JPH03133784A - Tray for semiconductor device - Google Patents
Tray for semiconductor deviceInfo
- Publication number
- JPH03133784A JPH03133784A JP1269595A JP26959589A JPH03133784A JP H03133784 A JPH03133784 A JP H03133784A JP 1269595 A JP1269595 A JP 1269595A JP 26959589 A JP26959589 A JP 26959589A JP H03133784 A JPH03133784 A JP H03133784A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- tray
- semiconductor device
- suction cup
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置神用トレーに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a tray for semiconductor devices.
第２図及び第３図は従来の半導体装置軸用トレーの例を
示す断面図である。従来この種の半導体装置娑拍用トレ
ー（以下単にトレーと呼ぶ）は第２図および第３図に示
すように、半導体装置１を外部リード２またはパッケー
ジ体をトレー３ａおよび３ｂの凸出部で押さえ固定する
構造となっていた。また、これらトレー３ａ、３ｂは一
つの半導体装置を収納し、これらのトレーを重ねて梱包
されていた。FIGS. 2 and 3 are cross-sectional views showing examples of conventional trays for semiconductor device shafts. Conventionally, this type of tray for holding semiconductor devices (hereinafter simply referred to as a tray) has a semiconductor device 1 connected to an external lead 2 or a package body using the protruding portions of trays 3a and 3b, as shown in FIGS. 2 and 3. It was designed to be held in place. Moreover, these trays 3a and 3b housed one semiconductor device, and these trays were stacked and packed.
上述した従来のトレーは、外部リードにて半導体装置を
固定する方法や、パッケージ体を直接固定する方法とな
っているので、外部リードを曲げてしまったり、また各
パッケージ毎にトレーを用意しないといけない等の欠点
がある。さらに同一形状であっても厚さが変れば別のト
レーが必要となるという欠点もある。本発明の目的は、
かかる問題を解消するトレーを提供することにある。With the conventional trays mentioned above, the semiconductor device is fixed using external leads, or the package body is directly fixed, so there is a risk of bending the external leads or having to prepare a tray for each package. There are drawbacks such as not being able to do so. Another drawback is that even if the shape is the same, a different tray is required if the thickness changes. The purpose of the present invention is to
The object of the present invention is to provide a tray that solves this problem.
本発明のトレーは、半導体装置を支持する突出体と、こ
の突出体の中間に設けられた前記半導体装置のパッケー
ジ体を吸着部、及びこの吸首部と通ずる穴を有するとと
もにその一端に設けられた開口とを有する吸盤とを備え
構成される。The tray of the present invention has a protruding body for supporting a semiconductor device, a suction portion for the package body of the semiconductor device provided between the protruding body, and a hole communicating with the suction neck portion and provided at one end thereof. and a suction cup having an opening.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）及び（ｂ）は本発明の一実施例を示すトレ
ーの断面図である。このトレー３は第１図（ａ）及び（
ｂ）に示すように、トレー３の半導体装置１が載置され
る部に、吸盤８を設けたことである。この構造にするこ
とにより、半導体装置１の外部リードに触れることなく
、パッケージ体を吸盤８で吸着固定している。また、そ
のパッケージ体を従来例と同じようにトレー３の突出体
で押さえ固定しているので、一種の冗長固定手段が設け
られていると同じ効果になる。この吸盤８は、フリーの
状態では、第１図（ａ）及び（ｂ）の形状を示しており
、半導体装置を吸着する吸着部７と、空気排出口である
開口及び空胴部６をもつ頭部５とから形成されている。FIGS. 1(a) and 1(b) are cross-sectional views of a tray showing an embodiment of the present invention. This tray 3 is shown in Fig. 1(a) and (
As shown in b), a suction cup 8 is provided on the portion of the tray 3 on which the semiconductor device 1 is placed. With this structure, the package body is suctioned and fixed by the suction cup 8 without touching the external leads of the semiconductor device 1. Further, since the package body is pressed and fixed by the protrusion of the tray 3 in the same way as in the conventional example, the same effect can be obtained if a kind of redundant fixing means is provided. In the free state, this suction cup 8 has the shape shown in FIGS. 1(a) and 1(b), and has a suction portion 7 for suctioning the semiconductor device, an opening serving as an air outlet, and a cavity portion 6. It is formed from a head 5.
また、この吸盤８の空胴部６と吸着部７は、通常、フリ
ーの状態では塞がっており、頭部５を押して変形するこ
とにより穴が生じ、吸着部７の空気を押し出す構造にな
っている。一方、この吸盤の取付法は、第１図（ａ）及
び（ｂ、）の二種類ある。いずれの方法でも、半導体装
置のパッケージ体を吸着固定することである。In addition, the cavity 6 and suction part 7 of this suction cup 8 are normally closed in the free state, and when the head 5 is pushed and deformed, a hole is created and the air in the suction part 7 is pushed out. There is. On the other hand, there are two methods of attaching this suction cup, as shown in FIGS. 1(a) and 1(b). In either method, the package body of the semiconductor device is fixed by suction.
以上説明したように本発明はトレーに従来の保持機構に
加えて、半導体装置を吸着固定する吸盤を設けることに
より搬送中の外部リードの変形発生率を極力おさえるこ
とが出来るとともにパッケージの厚さが異なるものでも
収納出来るトレーが得られるという効果がある。As explained above, in addition to the conventional holding mechanism, the present invention provides a tray with a suction cup for suctioning and fixing the semiconductor device, thereby making it possible to minimize the occurrence of deformation of the external leads during transportation and to reduce the thickness of the package. This has the effect of providing a tray that can store different items.
第１図（ａ）及び（ｂ）は本発明の一実施例を示すトレ
ーの断面図、第２図及び第３図は従来のトレーの例を示
す断面図である。
１・・・半導体装置、２・・・外部リード、３．３ａ。
３ｂ・・・トレー、５・・・頭部、６・・空胴部、７・
・・吸着部、８・・・吸盤。
６４９−FIGS. 1(a) and 1(b) are sectional views of a tray showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing an example of a conventional tray. 1... Semiconductor device, 2... External lead, 3.3a. 3b...Tray, 5...Head, 6...Cavity, 7...
... Suction part, 8... Suction cup. 649-
Claims (1)
けられた前記半導体装置のパッケージ体を吸着部、及び
この吸着部と通ずる穴を有するとともにその一端に設け
られた開口とを有する吸盤とを備えることを特徴とする
半導体装置用トレー。A suction cup having a protrusion for supporting a semiconductor device, a suction part for the package body of the semiconductor device provided in the middle of the protrusion, and an opening provided at one end of the protrusion and having a hole communicating with the suction part. A tray for a semiconductor device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1269595A JPH03133784A (en) | 1989-10-16 | 1989-10-16 | Tray for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1269595A JPH03133784A (en) | 1989-10-16 | 1989-10-16 | Tray for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03133784A true JPH03133784A (en) | 1991-06-06 |
Family
ID=17474552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1269595A Pending JPH03133784A (en) | 1989-10-16 | 1989-10-16 | Tray for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03133784A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5317106A (en) * | 1991-10-13 | 1994-05-31 | Vlsi Technology, Inc. | Coplanar corrector ring |
| JP3006948U (en) * | 1994-07-20 | 1995-01-31 | 天昇電気工業株式会社 | Semiconductor integrated circuit device storage tray |
| JPH07291388A (en) * | 1994-04-26 | 1995-11-07 | Nec Corp | Transfer tray for integrated circuit unit |
| US7258703B2 (en) * | 2005-01-07 | 2007-08-21 | Asm Assembly Automation Ltd. | Apparatus and method for aligning devices on carriers |
-
1989
- 1989-10-16 JP JP1269595A patent/JPH03133784A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5317106A (en) * | 1991-10-13 | 1994-05-31 | Vlsi Technology, Inc. | Coplanar corrector ring |
| JPH07291388A (en) * | 1994-04-26 | 1995-11-07 | Nec Corp | Transfer tray for integrated circuit unit |
| JP3006948U (en) * | 1994-07-20 | 1995-01-31 | 天昇電気工業株式会社 | Semiconductor integrated circuit device storage tray |
| US7258703B2 (en) * | 2005-01-07 | 2007-08-21 | Asm Assembly Automation Ltd. | Apparatus and method for aligning devices on carriers |
| CN100403510C (en) * | 2005-01-07 | 2008-07-16 | 先进自动器材有限公司 | Apparatus and method for aligning devices on carriers |
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