JPS63307086A - Packing system for semiconductor electronic part - Google Patents
Packing system for semiconductor electronic partInfo
- Publication number
- JPS63307086A JPS63307086A JP62138495A JP13849587A JPS63307086A JP S63307086 A JPS63307086 A JP S63307086A JP 62138495 A JP62138495 A JP 62138495A JP 13849587 A JP13849587 A JP 13849587A JP S63307086 A JPS63307086 A JP S63307086A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor electronic
- tray
- package
- electronic component
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 31
- 238000012856 packing Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体電子部品の梱包方式に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a packaging method for semiconductor electronic components.
［従来の技術〕
第４図は表面実装タイプの半導体電子部品の外形図であ
る。（、Ｌ）図は側面図で、（ｂ）図は裏面図である。[Prior Art] FIG. 4 is an outline drawing of a surface-mount type semiconductor electronic component. (, L) is a side view, and (b) is a back view.
図において、（１）は半導体電子部品、（２）はパッケ
ージ（封止樹脂）、（４）はリードである。In the figure, (1) is a semiconductor electronic component, (2) is a package (sealing resin), and (4) is a lead.
第５図は半導体電子部品（１）がトレイ（５）におさめ
られた状態を示す。FIG. 5 shows a state in which semiconductor electronic components (1) are placed in a tray (5).
上記半導体電子部品（１）は、第５図に示すようにトレ
イ（５）等によって梱包され出荷される。トレイ（５）
等に梱包された半導体電子部品（１）は自動搭載機等に
よってプリント配線基板などに搭載され、はんだ付けさ
れる。The semiconductor electronic component (1) is packed and shipped in a tray (5) or the like as shown in FIG. Tray (5)
The semiconductor electronic component (1) packed in a package is mounted on a printed wiring board or the like by an automatic mounting machine or the like and soldered.
従来のｓｏｐタイプ（Ｓｍａｌｌ ０ｕｔｌｉｎｅ Ｐ
ａｃｋａｇｅ ）の半導体電子部品のパッケージ蝶以上
のように構成されておシ、近年の軽薄短小化にともない
リード自体の強度が弱くなっているので、トレイ等に梱
包され九際に、）レイ等の中で固定されていないため、
半導体電子部品が動き、半導体電子部品のリードの屈曲
が９が生じるなどの問題点があった０
この発明は上記のような８題点を解消するためになされ
たもので、半導体電子部品のパッケージ表面に凹部を設
け、梱包するトレイ等にパッケージ凹部に相当する位置
嗜形状の凸部を設けることによシトレイ等に梱包された
状態において半導体電子部品が固定されリードの屈曲が
りを防止する効果を得ることを目的とする。Traditional sop type (Small 0utline P
Packages for semiconductor electronic components (ackage) are structured as above, but as the leads themselves have become thinner, thinner, and smaller in recent years, the strength of the leads themselves has weakened, so when they are packaged in trays, etc. Because it is not fixed inside,
There were problems such as semiconductor electronic parts moving and bending of leads of semiconductor electronic parts.This invention was made to solve the above problems. By providing a concave portion on the surface and a convex portion corresponding to the package concave portion on the packaging tray, the semiconductor electronic components are fixed when packed in the tray, etc., and the leads are prevented from bending. The purpose is to obtain.
この発明に係る半導体電子部品は、半導体電子部品のパ
ッケージ裏面に凹部を設け、トレイに半導体電子部品の
パッケージに設けられた凹部に相当する位置・形状の凸
部を設けたものである。In the semiconductor electronic component according to the present invention, a recess is provided on the back surface of the package of the semiconductor electronic component, and a convex portion having a position and shape corresponding to the recess provided in the package of the semiconductor electronic component is provided on the tray.
この発明における半導体電子部品はパッケージの裏面に
凹部を設はトレイに半導体電子部品のパッケージに設け
られた凹部に相当する位置書形状の凸部を設けたことに
より、梱包状態において半導体電子部品の固定の効果を
持たせ喪ものである。The semiconductor electronic component of the present invention has a concave portion on the back side of the package, and the tray has a convex portion in the shape of a position letter corresponding to the concave portion provided on the package of the semiconductor electronic component, so that the semiconductor electronic component is fixed in the packaged state. It has the effect of mourning.
第１図にこの発明の一実施例を示す。図において、（１
） 、 （２） 、 （４）は第３図の従来例と同一な
いし相当部分を示す。（３）はパッケージ偽面に設は九
凹部である。FIG. 1 shows an embodiment of the present invention. In the figure, (1
), (2), and (4) indicate the same or equivalent parts as in the conventional example shown in FIG. (3) has nine concave portions on the false surface of the package.
第２図は第１図の半導体電子部品をトレイに梱包した状
態を示す。図において、（６）はパッケージ裏面に設け
た凹部に相当する位置・形状の凸部を示す。FIG. 2 shows the semiconductor electronic components of FIG. 1 packed in a tray. In the figure, (6) indicates a convex portion having a position and shape corresponding to a concave portion provided on the back surface of the package.
上記半導体電子部品の梱包方法について本発明の特徴で
あるパッケージ裏面〈設けられた凹部（４）があるため
、第２図に示すようにトレイ（５）にパッケージ凹部に
対応する位ｖｔ＠形状の凸部（６）を設け、半導体電子
部品（１）を固定する効果がある。Regarding the packaging method for semiconductor electronic components, a feature of the present invention is that since there is a recess (4) provided on the back of the package, as shown in FIG. Providing the protrusion (6) has the effect of fixing the semiconductor electronic component (1).
（１） なお上記実施例では、半導体電子部品のリー
ドの屈曲がり防止の効果を示したが、自ｗ′Ｊ搭載機に
よる部品搭載の際、従来においては半導体電子部品の梱
包されているトレイ等から一度部品を取シだして機械的
に位置決めを行ない搭載を行っていたものが、この発明
によりトレイ中での位置決めができるため、省力化の効
果を得ることができる。 −
（２） 凸、凹部の形状及び個数については限定され
ない。(1) In the above embodiment, the effect of preventing bending of the leads of semiconductor electronic components was shown, but when components are mounted by an automatic w'J loading machine, conventionally, the trays etc. on which semiconductor electronic components are packed are used. Instead of having to take out parts from a tray, mechanically position them, and then mount them, the present invention enables positioning in a tray, resulting in a labor-saving effect. - (2) There are no limitations on the shape and number of the convex and concave portions.
（３） 第３図に示すように凹部、凸部の位置を中心
位置よりずらす等の考ＷＬをすることにょシトレイ内で
、部品自体に方向性を持たせることができる。(3) As shown in FIG. 3, by considering WL such as shifting the positions of the concave portions and convex portions from the center position, it is possible to give directionality to the components themselves within the tray.
以上のようにこの発明によれば、半導体電子部品のパッ
ケージ裏面に凹部を設はトレイにパッケージの凹部に相
当する位置・形状の凸部を設けたので梱包状態での部品
の固定をすることができんAs described above, according to the present invention, the concave portion is provided on the back surface of the package of the semiconductor electronic component, and the convex portion with the position and shape corresponding to the concave portion of the package is provided on the tray, so that the components can be fixed in the packaged state. can not
第１図はこの発明の一実施例による半導体電子部品のパ
ッケージ構造図で、（ａ）は側面図、（ｂ）は裏面図、
第２図は第１図の半導体電子部品をトレイに梱包した状
態の断面図、第３図はこの発明の他への実施例を示す図
、第４図は従来の半導体電子部品のパッケージ構造図で
、（ａ）は側面図、（ｂ）は裏面図、第５図は従来の半
導体電子部品の梱包状態の断面図である。
図において、（１）は半導体電子部品、（２）はパッケ
ージ（封止樹脂） 、（３）は凹部、（４）はリード、
（５）はトレイ、（６）はトレイ凸部である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a diagram showing the package structure of a semiconductor electronic component according to an embodiment of the present invention, in which (a) is a side view, (b) is a back view,
Fig. 2 is a sectional view of the semiconductor electronic component shown in Fig. 1 packed in a tray, Fig. 3 is a diagram showing another embodiment of the present invention, and Fig. 4 is a diagram of the conventional package structure of the semiconductor electronic component. (a) is a side view, (b) is a back view, and FIG. 5 is a sectional view of a conventional semiconductor electronic component in a packaged state. In the figure, (1) is a semiconductor electronic component, (2) is a package (sealing resin), (3) is a recess, (4) is a lead,
(5) is a tray, and (6) is a tray convex portion. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
体電子部品をその凹部の位置・形状に対応する凸部を設
けたトレイに梱包することにより、トレイの中で上記半
導体電子部品が固定されることを特徴とする半導体電子
部品の梱包方式。By packaging a semiconductor electronic component having a concave portion on the back side of the package in a tray having a convex portion corresponding to the position and shape of the concave portion, it is possible to ensure that the semiconductor electronic component is fixed in the tray. A distinctive packaging method for semiconductor electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62138495A JPS63307086A (en) | 1987-06-02 | 1987-06-02 | Packing system for semiconductor electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62138495A JPS63307086A (en) | 1987-06-02 | 1987-06-02 | Packing system for semiconductor electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63307086A true JPS63307086A (en) | 1988-12-14 |
Family
ID=15223450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62138495A Pending JPS63307086A (en) | 1987-06-02 | 1987-06-02 | Packing system for semiconductor electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63307086A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093824A (en) * | 2000-09-13 | 2002-03-29 | Fujitsu Ltd | Electronic component, alignment pallet, and alignment method of the electronic component |
| CN110444506A (en) * | 2019-07-31 | 2019-11-12 | 青岛歌尔智能传感器有限公司 | A kind of adsorption method of system in package shell |
-
1987
- 1987-06-02 JP JP62138495A patent/JPS63307086A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093824A (en) * | 2000-09-13 | 2002-03-29 | Fujitsu Ltd | Electronic component, alignment pallet, and alignment method of the electronic component |
| CN110444506A (en) * | 2019-07-31 | 2019-11-12 | 青岛歌尔智能传感器有限公司 | A kind of adsorption method of system in package shell |
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