JPH0758481A - Semiconductor integrated circuit unit - Google Patents

Abstract

PURPOSE:To intercept the leak of electromagnetic waves from input terminals to output terminals of a semiconductor integrated circuit package, and prevent electromagnetic interference, by forming a metal plate on the upper surface of the semiconductor integrated circuit package, and arranging a shied member in close contact with the metal plate. CONSTITUTION:The package 1 for a semiconductor integrated circuit is made of ordinary plastic or ceramic. Input terminals 3, 4 are arranged on one side surface of the package 1, and coutput terminals 5, 6 are arranged on the other side surface. A metal plate 2 is arranged in the nearly central part of the upper surface in the longitudinal direction of the package 1 in parallel with the side surfaces on which the terminals are arranged. A shield member 7 is fixed to the metal plate 2 on the package 1 and a printed board 8 by soldering. Since solder is buried in the gap between the upper surface of the package 1 and the shield member 7, electromagnetic waves do not travel the output terminals 5, 6 when they are generated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit unit for preventing leakage of a signal from an input terminal to an output terminal in a semiconductor integrated circuit package used in electronic equipment or the like.

[0002]

2. Description of the Related Art Conventionally, a package for a semiconductor integrated circuit used in various electronic devices can be constructed at a low cost. Therefore, a plastic small outline package (SOP), a dual inline package (DIP), a ceramic flat・ Packages and other items were common. In such a conventional package for a semiconductor integrated circuit, the input terminal and the output terminal are provided on opposite sides of the package in order to prevent a signal from leaking from the input terminal to the output terminal. However,
When the frequency of the signal to be used is high, there is a problem that the signal leaks from the input terminal as an electromagnetic wave through the space and leaks to the output terminal, which becomes more remarkable as the frequency becomes higher.
And this leakage has caused various inconveniences such as causing malfunction of the electronic device.

Therefore, in the conventional semiconductor integrated circuit package, a metal shield member is provided outside the upper surface of the package to block and separate the space in which the electromagnetic wave is transmitted between the input terminal and the output terminal, thereby making the electromagnetic wave. It was trying to reduce the effect of.

Further, Japanese Laid-Open Utility Model Publication No. 1-67759 proposes a semiconductor device in which a lid is grounded to cover the upper surface of a package for a semiconductor integrated circuit. Furthermore, JP-A-1
The publication of -255254 proposes a method of packaging a semiconductor integrated circuit in which the material of the package for the semiconductor integrated circuit is a conductive molding material. Furthermore, Japanese Patent Application Laid-Open No. 1-278052 proposes a semiconductor device in which a shield member made of a conductive material is disposed so as to surround the semiconductor chip and is resin-sealed together with the semiconductor chip.

[0005]

However, in the conventional method of providing the shield member on the outside of the upper surface of the package for the semiconductor integrated circuit, there is a gap between the upper surface of the package and the shield member, so that a particularly high frequency is required. In the case of a signal, there was a problem that electromagnetic waves leaked through this gap.

[0006] Further, Japanese Utility Model Laid-Open No. 1-67759, Japanese Patent Laid-Open No. 1-75759.
Each of the techniques described in Japanese Patent Laid-Open No. 255254 and Japanese Patent Laid-Open No. 1-278052 relates to electromagnetic interference to or from other circuits, and therefore input and output terminals of the same circuit. No means for resolving the above-mentioned problems between them was disclosed.

The present invention has been proposed in order to solve the problems of the prior art, and blocks the leakage of electromagnetic waves from the input terminal to the output terminal in the semiconductor integrated circuit package to prevent electromagnetic interference. An object of the present invention is to provide a unit for a semiconductor integrated circuit that surely prevents the above.

[0008]

In order to achieve this object, a semiconductor integrated circuit unit of the present invention reduces signal leakage from an input terminal to an output terminal of a plastic or ceramic semiconductor integrated circuit package. In the unit, a metal plate is formed on all or part of the upper surface of the semiconductor integrated circuit package, and a shield member is provided in close contact with the metal plate.

[0009]

According to the above-mentioned structure, the gap between the shield member and the upper surface of the package can be filled by soldering the shield member to the metal plate, so that the electromagnetic wave entering from the input terminal to the output terminal can be blocked.

[0010]

Embodiments of a semiconductor integrated circuit unit according to the present invention will now be described in detail with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of this semiconductor integrated circuit unit, and FIG. 2 is a front view showing a state in which a shield member is attached to this semiconductor integrated circuit package. In these drawings, 1 is a package for a semiconductor integrated circuit, and its material is usually made of plastic or ceramic. The input terminals 3 and 4 are provided on one side surface of the package 1, and the output terminals 5 and 6 are provided on the other side surface thereof. On the metal plate 2
Is provided. Although the metal plate 2 is provided only on the central portion in the longitudinal direction of the upper surface of the package 1 in this embodiment, the present invention is not limited to this and can be provided on the entire upper surface of the package 1, for example.

Reference numeral 7 denotes a metal shield member which is mounted on the package 1, and is formed in a relatively thin plate shape.
As shown in FIG. 2, an accommodating portion 7a is provided at the center of the lower portion so that the package 1 can be fitted exactly. The shield member 7 is fixed to the metal plate 2 and the printed board 8 on the package 1 by soldering. Shield member 7
The shape of the storage portion 7a is rectangular in this embodiment, but is not limited to this. For example, it may have the same shape as the outer shape of the package 1,
In this way, the electromagnetic wave blocking efficiency can be improved. According to the semiconductor integrated circuit unit of the present invention having such a configuration, since the gap between the upper surface of the package 1 and the shield member 7 is filled by soldering, the input terminals 3,
Even if an electromagnetic wave is generated from 4, it is not transmitted to the output terminals 5 and 6.

[0012]

As described above, according to the present invention, it is possible to prevent the electromagnetic wave from leaking from the input terminal to the output terminal of the semiconductor integrated circuit, and reliably prevent the electromagnetic interference.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a semiconductor integrated circuit unit according to the present invention.

FIG. 2 is a front view showing a state in which a shield member is attached to the semiconductor integrated circuit package according to the present invention.

[Explanation of symbols]

 1 Package 2 Metal Plate 3,4 Input Terminal 5,6 Output Terminal 7 Shield Member 7a Storage Section 8 Printed Circuit Board

Claims (2)

[Claims] 1. A unit for reducing signal leakage from an input terminal to an output terminal of a plastic or ceramic package for a semiconductor integrated circuit, wherein a metal plate is formed on all or part of an upper surface of the package for the semiconductor integrated circuit. In addition, a unit for semiconductor integrated circuit is provided with a shield member which is disposed in close contact with the metal plate. 2. The unit for semiconductor integrated circuit according to claim 1, wherein the shield member is made of a relatively thin plate material, and a housing portion corresponding to the outer shape of the package is provided at the center of the lower portion.