JPH05190609A - Tape carrier for tab - Google Patents

Tape carrier for tab

Info

Publication number
JPH05190609A
JPH05190609A JP4024699A JP2469992A JPH05190609A JP H05190609 A JPH05190609 A JP H05190609A JP 4024699 A JP4024699 A JP 4024699A JP 2469992 A JP2469992 A JP 2469992A JP H05190609 A JPH05190609 A JP H05190609A
Authority
JP
Japan
Prior art keywords
ground plane
lead conductor
tape carrier
lead
noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4024699A
Other languages
Japanese (ja)
Inventor
Toyohiko Kumakura
豊彦 熊倉
Mamoru Onda
護 御田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP4024699A priority Critical patent/JPH05190609A/en
Publication of JPH05190609A publication Critical patent/JPH05190609A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To reduce cross talk and make it possible to easily control the electric characteristics of a lead conductor by covering the vicinities of the lead conductor overlaying an insulating body with conductive members. CONSTITUTION:A lead conductor 1 is covered with an insulating body 2 and is surrounded by an upper ground plane 3 and a lower ground plane 4 while holding a predetermined capacitance between them, and the upper ground plane 3 and the lower ground plane 4 are connected to the grounding potential. Therefore, even there is external noise in the surrounding area, the noise cannot enter into the inside of a space surrounded by the upper ground plane 3 and the lower ground plane 4. Also, the electric field generated from the lead conductor 1 does not leaks outside of the upper ground plane 3 and the lower ground plane 4 thereby not affecting the outside, and there is no possibility of a signal from the lead conductor 1 becoming noise for other lead wires.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はIC,LSI等の半導体
素子の実装方式の1つであるTAB(Tape Automated B
onding)方式に使用されるTAB用テープキャリアに関
し、特に、クロストークを抑制し、かつ、リード導体の
電気特性の制御が行えるTAB用テープキャリアに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a TAB (Tape Automated B) which is one of mounting methods for semiconductor elements such as IC and LSI.
The present invention relates to a TAB tape carrier used in an onding method, and more particularly, to a TAB tape carrier capable of suppressing crosstalk and controlling the electrical characteristics of lead conductors.

【0002】従来のTAB用テープキャリアとして、例
えば、図5に示されるものがある。このTAB用テープ
キャリアは、絶縁体2の上部に所定パターンのリード導
体1をラミネートして構成されている。リード導体1は
信号伝送用の信号リードの他に電源リードとグランドリ
ードを有し、電源電位,及び接地電位のチップへの供給
はリード導体1の一部を兼用して行っている。
As a conventional TAB tape carrier, for example, there is one shown in FIG. This TAB tape carrier is constructed by laminating a lead conductor 1 having a predetermined pattern on an insulator 2. The lead conductor 1 has a power supply lead and a ground lead in addition to a signal lead for signal transmission, and the power supply potential and the ground potential are supplied to the chip by using part of the lead conductor 1 as well.

【0003】一方、最近になってデジタル信号の高速化
(コンピュータ処理の高速化,制御機器の高速化)が進
み、クロック周波数にして数10MHzから100MH
zの段階にまで及んでいる。こうした周波数では単なる
伝送経路となるリードに対しても伝送信号に歪が生じな
いように、リードのインダクタンス,及び静電容量等と
いった電気定数を所定の値に制御する必要がある。すな
わち、半導体装置としてプリント基板に接合した場合、
プリント基板との接合点,及びICチップとの接合点で
の信号の反射を防ぐために、リード導体の特性インピー
ダンスを制御してインピーダンス整合(マッチング)を
行っている。
On the other hand, recently, the speed of digital signals (speed of computer processing, speed of control equipment) has increased, and the clock frequency is from several tens of MHz to 100 MH.
It extends to the z stage. At such frequencies, it is necessary to control the electric constants such as the inductance and the capacitance of the leads to predetermined values so that the transmission signal is not distorted even for the leads that are simply transmission paths. That is, when bonded to a printed circuit board as a semiconductor device,
Impedance matching is performed by controlling the characteristic impedance of the lead conductor in order to prevent reflection of signals at the junction with the printed circuit board and the junction with the IC chip.

【0004】[0004]

【発明が解決しようとする課題】しかし、従来のTAB
用テープキャリアは、隣接するリード導体や、プリント
基板の他の電子部品からノイズの影響を直接受けるた
め、電源リード又はグランドリードのノイズが信号リー
ドに重畳したり、信号リードの信号が他の信号リードに
ノイズとして重畳したり、外部電子部品のノイズが信号
リードに重畳するというクロストークが生じ、ICチッ
プや他の電子部品等の誤動作の原因となっている。ま
た、インピーダンス整合(マッチング)を行う際のリー
ド導体の電気特性の制御が比較的困難である。
However, the conventional TAB
Since the tape carrier for use is directly affected by noise from the adjacent lead conductors and other electronic components on the printed circuit board, the noise of the power supply lead or the ground lead is superimposed on the signal lead, or the signal of the signal lead is transmitted to other signals. Crosstalk occurs in which noise is superimposed on the leads as noise or noise of external electronic components is superimposed on the signal leads, which causes malfunction of the IC chip and other electronic components. In addition, it is relatively difficult to control the electrical characteristics of the lead conductor when performing impedance matching.

【0005】従って、本発明の目的はクロストークを低
減させることができ、かつ、リード導体の電気特性を容
易に制御することができるTAB用テープキャリアを提
供することである。
Therefore, an object of the present invention is to provide a TAB tape carrier which can reduce crosstalk and can easily control the electrical characteristics of the lead conductor.

【0006】[0006]

【課題を解決するための手段】本発明は上記問題点に鑑
み、クロストークを低減させ、かつ、リード導体の電気
特性を容易に制御できるようにするため、絶縁体によっ
て被覆されたリード導体の周囲を導電部材によって包囲
したTAB用テープキャリアを提供するものである。
SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a lead conductor coated with an insulator in order to reduce crosstalk and to easily control the electrical characteristics of the lead conductor. Provided is a TAB tape carrier surrounded by a conductive member.

【0007】前記導電部材は、例えば、銅材,鉄系合金
材,或いはアルミ材等より成り、絶縁体の上部,及び下
部に配置されている。上部の導電部材はリード導体を個
々に包囲するように凸凹状に形成されている。また、上
下の導電部材を接合部を介して電気的に接合した構成に
しても良い。
The conductive member is made of, for example, a copper material, an iron-based alloy material, an aluminum material, or the like, and is arranged above and below the insulator. The upper conductive member is formed in an uneven shape so as to individually surround the lead conductors. Alternatively, the upper and lower conductive members may be electrically joined via the joining portion.

【0008】[0008]

【作用】上記構成に基づく本発明のTAB用テープキャ
リアは、周囲に外部ノイズがあっても導電部材が接地等
の固定電位に接続されているため、リード導体へのノイ
ズの侵入を防ぐことができる。また、リード導体から発
生する電界は接地されるため、外部に洩れ出して外部機
器等に影響を及ぼすことがなく、また、あるリード導体
の信号が他のリード導体のノイズとなる恐れもない。更
に、絶縁体の厚さを適宜変えることによって、リード導
体と導電部材の静電容量を制御できるようになり、リー
ド導体のインピーダンスを容易に制御することができ
る。また、リード導体を挟持する上下の導電部材を電気
的に接合すると、電磁遮蔽効果をもたらすことができ、
更に、接合部の接合の程度を変えることによってリード
のインダクタンスを制御することができる。特に、静電
遮蔽効果を期待するときは、銅,アルミ等の導電部材を
使用し、電磁遮蔽効果を期待するときは、鉄等の磁性部
材を使用し、両遮蔽効果を同時に期待するときは、銅,
アルミ等と鉄等のラミネート材料を使用すれば良い。
In the TAB tape carrier of the present invention having the above structure, the conductive member is connected to a fixed potential such as ground even if there is external noise in the surroundings, so that the noise can be prevented from entering the lead conductor. it can. In addition, since the electric field generated from the lead conductor is grounded, it does not leak to the outside to affect external devices and the like, and the signal of one lead conductor does not become noise of another lead conductor. Further, by appropriately changing the thickness of the insulator, the capacitance of the lead conductor and the conductive member can be controlled, and the impedance of the lead conductor can be easily controlled. Further, when the upper and lower conductive members that sandwich the lead conductor are electrically joined, an electromagnetic shielding effect can be brought about.
Further, the inductance of the lead can be controlled by changing the degree of joining at the joining portion. In particular, when expecting an electrostatic shielding effect, use a conductive member such as copper or aluminum. When expecting an electromagnetic shielding effect, use a magnetic member such as iron. When expecting both shielding effects at the same time. ,copper,
Laminate materials such as aluminum and iron may be used.

【0009】[0009]

【実施例】以下、本発明のTAB用テープキャリアにつ
いて添付図面を参照しつつ詳細に説明する。
The tape carrier for TAB of the present invention will be described in detail below with reference to the accompanying drawings.

【0010】図1には、本発明の一実施例に係るTAB
用テープキャリアの断面構造が示されている。このTA
B用テープキャリアは、ICチップと接合される所定パ
ターンのリード導体1と、IC,LSI等の半導体素子
の実装に用いる絶縁体2と、絶縁体2の上部,及び下部
に配置された上部グランドプレーン3,及び下部グラン
ドプレーン4より構成されている。
FIG. 1 shows a TAB according to an embodiment of the present invention.
The cross-sectional structure of the tape carrier is shown. This TA
The tape carrier for B includes a lead conductor 1 having a predetermined pattern to be joined to an IC chip, an insulator 2 used for mounting a semiconductor element such as an IC and an LSI, and an upper ground arranged above and below the insulator 2. It is composed of a plane 3 and a lower ground plane 4.

【0011】リード導体1は、絶縁体2に被覆されてい
ると共に、個々に独立して遮蔽されるように上部グラン
ドプレーン3によって凹凸状に包囲されている。すなわ
ち、リード導体1は上部グランドプレーン3,及び下部
グランドプレーン4との間に所定の静電容量を有しなが
ら包囲されている。上部グランドプレーン3,及び下部
グランドプレーン4は接地電位に接続されている。
The lead conductor 1 is covered with an insulator 2 and is surrounded by an upper ground plane 3 in an uneven shape so as to be shielded independently. That is, the lead conductor 1 is surrounded by the upper ground plane 3 and the lower ground plane 4 while having a predetermined capacitance. The upper ground plane 3 and the lower ground plane 4 are connected to the ground potential.

【0012】以上のTAB用テープキャリアは、図2に
示すように、周囲に外部ノイズがあっても上部グランド
プレーン3,及び下部グランドプレーン4が接地されて
いるため、ノイズは上部グランドプレーン3,及び下部
グランドプレーン4によって包囲される空間の内部に侵
入することができない。また、リード導体1から発生す
る電界は、上部グランドプレーン3,及び下部グランド
プレーン4を介して接地されるため、上部グランドプレ
ーン3,及び下部グランドプレーン4の外部に洩れ出し
て外部に影響を及ぼすことがなく、また、リード導体1
の相互間に上部グランドプレーン3が入り込んでいるた
め、リード導体1の信号が他のリード導体1のノイズと
なる恐れもない。更に、絶縁体2の厚さを適宜変えるこ
とによって、リード導体1とグランドプレーン3,4の
間の静電容量を制御できるようになり、リード導体1の
インピーダンスを容易に制御することができる。
In the above TAB tape carrier, as shown in FIG. 2, since the upper ground plane 3 and the lower ground plane 4 are grounded even if there is external noise in the surroundings, noise is generated in the upper ground plane 3. In addition, the inside of the space surrounded by the lower ground plane 4 cannot enter. Further, since the electric field generated from the lead conductor 1 is grounded via the upper ground plane 3 and the lower ground plane 4, it leaks to the outside of the upper ground plane 3 and the lower ground plane 4 and affects the outside. Without lead conductor 1
Since the upper ground plane 3 is inserted between the two, there is no fear that the signal of the lead conductor 1 becomes noise of the other lead conductors 1. Further, by appropriately changing the thickness of the insulator 2, the capacitance between the lead conductor 1 and the ground planes 3 and 4 can be controlled, and the impedance of the lead conductor 1 can be easily controlled.

【0013】図3には、本発明の第2の実施例に係るT
AB用テープキャリアの断面構造が示されている。この
TAB用テープキャリアは、上部グランドプレーン3と
下部グランドプレーン4を接合部5を介して電気的に接
合した構成を有している。
FIG. 3 shows a T according to the second embodiment of the present invention.
The cross-sectional structure of the AB tape carrier is shown. This TAB tape carrier has a structure in which an upper ground plane 3 and a lower ground plane 4 are electrically joined via a joining portion 5.

【0014】このTAB用テープキャリアによると、第
1の実施例の遮蔽効果を更に高めることができる。すな
わち、図4に示すように、リード導体1に流れる電流に
よる磁束又は周辺の磁束(ノイズ)とグランドプレーン
3,4が鎖交すると、鎖交する磁束の変化に対応してグ
ランドプレーン3,4に逆起電力が発生し、鎖交する磁
束変化を打ち消すように電流が流れる。このため、電磁
遮蔽効果をもたらすことができ、上部グランドプレーン
3と下部グランドプレーン4の電気的接合が十分であれ
ば20〜50%の電磁ノイズの低減が図れる。また、接
合部5の接合の程度を変えることによって、リード導体
1のインダクタンスを制御することができ、第1の実施
例における静電容量に制御と合わせてリード導体1のイ
ンピーダンスを容易に制御することができる。
According to this TAB tape carrier, the shielding effect of the first embodiment can be further enhanced. That is, as shown in FIG. 4, when the magnetic flux due to the current flowing through the lead conductor 1 or the surrounding magnetic flux (noise) and the ground planes 3 and 4 interlink, the ground planes 3 and 4 correspond to the change in the interlinking magnetic flux. A counter electromotive force is generated in the current, and a current flows so as to cancel the interlinking magnetic flux change. Therefore, an electromagnetic shielding effect can be brought about, and if the electric connection between the upper ground plane 3 and the lower ground plane 4 is sufficient, the electromagnetic noise can be reduced by 20 to 50%. In addition, the inductance of the lead conductor 1 can be controlled by changing the degree of joining of the joining portion 5, and the impedance of the lead conductor 1 can be easily controlled together with the control of the electrostatic capacitance in the first embodiment. be able to.

【0016】尚、上記実施例では、導電部材をグランド
プレーンとしたが、電源プレーンに置換しても良い。
Although the conductive member is a ground plane in the above embodiment, it may be replaced with a power plane.

【0017】[0017]

【発明の効果】以上説明したように、本発明のTAB用
テープキャリアによると、絶縁体に被覆されたリード導
体の周囲を導電部材によって包囲したため、クロストー
クを抑制することができると共に、リード導体の電気特
性の制御を容易に行うことができる。
As described above, according to the TAB tape carrier of the present invention, since the periphery of the lead conductor covered with the insulator is surrounded by the conductive member, crosstalk can be suppressed and the lead conductor can be suppressed. It is possible to easily control the electric characteristics of the.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例に係るTAB用テープキ
ャリアを示す断面図。
FIG. 1 is a sectional view showing a TAB tape carrier according to a first embodiment of the present invention.

【図2】第1の実施例における動作説明図。FIG. 2 is an operation explanatory diagram of the first embodiment.

【図3】本発明の第2の実施例に係るTAB用テープキ
ャリアを示す断面図。
FIG. 3 is a sectional view showing a TAB tape carrier according to a second embodiment of the present invention.

【図4】第2の実施例における動作説明図。FIG. 4 is an operation explanatory diagram of the second embodiment.

【図5】従来のTAB用テープキャリアを示す断面図。FIG. 5 is a cross-sectional view showing a conventional TAB tape carrier.

【符号の説明】[Explanation of symbols]

1 リード導体 2 絶縁
体 3 上部グランドプレーン 4 下部
グランドプレーン 5 接合部
1 Lead conductor 2 Insulator 3 Upper ground plane 4 Lower ground plane 5 Junction

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 フィルム状絶縁体(以下、絶縁体とい
う)に所定パターンのリード導体を設けて成るTAB用
テープキャリアにおいて、 前記リード導体は、導電部材によって包囲されていると
共に、前記導電部材との間に所定の静電容量を有してい
ることを特徴とするTAB用テープキャリア。
1. A tape carrier for TAB comprising a film-shaped insulator (hereinafter referred to as an insulator) provided with a lead conductor having a predetermined pattern, wherein the lead conductor is surrounded by a conductive member and A tape carrier for TAB, which has a predetermined electrostatic capacity between the two.
JP4024699A 1992-01-14 1992-01-14 Tape carrier for tab Pending JPH05190609A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4024699A JPH05190609A (en) 1992-01-14 1992-01-14 Tape carrier for tab

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4024699A JPH05190609A (en) 1992-01-14 1992-01-14 Tape carrier for tab

Publications (1)

Publication Number Publication Date
JPH05190609A true JPH05190609A (en) 1993-07-30

Family

ID=12145425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4024699A Pending JPH05190609A (en) 1992-01-14 1992-01-14 Tape carrier for tab

Country Status (1)

Country Link
JP (1) JPH05190609A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311682A (en) * 2008-09-16 2008-12-25 Kyocera Corp Wiring board
JP2015016266A (en) * 2013-07-12 2015-01-29 株式会社東芝 Magnetic resonance imaging apparatus
JP2018182356A (en) * 2017-04-03 2018-11-15 矢崎総業株式会社 Transmission line and manufacturing method therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311682A (en) * 2008-09-16 2008-12-25 Kyocera Corp Wiring board
JP2015016266A (en) * 2013-07-12 2015-01-29 株式会社東芝 Magnetic resonance imaging apparatus
US9910112B2 (en) 2013-07-12 2018-03-06 Toshiba Medical Systems Corporation Noise suppression for MRI signals directly sampled and digitized in imaging room
JP2018182356A (en) * 2017-04-03 2018-11-15 矢崎総業株式会社 Transmission line and manufacturing method therefor

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