27 1985-12-27 電子部品の接合方法 Granted JPS62154746A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60294016A JPS62154746A (ja) 1985-12-27 1985-12-27 電子部品の接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60294016A JPS62154746A (ja) 1985-12-27 1985-12-27 電子部品の接合方法

Publications (2)

Publication Number Publication Date
JPS62154746A JPS62154746A (ja) 1987-07-09
JPH0436574B2 true JPH0436574B2 (enExample) 1992-06-16

Family

ID=17802160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60294016A Granted JPS62154746A (ja) 1985-12-27 1985-12-27 電子部品の接合方法

Country Status (1)

Country Link
JP (1) JPS62154746A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2541284B2 (ja) * 1988-06-09 1996-10-09 富士通株式会社 半導体チップの実装方法
JPH03274789A (ja) * 1990-03-23 1991-12-05 Toshiba Corp 実装回路ユニットの製造方法
JPH03128937U (enExample) * 1990-04-10 1991-12-25
US5371327A (en) * 1992-02-19 1994-12-06 Shin-Etsu Polymer Co., Ltd. Heat-sealable connector sheet
JPH07159197A (ja) * 1993-12-02 1995-06-23 Mitsubishi Steel Mfg Co Ltd 磁気式エンコーダ用磁気抵抗効果センサー
JP2000113919A (ja) * 1998-08-03 2000-04-21 Sony Corp 電気的接続装置と電気的接続方法

Also Published As

Publication number Publication date
JPS62154746A (ja) 1987-07-09

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Legal Events

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