KR19990030766A - Semiconductor package - Google Patents
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- KR19990030766A KR19990030766A KR1019970051164A KR19970051164A KR19990030766A KR 19990030766 A KR19990030766 A KR 19990030766A KR 1019970051164 A KR1019970051164 A KR 1019970051164A KR 19970051164 A KR19970051164 A KR 19970051164A KR 19990030766 A KR19990030766 A KR 19990030766A
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- semiconductor package
- molding resin
- electromagnetic shielding
- shielding layer
- semiconductor
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 발명은 반도체 다이와 리드프레임을 둘러싼 몰딩수지의 외부로 돌출된 외부리드를 전기적으로 접지된 전자파 차폐층으로 둘러싸서 상기 외부리드를 통해 나가는 고주파를 차단한다.The present invention surrounds an outer lead protruding to the outside of the molding resin surrounding the semiconductor die and the lead frame with an electrically grounded electromagnetic shielding layer to block high frequency outgoing through the outer lead.
Description
본 발명은 반도체 패키지에 관한 것으로서, 특히 패키지 레벨에서 전자파를 차폐할 수 있는 반도체 패키지에 관한 것이다.The present invention relates to a semiconductor package, and more particularly, to a semiconductor package capable of shielding electromagnetic waves at the package level.
일반적으로 반도체 장치는 반도체 기판상에 회로를 집적한 반도체 소자, 즉 반도체 다이를 도 1 에 도시한 바와 같이 몰딩 수지(10)로 밀봉한 패키지 형태로 제작되며, 패키지 외부로 돌출된 외부리드(20)를 통하여 외부 회로와 연결된다. 이와 같은 반도체 집적회로는 회로기판상에 실장되어 전기적 기능을 수행하게 되는 바, 외부의 전자파가 집적회로의 내부회로에 영향을 미치게 되어 집적회로의 회로동작상의 오동작을 유발시키거나 회로특성을 열하시키는 문제가 제기되고 있다.In general, a semiconductor device is manufactured in a package form in which a semiconductor device in which a circuit is integrated on a semiconductor substrate, that is, a semiconductor die is sealed with a molding resin 10 as shown in FIG. 1, and an external lead 20 protruding outside the package Is connected to an external circuit. Such a semiconductor integrated circuit is mounted on a circuit board to perform an electrical function, and external electromagnetic waves affect the internal circuit of the integrated circuit, causing malfunctions or degrading circuit characteristics of the integrated circuit. The problem is being raised.
반대로, 집적회로의 고속화로 인하여 집적회로가 전자파 발생원이 되어 인접한 다른 회로구성에 영향을 주게 되는 문제도 활발히 연구되고 있다.On the contrary, due to the high speed of the integrated circuit, the problem that the integrated circuit becomes a source of electromagnetic waves and affects other adjacent circuit configurations is also actively studied.
특히 통신장치와 같은 고주파신호를 처리하는 응용분야에 사용되는 집적회로에서는 이와같은 전자파로 인한 오동작이 심각한 문제로 대두되고 있을뿐만 아니라 이러한 통신장치를 사용하는 인체에 악영향을 끼치고 심한 경우 질병을 유발한다는 보고가 증가하고 있기 때문에, 각 나라에서는 전자제품의 전자파 차폐특성을 엄격히 규정하고 있다.In particular, in integrated circuits used in applications that process high frequency signals such as communication devices, malfunctions caused by electromagnetic waves are not only a serious problem, but also adversely affect the human body using such communication devices and cause diseases in severe cases. As reports increase, each country strictly regulates electromagnetic shielding characteristics of electronic products.
따라서 본 발명의 목적은 이와 같은 종래기술의 문제점을 해결하기 위하여 전자파를 차폐할 수 있는 반도체 패키지를 제공하는 것이다.Accordingly, an object of the present invention is to provide a semiconductor package capable of shielding electromagnetic waves in order to solve the problems of the prior art.
상기 목적을 달성하기 위한 본 발명의 반도체 패키지는, 반도체 다이와 리드프레임을 몰딩수지로 봉지한 반도체 패키지에 있어서, 상기 몰딩수지 외부로 돌출된 리드프레임의 외부리드는 절연막 및 상기 절연막을 덮으며 전기적으로 접지된 전자파 차폐층으로 둘러싸인 것을 특징으로 한다.In the semiconductor package of the present invention for achieving the above object, in the semiconductor package in which the semiconductor die and the lead frame is sealed with a molding resin, the outer lead of the lead frame protruding outside the molding resin covering the insulating film and the insulating film electrically It is characterized by being surrounded by a grounded electromagnetic shielding layer.
도 1 은 종래의 기술에 의한 반도체 패키지의 단면구조를 도시한 것이고,1 shows a cross-sectional structure of a semiconductor package according to the prior art,
도 2 는 본 발명에 의한 반도체 패키지의 단면구조를 도시한 것이다.2 illustrates a cross-sectional structure of a semiconductor package according to the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for main parts of the drawings>
110 : 몰딩수지 120 : 외부리드110: molding resin 120: external lead
130 : 절연막 140 : 전자파 차폐층130: insulating film 140: electromagnetic shielding layer
이하, 첨부도면을 참조하여 본 발명을 보다 상세히 설명하고자 한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
본 발명의 반도체 패키지는, 도 2 에 도 2 에 도시한 바와 같이 반도체 다이와 리드프레임을 둘러싼 몰딩수지(110)의 외부로 돌출된 외부리드(120), 즉 핀을 전기적으로 접지된 전자파 차폐층(140)으로 둘러싸서 상기 외부리드를 통해 나가는 고주파를 차단한다.As shown in FIG. 2 and FIG. 2, the semiconductor package of the present invention includes an external shield 120 protruding to the outside of the molding resin 110 surrounding the semiconductor die and the lead frame, that is, an electromagnetic shielding layer electrically connected to a pin. 140 to block the high frequency outgoing through the outer lead.
이때 상기 전자파 차폐층(140)으로는 박막의 구리나 알루미늄을 사용하며, 상기 외부리드(120)와 전자파 차폐층(140) 사이에는 절연막(130)을 삽입한다.In this case, a thin film of copper or aluminum is used as the electromagnetic shielding layer 140, and an insulating film 130 is inserted between the external lead 120 and the electromagnetic shielding layer 140.
이상에서와 같이 본 발명에 의하면, 반도체 패키지 레벨에서 전자파가 외부로 나가는 것을 차단함으로써 고주파 소자를 사용한 장비의 인접회로의 오동작을 방지할 수 있는 효과가 있다.As described above, according to the present invention, by preventing electromagnetic waves from going out at the semiconductor package level, there is an effect of preventing malfunction of adjacent circuits of equipment using high frequency devices.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970051164A KR19990030766A (en) | 1997-10-06 | 1997-10-06 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970051164A KR19990030766A (en) | 1997-10-06 | 1997-10-06 | Semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990030766A true KR19990030766A (en) | 1999-05-06 |
Family
ID=66042588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970051164A KR19990030766A (en) | 1997-10-06 | 1997-10-06 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19990030766A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101388815B1 (en) * | 2012-06-29 | 2014-04-23 | 삼성전기주식회사 | Semiconductor package |
-
1997
- 1997-10-06 KR KR1019970051164A patent/KR19990030766A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101388815B1 (en) * | 2012-06-29 | 2014-04-23 | 삼성전기주식회사 | Semiconductor package |
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