JPH01255254A - Packaging method for semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To attenuate an electromagnetic noise generated from an electronic device to the degree not to become a problem in practice without an EMI filter and a shielding case by adding a shielding function to a package itself of an integrated circuit. CONSTITUTION:In an electronic device using a digital signal, electromagnetic wave failure removing means is provided at the package itself of a semiconductor integrated circuit used in the device. For example, a whole DIP is molded with a conductive molding material 42, and the material 42, a lead terminal 41, leads and the integrated circuit are insulated thereamong by an insulating film 43. The material 42 is brought into contact with a tab securing lead, which is connected to a GND. Thus, an electromagnetic wave noise can be attenuated to the degree not to become a problem in practice without an EMI filter and a shielding case. As a result, its component cost is reduced, the mounting efficiency of a board is improved, its assembling cost is decreased, and the device can be further reduced in size and weight.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a packaging method for semiconductor integrated circuits, and more particularly to electromagnetic interference technology.

[Summary of the invention]

In recent years, with the increase in the number of electronic devices, electromagnetic noise (ELEOTRO-MAGNFJT Engineering C-Engineering NTF: RFAGE, hereinafter referred to as FXMI) generated from the electronic devices has become a major problem.゛For this reason, in Japan, the VaC (Voluntary Control Council for Electromagnetic Interference from Information Processing Equipment) has begun to implement voluntary regulations. As a result, manufacturers are taking measures such as installing KM filters on the outside of integrated circuits and shielding them with shield cases.

In order to solve the above-mentioned problem, the present invention uses a conductive molding material for the package itself of the integrated circuit, which is the source of electromagnetic noise, to block electromagnetic noise, and to protect the integrated circuit from other semiconductor integrated circuits and other devices. It becomes possible to prevent electromagnetic wave interference to electronic devices, and furthermore, it is possible to reduce the cost of electronic devices.

[Conventional technology]

Since it is impossible to take KMI measures for a single integrated circuit, EM
The only way to prevent electromagnetic noise from escaping was by attaching an external filter or shielding electronic equipment with a conductor.

[Problem to be solved by the invention]

With the recent increase in the number of electronic devices, electromagnetic noise generated from the electronic devices has become a major problem. In particular, since electronic devices that use digital signals generate noise over a wide range of frequencies, the problem of noise in digital devices is attracting attention.

Since the high frequency noise may damage the functions of other integrated circuits and electronic devices, electronic device manufacturers take noise countermeasures by using KM filters and shield cases. As a result, component costs have increased, board mounting efficiency has decreased, assembly costs have increased, and electronic devices have also become larger. Therefore, an object of the present invention is to solve the above problems.

[Means to solve the problem]

In order to solve the above problem, the present invention adds a shielding function to the integrated circuit package itself, thereby making it possible to reduce the total cost of electronic equipment.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a conceptual diagram of a digital electronic device, showing the generation path of electromagnetic noise. Figure 2 is a conceptual diagram showing an example of electromagnetic noise countermeasures currently adopted in various 'td child devices.KMI filters are inserted into all terminals where there is a risk of noise generation, and the entire collection circuit is This shows how the wire is shielded with a conductor. Figure 3 shows D-engineering P.
It is a package drawing of an integrated circuit called (α
) is a plan view, (b) is a side view, and (C) is a sectional view.

FIG. 4 is a drawing showing the present invention, and shows that the entire D-work P is molded with a conductive molding material. The conductive mold material, lead terminals, lead wires, and integrated circuit are insulated by an insulating film. Further, the conductive mold material is in contact with the tab fixing lead, and the tab fixing lead is connected to GND. The GND electrode must be stable in terms of noise (7ND).

As described above, the electromagnetic noise generated by the integrated circuit can be caught by the conductive molding material used in the packaging, and then flowed out to the ground electrode via the tab fixing lead that is in contact with the molding material, thereby eliminating the noise. .

As explained above, according to the present invention, electromagnetic wave noise generated from electronic equipment can be filtered out by an EM filter.

And it can be attenuated to a level that poses no problem in practice without a shield case.

〔Effect of the invention〕

According to the present invention, it is possible to attenuate electromagnetic wave noise to the extent that it does not pose a practical problem without using an EM filter or a shielding case.As a result, component costs are reduced, board mounting efficiency is improved, and assembly costs are reduced. Moreover, it is possible to make the equipment smaller and lighter.

[Brief explanation of the drawing]

Figure 1 is a conceptual diagram of a digital electronic device, with 1...
...Integrated circuit, 2...Noise transmission path passing through conductor, 3...Electromagnetic wave noise flying in the air, 4...Shield case Figure 2 shows It is a conceptual diagram showing electromagnetic wave noise countermeasures in electronic equipment, and includes 21... integrated circuit, 22... EM filter, 23... shield case Figure 6 (α). ~ (C) is an external view of D-work p, (α) is a plan view, 31... lead terminal, 32... mold material (b) is a side view, 31...Lead terminal, 32...Mold material (C) is a sectional view, 31...Lead terminal, 62...Mold material. 4 (α) to (C) are drawings showing the present invention, (α) is a plan view, 41... lead terminal, 42... conductive mold material is ) is a side view, 41... Lead terminal, 42... Conductive molding material, 43... Lead terminal insulating film, 44
. . . The protective film (C) covering the conductive molding material is a cross-sectional view. 41 . . . Lead terminal, 42 . . . Conductive molding material, 46 . . . ...Lead terminal insulating film, 44
......A protective film that covers the conductive mold material. Applicant: Seiko Epson Co., Ltd. Agent Patent attorney: Masayoshi Kamiyanagi (and 1 other person)

Claims (1)

[Claims] 1. A method for packaging a semiconductor integrated circuit in an electronic device using digital signals, characterized in that the package itself of the semiconductor integrated circuit used in the electronic device has an electromagnetic interference removing means.