JPH04352675A - Packaging component for semiconductor chip - Google Patents
Packaging component for semiconductor chipInfo
- Publication number
- JPH04352675A JPH04352675A JP3115172A JP11517291A JPH04352675A JP H04352675 A JPH04352675 A JP H04352675A JP 3115172 A JP3115172 A JP 3115172A JP 11517291 A JP11517291 A JP 11517291A JP H04352675 A JPH04352675 A JP H04352675A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- packaging
- packaging component
- circuit
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 230000035939 shock Effects 0.000 description 2
Landscapes
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、半導体チップ用包装部
品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to packaging components for semiconductor chips.
【０００２】0002
【従来の技術】従来、半導体チップ用包装部品の半導体
チップの回路が形成された面と対向する面の形状は、図
２に示すように、平坦面１３となっている。2. Description of the Related Art Conventionally, the surface of a packaging component for semiconductor chips, which faces the surface on which a circuit of a semiconductor chip is formed, has a flat surface 13, as shown in FIG.
【０００３】0003
【発明が解決しようとする課題】上述した従来の半導体
チップ用包装部品は、半導体チップの回路が形成された
面と対向する面の形状が平坦面であるので、半導体チッ
プの包装段階及び物流段階に於いて、半導体チップの回
路が形成された面が半導体チップ用包装部品の対向する
平坦面と接触し合う事により、半導体チップの回路が破
滅されるという欠点がある。[Problems to be Solved by the Invention] In the above-mentioned conventional packaging parts for semiconductor chips, the surface facing the surface on which the circuit of the semiconductor chip is formed is a flat surface. However, there is a drawback that the circuit of the semiconductor chip is destroyed when the surface of the semiconductor chip on which the circuit is formed comes into contact with the opposing flat surface of the packaging component for the semiconductor chip.
【０００４】本発明の目的は、半導体チップの回路が包
装段階及び物流段階に於いて破壊されない半導体チップ
用包装部品を提供する事にある。An object of the present invention is to provide a packaging component for semiconductor chips in which the circuits of the semiconductor chips are not destroyed during the packaging and distribution stages.
【０００５】[0005]
【課題を解決するための手段】本発明は、多数の半導体
チップを整列し並べて収納する半導体チップ用包装部品
に於いて、前記半導体チップの回路が形成された面と対
向する面に円弧上の凹部を設ける。[Means for Solving the Problems] The present invention provides a packaging component for semiconductor chips in which a large number of semiconductor chips are arranged and housed side by side. Provide a recess.
【０００６】[0006]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments Next, embodiments of the present invention will be described with reference to the drawings.
【０００７】図１は本発明の一実施例に半導体チップを
収納した断面図である。FIG. 1 is a sectional view of a semiconductor chip housed in an embodiment of the present invention.
【０００８】図１に示ように、半導体チップ用包装部品
２の半導体チップ１の回路が形成された面と対向する面
には、円弧状の凹部３が設けられている。As shown in FIG. 1, an arcuate recess 3 is provided on the surface of the semiconductor chip packaging component 2 that faces the surface on which the circuit of the semiconductor chip 1 is formed.
【０００９】このように、半導体チップ用包装部品２の
半導体チップ１の回路が形成された面と対向する面に円
弧状の凹部３を設けることにより、半導体チップ１が包
装段階及び物流段階に於いて、振動や衝撃が与えられて
も回路が直接半導体チップ用包装部品２に接触すること
なく、半導体チップ１の回路が破壊されるのを防止出来
る。As described above, by providing the arc-shaped recess 3 on the surface of the semiconductor chip packaging component 2 opposite to the surface on which the circuit of the semiconductor chip 1 is formed, the semiconductor chip 1 can be easily transported during the packaging and distribution stages. Therefore, even if vibrations or shocks are applied, the circuits do not come into direct contact with the semiconductor chip packaging part 2, and the circuits of the semiconductor chip 1 can be prevented from being destroyed.
【００１０】尚、円弧状の凹部３は、半導体チップの長
辺を半径とする形状が半導体チップの振動防止上有利で
ある。Note that it is advantageous for the arcuate recess 3 to have a shape whose radius is the long side of the semiconductor chip in order to prevent vibration of the semiconductor chip.
【００１１】[0011]
【発明の効果】以上説明したように本発明は、半導体チ
ップの包装用部品の半導体チップの回路が形成された面
と対向する面に円弧状の凹部を設ける事によって、半導
体チップの包装段階及び物流段階に於いて、振動や衝撃
が与えられても、半導体チップの回路が形成された面が
半導体チップ用包装部品に接触し合う事による半導体チ
ップの回路の破壊を防止出来る効果がある。As explained above, the present invention provides an arc-shaped recess on the surface of the semiconductor chip packaging component opposite to the surface on which the circuit of the semiconductor chip is formed. Even if vibrations or shocks are applied during the distribution stage, there is an effect of preventing the circuits of the semiconductor chips from being destroyed due to the surface on which the circuits of the semiconductor chips are formed coming into contact with the packaging parts for the semiconductor chips.
【図１】本発明の一実施例に半導体チップを収納した断
面図である。FIG. 1 is a sectional view of a semiconductor chip housed in an embodiment of the present invention.
【図２】従来の半導体チップ用包装部品に半導体チップ
を収納した断面図である。FIG. 2 is a cross-sectional view of a conventional semiconductor chip packaging component in which a semiconductor chip is housed.
１ 半導チップ ２ 半導体チップ用包装部品 ３ 凹部 ４ 平坦面 1 Semiconductor chip 2 Packaging parts for semiconductor chips 3 Recessed part 4 Flat surface
Claims (1)
納する半導体チップ用包装部品に於いて、前記半導体チ
ップの回路が形成された面と対向する面に円孤状の凹部
を設けた事を特徴とする半導体チップ用包装部品。1. A semiconductor chip packaging component for arranging and arranging a large number of semiconductor chips and accommodating them side by side, characterized in that an arc-shaped recess is provided on a surface of the semiconductor chip opposite to a surface on which a circuit is formed. Packaging parts for semiconductor chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3115172A JPH04352675A (en) | 1991-05-21 | 1991-05-21 | Packaging component for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3115172A JPH04352675A (en) | 1991-05-21 | 1991-05-21 | Packaging component for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04352675A true JPH04352675A (en) | 1992-12-07 |
Family
ID=14656132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3115172A Pending JPH04352675A (en) | 1991-05-21 | 1991-05-21 | Packaging component for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04352675A (en) |
-
1991
- 1991-05-21 JP JP3115172A patent/JPH04352675A/en active Pending
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