JPH0722535A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve the positioning accuracy of a semiconductor device upon its being packaged on a packaging substrate and hereby reduce failure packaging by providing a plurality of positioning holes in a package bottom facing to the packaging substrate upon packaging the semiconductor device. CONSTITUTION:Three for example of positioning holes 3 are provided on a bottom surface of a package facing to a packaging substrate 2 of a resin molding type semiconductor device 1. Provided positioning protrusions 4 are also provided on the packaging substrate 2 at the same locations as those of the positioning holes 3, the protrusions on the packaging substrate 2 are inserted into the positioning holes 3 of the semiconductor device 1 upon the semiconductor device 1 being packaged on the packaging substrate 2. whereby the semiconductor device 1 and the packaging substrate 2 are prevented from being displaced from each other owing to any vibration before the packaging for ensurance of accurate packaging. Further, three positioning portions are used, whereby the packaging is prevented from being reversely packaged for reduction of failure packaging.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a structure of a surface mount type semiconductor device package which can be easily positioned when mounted on a printed circuit board.

[0002]

2. Description of the Related Art With the recent increase in functionality of semiconductor devices,
The accuracy of positioning when mounting a semiconductor device on a mounting board becomes stricter due to the reduction in the lead-to-lead pitch of the external leads due to the increase in the number of pins of the external leads of the semiconductor device and the reduction in the package of the semiconductor device. ing. As a countermeasure, a semiconductor device package having a plurality of protrusions on its back surface is disclosed in Japanese Patent Laid-Open No. 62-95252.

As shown in FIG. 3, this package is provided with a plurality of positioning projections 5 on the back surface of the package body 10 facing the mounting board 2, and the mounting board 2 is provided with positioning holes 6. By providing the semiconductor device, the semiconductor device can be accurately mounted on the mounting substrate 2.

[0004]

The semiconductor device using this conventional package has a problem that it cannot be mounted unless the mounting board to be mounted is provided with a positioning hole. In addition, there is a problem that a mounting failure occurs because no countermeasure is taken for reverse mounting in which the pin array is to be mounted in the opposite direction (180 ° inversion).

[0005]

A semiconductor device according to the present invention is provided with a plurality of positioning holes on the bottom surface of a package facing a mounting substrate.

If the mounting board is provided with a positioning projection, the semiconductor device can be mounted on the mounting board with high accuracy. Further, by providing three positioning holes, it is possible to take measures against reverse mounting, and it is also possible to mount on a mounting board having no protrusion.

[0007]

The present invention will be described below with reference to the drawings.

1A and 1B are a front view and a bottom view of an embodiment of the present invention.

Three holes 3 for positioning having a depth of about 0.5 mm and a width of about 1 mm are provided on the bottom surface of the package facing the mounting substrate 2 of the resin mold type semiconductor device 1.

When the semiconductor device 1 is mounted on the mounting substrate 2 by providing the positioning protrusion 4 on the mounting substrate 2 at the same position as the positioning hole 3, the semiconductor device 1 is positioned on the mounting substrate 2. By inserting the protrusions 4 on the mounting substrate 2 into the holes 3, it is possible to prevent displacement due to vibration or the like before mounting and to mount with high accuracy. Further, by providing the positioning portions at three positions, reverse mounting can be prevented and mounting defects can be reduced. The same effect can be obtained even if the position of the positioning hole 3 is as shown in FIG.

[0011]

As described above, the semiconductor device of the present invention can be mounted with high accuracy by providing a plurality of positioning holes at the bottom of the package facing the mounting substrate during mounting. Further, since reverse mounting can be prevented, it is possible to reduce mounting defects. or,
It can be mounted even if the mounting board does not have a positioning protrusion.

[Brief description of drawings]

FIG. 1 is a front view and a bottom view of an embodiment of the present invention.

FIG. 2 is a bottom view of another embodiment of the present invention.

FIG. 3 is a front view of an example of a conventional semiconductor device.

[Explanation of symbols]

 1 semiconductor device 2 mounting substrate 3 hole 4 protrusion 5 protrusion 6 hole 10 package body

Claims (1)

[Claims] 1. A semiconductor device, wherein a plurality of positioning holes are provided in a bottom surface portion of a semiconductor device package facing a mounting substrate during mounting.