JPH0436462B2 - - Google Patents

Info

Publication number
JPH0436462B2
JPH0436462B2 JP58114975A JP11497583A JPH0436462B2 JP H0436462 B2 JPH0436462 B2 JP H0436462B2 JP 58114975 A JP58114975 A JP 58114975A JP 11497583 A JP11497583 A JP 11497583A JP H0436462 B2 JPH0436462 B2 JP H0436462B2
Authority
JP
Japan
Prior art keywords
bonding
wire
ball
less
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58114975A
Other languages
English (en)
Japanese (ja)
Other versions
JPS607164A (ja
Inventor
Kenichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58114975A priority Critical patent/JPS607164A/ja
Publication of JPS607164A publication Critical patent/JPS607164A/ja
Publication of JPH0436462B2 publication Critical patent/JPH0436462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/075—
    • H10W72/07555—
    • H10W72/50—
    • H10W72/551—
    • H10W72/5524—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP58114975A 1983-06-24 1983-06-24 ボンデイングワイヤ Granted JPS607164A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58114975A JPS607164A (ja) 1983-06-24 1983-06-24 ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58114975A JPS607164A (ja) 1983-06-24 1983-06-24 ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS607164A JPS607164A (ja) 1985-01-14
JPH0436462B2 true JPH0436462B2 (cg-RX-API-DMAC10.html) 1992-06-16

Family

ID=14651255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58114975A Granted JPS607164A (ja) 1983-06-24 1983-06-24 ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS607164A (cg-RX-API-DMAC10.html)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887841A (ja) * 1981-11-20 1983-05-25 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Also Published As

Publication number Publication date
JPS607164A (ja) 1985-01-14

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