JPH0541169U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH0541169U JPH0541169U JP9018391U JP9018391U JPH0541169U JP H0541169 U JPH0541169 U JP H0541169U JP 9018391 U JP9018391 U JP 9018391U JP 9018391 U JP9018391 U JP 9018391U JP H0541169 U JPH0541169 U JP H0541169U
- Authority
- JP
- Japan
- Prior art keywords
- substrate body
- circuit board
- printed circuit
- slit
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】
【目的】 本考案は、基板本体11に実装された電子部品
に生じる応力を抑制し、電子部品の特性劣化や破壊を防
止して、信頼性を安価に向上させることを目的とするも
のである。
【構成】 基板本体11に、その周縁部からねじ止め用孔
11ａの周辺に延びるスリット11ｂを設け、基板本体11が
反りを有する場合や取付部にずれがある場合などに、基
板本体11の電子部品が実装された部分に変形による応力
が生じるのを防止した。
(57) [Abstract] [Purpose] The present invention aims to suppress the stress generated in the electronic components mounted on the substrate main body 11, prevent the characteristic deterioration and destruction of the electronic components, and improve the reliability at low cost. It is intended. [Structure] Board main body 11 has screw holes from its peripheral edge
A slit 11b extending around 11a is provided to prevent stress due to deformation in a portion of the substrate body 11 on which electronic components are mounted when the substrate body 11 has a warp or a mounting portion is displaced. .
Description
【０００１】[0001]
請求項１及び請求項２の考案は、プリント基板の取付状態における応力発生防 止に関するものである。 The inventions of claims 1 and 2 relate to prevention of stress generation in a mounted state of a printed circuit board.
【０００２】[0002]
図５は従来のプリント基板の一例を示す斜視図である。図において、基板本体 １の周縁部近傍には、４つのねじ止め用孔１ａが設けられている。基板本体１は 、例えば図６に示すように、製造上発生したある程度の反り（ひわり）を有して いることがある。 FIG. 5 is a perspective view showing an example of a conventional printed circuit board. In the figure, four screw holes 1a are provided near the peripheral edge of the substrate body 1. The substrate body 1 may have a certain degree of warpage (cracking) that has occurred during manufacturing, as shown in FIG. 6, for example.
【０００３】 上記のような従来のプリント基板は、図７に示すように、基板本体１の表面に 電子部品（図示せず）が実装された後、ねじ止め用孔１ａを貫通するねじ２によ り、例えば電子機器筐体などの取付部３上にねじ止め固定される。As shown in FIG. 7, in the conventional printed circuit board as described above, after an electronic component (not shown) is mounted on the surface of the substrate body 1, a screw 2 penetrating the screw hole 1a is mounted. Therefore, for example, it is screwed and fixed on the mounting portion 3 such as an electronic device housing.
【０００４】[0004]
上記のように構成された従来のプリント基板においては、基板本体１が反りを 有していると、取付部３に固定したとき基板本体１が変形し、図７のＡ，Ｂに示 すような範囲で基板本体１に応力が生じる。また、図８に示すように、寸法誤差 等により取付部３がずれて、取付部３の平面度が低くなると、Ｃに示すような範 囲で基板本体１に応力が生じる。一方、基板本体１に実装された電子部品には、 温度変化による温度ストレスが生じるので、基板本体１の応力発生部分に実装さ れた電子部品には、通常の温度ストレスに加えて基板本体１の変形による応力が 生じめことになり、従って電子部品に特性劣化や破壊が発生する恐れがあり、こ のプリント基板が装着される機器の信頼性が低下するという問題点があった。ま た、例えば実開平２−１１８２４号公報には、印刷配線板に切溝を設けたものが 示されているが、この切溝は、コネクタとの接続の際に、反りによる支障が生じ ないようにしたものであり、上記の問題点は解決できなかった。 In the conventional printed circuit board configured as described above, if the board body 1 has a warp, the board body 1 is deformed when it is fixed to the mounting portion 3, and as shown in A and B of FIG. The stress is generated in the substrate body 1 in such a range. Further, as shown in FIG. 8, when the mounting portion 3 is displaced due to a dimensional error or the like and the flatness of the mounting portion 3 becomes low, stress is generated in the substrate body 1 in the range shown in C. On the other hand, the electronic components mounted on the board body 1 are subject to temperature stress due to temperature changes. This causes stress due to the deformation, and therefore, there is a possibility that characteristic deterioration or destruction may occur in the electronic component, and there is a problem in that the reliability of the equipment on which this printed circuit board is mounted decreases. In addition, for example, Japanese Utility Model Laid-Open No. 2-11824 discloses a printed wiring board provided with a kerf, but this kerf does not cause any trouble due to warpage when connecting to a connector. However, the above problems could not be solved.
【０００５】 請求項１及び請求項２の考案は、上記のような問題点を解決することを課題と してなされたものであり、基板本体に実装された電子部品に生じる応力を抑制し て、電子部品の特性劣化や破壊を防止することができ、信頼性を向上させること ができるプリント基板を得ることを目的とする。The inventions of claims 1 and 2 have been made to solve the above problems, and suppress the stress generated in the electronic components mounted on the substrate body. The purpose of the present invention is to obtain a printed circuit board that can prevent the characteristic deterioration and destruction of electronic components and improve the reliability.
【０００６】[0006]
請求項１の考案に係るプリント基板は、周縁部からねじ止め用孔の周辺に延び るスリットを基板本体に設けたものである。 In the printed circuit board according to the invention of claim 1, a slit extending from the peripheral portion to the periphery of the screwing hole is provided in the substrate body.
【０００７】 請求項２の考案に係るプリント基板は、周縁部から周縁部近傍のねじ止め用孔 の周辺に延びる第１のスリットと、中央部のねじ止め用孔の周辺に位置する第２ のスリットとを、基板本体に設けたものである。The printed circuit board according to the invention of claim 2 has a first slit extending from the peripheral portion to the periphery of the screwing hole in the vicinity of the peripheral portion, and a second slit located around the screwing hole in the central portion. The slit is provided in the substrate body.
【０００８】[0008]
請求項１及び請求項２の考案においては、基板本体のねじ止め用孔の周辺部を 他の部分からスリットで分離させ、この分離された部分に変形を集中させて、電 子部品が実装された部分の変形を防止する。 According to the first and second aspects of the invention, the peripheral portion of the screwing hole of the substrate body is separated from the other portion by the slit, and the deformation is concentrated on the separated portion to mount the electronic component. Prevents deformation of the broken part.
【０００９】[0009]
以下、請求項１及び請求項２の考案の実施例を図について説明する。 実施例１． 図１は請求項１の考案の一実施例によるプリント基板を示す斜視図である。図 において、基板本体11には、従来例と同様にねじ止め用孔11ａが設けられている 。基板本体11の各ねじ止め用孔11ａの両側には、それぞれ基板本体11の周縁部か ら短辺方向（図１の左右方向）に延びるスリット11ｂが設けられている。 Embodiments of the inventions of claims 1 and 2 will be described below with reference to the drawings. Example 1. 1 is a perspective view showing a printed circuit board according to an embodiment of the present invention. In the figure, the board body 11 is provided with screw holes 11a as in the conventional example. Slits 11b extending from the peripheral edge portion of the substrate body 11 in the short side direction (left-right direction in FIG. 1) are provided on both sides of each screwing hole 11a of the substrate body 11.
【００１０】 このようなプリント基板では、従来例と同様に電子部品が実装された基板本体 11が、ねじ２により取付部３にねじ止め固定される。このとき、基板本体11には スリット11ｂが設けられているので、基板本体11が反りを有している場合でも、 図２に示すように、スリット11ｂの内側のねじ止め用孔11ａの周辺部が他の部分 から分離され、上記周辺部に変形が集中し、基板本体11の他の部分は殆ど変形し ない。また、寸法誤差等により取付部３にずれが生じた場合も、図３に示すよう に、ねじ止め用孔11ａの周辺部に変形が集中し、基板本体11の他の部分は殆ど変 形しない。In such a printed board, the board body 11 on which electronic components are mounted is screwed and fixed to the mounting portion 3 by the screw 2 as in the conventional example. At this time, since the board body 11 is provided with the slit 11b, even when the board body 11 has a warp, as shown in FIG. 2, the peripheral portion of the screw fastening hole 11a inside the slit 11b is formed. Are separated from other portions, deformation is concentrated on the peripheral portion, and other portions of the substrate body 11 are hardly deformed. Also, when the mounting portion 3 is displaced due to a dimensional error or the like, as shown in FIG. 3, the deformation is concentrated on the periphery of the screw hole 11a, and the other parts of the substrate body 11 are hardly deformed. .
【００１１】 従って、基板本体11の電子部品が実装された部分に生じる応力が抑制され、電 子部品に生じる応力も抑制される。この結果、電子部品の特性劣化や破壊が防止 され、プリント基板全体の信頼性が向上する。Therefore, the stress generated in the portion of the substrate body 11 on which the electronic component is mounted is suppressed, and the stress generated in the electronic component is also suppressed. As a result, the characteristic deterioration and destruction of electronic components are prevented, and the reliability of the entire printed circuit board is improved.
【００１２】 なお、上記実施例ではねじ止め用孔11ａの両側にスリット11ｂを設けたが、例 えばねじ止め用孔11ａが基板本体11のコーナー部に位置する場合などには、ねじ 止め用孔11ａの片側にのみスリット11ｂを設けてもよい。 また、上記実施例では直線状のスリット11ｂを示したが、スリット11ｂをＬ字 状にして、ねじ止め用孔11ａを２方向から囲むように設けてもよい。 さらに、上記実施例では総てのねじ止め用孔11ａの周辺にスリット11ｂを設け たが、一部のねじ止め用孔11ａの周辺にのみ必要に応じて設けてもよい。Although the slits 11b are provided on both sides of the screw-fastening hole 11a in the above embodiment, for example, when the screw-fastening hole 11a is located at the corner of the substrate body 11, the screw-fastening hole 11a is provided. The slit 11b may be provided only on one side of 11a. Further, although the linear slit 11b is shown in the above embodiment, the slit 11b may be formed in an L shape so as to surround the screwing hole 11a from two directions. Further, in the above embodiment, the slits 11b are provided around all the screw fastening holes 11a, but they may be provided only around some of the screw fastening holes 11a, if necessary.
【００１３】 実施例２． 図４は請求項２の考案の一実施例によるプリント基板を示す平面図である。図 において、基板本体21には、実施例１と同様の周縁部近傍の他に、中央部にもね じ止め用孔21ａが設けられている。基板本体21の周縁部近傍の４つのねじ止め用 孔21ａの両側には、基板本体21の周縁部から短辺方向に延びる第１のスリット21 ｂが設けられている。基板本体21の中央部のねじ止め用孔21ａの周辺、即ち基板 本体21の長辺方向両側には、短辺方向に延びる第２のスリット21ｃが設けられて いる。Example 2. FIG. 4 is a plan view showing a printed circuit board according to an embodiment of the present invention. In the figure, the substrate main body 21 is provided with a screwing hole 21a in the central portion as well as in the vicinity of the peripheral portion similar to the first embodiment. First slits 21b extending in the short side direction from the peripheral portion of the substrate body 21 are provided on both sides of the four screw holes 21a near the peripheral portion of the substrate body 21. A second slit 21c extending in the short side direction is provided around the screw hole 21a at the center of the substrate body 21, that is, on both sides of the substrate body 21 in the long side direction.
【００１４】 このように、基板本体21の面積が広い場合などには、基板本体21の中央部にも ねじ止め用孔21ａが設けられていることが多い。この場合、プリント配線や基板 本体21自体の強度に問題が生じるので、基板本体21の周縁部からスリットを延ば すことは困難である。従って、この実施例のように、基板本体21の周縁部近傍の ねじ止め用孔21ａに対しては、実施例１と同様の第１のスリット21ｂを設け、基 板本体21の中央部のねじ止め用孔21ａに対しては、両端が基板本体21内に位置す る第２のスリット21ｃを設けている。As described above, when the area of the substrate body 21 is large, the screwing hole 21a is often provided in the central portion of the substrate body 21 as well. In this case, it is difficult to extend the slit from the peripheral edge of the board body 21 because problems occur in the strength of the printed wiring and the board body 21 itself. Therefore, as in this embodiment, the first slit 21b similar to that of the first embodiment is provided in the screwing hole 21a near the peripheral portion of the substrate body 21, and the screw at the central portion of the substrate body 21 is provided. The stopper hole 21a is provided with a second slit 21c whose both ends are located inside the substrate body 21.
【００１５】 このような第２のスリット21ｃを設けることにより、中央部でねじ止め固定し たときに基板本体21に生じる応力もある程度抑えることができ、中央部にねじ止 め用孔21ａを有する基板本体21を用いたプリント基板についても、取付時の電子 部品に生じる応力を抑えることができる。By providing such a second slit 21c, the stress generated in the substrate body 21 when screwed and fixed in the central portion can be suppressed to some extent, and the screwing hole 21a is provided in the central portion. Also for the printed circuit board using the circuit board body 21, it is possible to suppress the stress generated in the electronic component at the time of mounting.
【００１６】 なお、第１のスリット21ｂについては実施例１で説明したような変形，変更が 可能であるのは言うまでもないが、第２のスリット21ｃについても、その形状や 数は限定されない。例えば、第２のスリット21ｃをＬ字状やコ字状にしたり、直 線状の４本の第２のスリット21ｃを、ねじ止め用孔21ａを囲むように配置したり してもよい。Needless to say, the first slit 21b can be modified and changed as described in the first embodiment, but the shape and number of the second slit 21c are not limited. For example, the second slit 21c may be L-shaped or U-shaped, or the four second linear slits 21c may be arranged so as to surround the screwing hole 21a.
【００１７】[0017]
以上説明したように、請求項１の考案のプリント基板は、周縁部からねじ止め 用孔の周辺に延びるスリットを基板本体に設けたので、基板本体の電子部品が実 装された部分に取付時に生じる応力を抑えることができ、これにより電子部品に 生じる応力も抑制され、電子部品の特性劣化や破壊を防止することができ、この 結果信頼性を安価に向上させることができるなどの効果を奏する。 As described above, in the printed circuit board according to the first aspect of the present invention, the slit extending from the peripheral portion to the periphery of the screw hole is provided in the board body, so that when mounting the electronic part of the board body on the mounted part. It is possible to suppress the stress that is generated, which also suppresses the stress that is generated in the electronic component, it is possible to prevent the characteristic deterioration and destruction of the electronic component, and as a result, it is possible to improve the reliability at low cost. .
【００１８】 また、請求項２の考案のプリント基板は、周縁部から周縁部近傍のねじ止め用 孔の周辺に延びる第１のスリットと、中央部のねじ止め用孔の周辺に位置する第 ２のスリットとを、基板本体に設けたので、基板本体の中央部にねじ止め用孔が 存在する場合にも、上記請求項１の考案の効果と同様の効果を奏する。In the printed circuit board according to the second aspect of the present invention, the first slit extending from the peripheral edge to the periphery of the screwing hole near the peripheral edge and the second slit located in the periphery of the central screwing hole. Since the slit is provided in the substrate body, the same effect as that of the invention of claim 1 can be obtained even when the hole for screwing exists in the central portion of the substrate body.
【図１】請求項１の考案の一実施例によるプリント基板
を示す斜視図である。FIG. 1 is a perspective view showing a printed circuit board according to an embodiment of the present invention.
【図２】基板本体が反りを有する場合の図１のプリント
基板を取付部にねじ止め固定した状態を示す側面図であ
る。FIG. 2 is a side view showing a state in which the printed circuit board of FIG. 1 is screwed and fixed to a mounting portion when the substrate body has a warp.
【図３】図１のプリント基板を位置ずれした取付部にね
じ止め固定した状態を示す側面図である。FIG. 3 is a side view showing a state in which the printed circuit board of FIG. 1 is screwed and fixed to a positionally displaced mounting portion.
【図４】請求項２の考案の一実施例によるプリント基板
を示す平面図である。FIG. 4 is a plan view showing a printed circuit board according to an embodiment of the present invention.
【図５】従来のプリント基板の一例を示す斜視図であ
る。FIG. 5 is a perspective view showing an example of a conventional printed circuit board.
【図６】基板本体が反りを有する場合の図５のプリント
基板の断面図である。6 is a cross-sectional view of the printed circuit board of FIG. 5 when the substrate body has a warp.
【図７】図６のプリント基板を取付部にねじ止め固定し
た状態を示す側面図である。7 is a side view showing a state in which the printed circuit board of FIG. 6 is screwed and fixed to a mounting portion.
【図８】図５のプリント基板を位置ずれした取付部にね
じ止め固定した状態を示す側面図である。8 is a side view showing a state in which the printed circuit board of FIG. 5 is screwed and fixed to a mounting portion that is displaced.
11 基板本体 11ａ ねじ止め用孔 11ｂ スリット 21 基板本体 21ａ ねじ止め用孔 21ｂ 第１のスリット 21ｃ 第２のスリット 11 board body 11a screw fastening hole 11b slit 21 board body 21a screw fastening hole 21b first slit 21c second slit
Claims (2)
えているプリント基板において、前記基板本体には、そ
の周縁部から前記ねじ止め用孔の周辺に延びるスリット
が設けられていることを特徴とするプリント基板。1. A printed circuit board having a substrate body provided with screwing holes, wherein the substrate body is provided with a slit extending from a peripheral portion of the substrate body to the periphery of the screwing hole. Characterized printed circuit board.
それぞれ設けられた基板本体を備えているプリント基板
において、前記基板本体には、その周縁部から前記周縁
部近傍のねじ止め用孔の周辺に延びる第１のスリット
と、前記中央部のねじ止め用孔の周辺に位置する第２の
スリットとが設けられていることを特徴とするプリント
基板。2. A printed circuit board comprising a substrate body having screw fastening holes provided in the vicinity of the peripheral edge and in the central portion thereof, wherein the substrate body has screw fastening holes from the peripheral edge to the vicinity of the peripheral edge. A printed circuit board, wherein a first slit extending to the periphery of the printed circuit board and a second slit located around the screwing hole in the central portion are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9018391U JPH0541169U (en) | 1991-11-01 | 1991-11-01 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9018391U JPH0541169U (en) | 1991-11-01 | 1991-11-01 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0541169U true JPH0541169U (en) | 1993-06-01 |
Family
ID=13991378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9018391U Pending JPH0541169U (en) | 1991-11-01 | 1991-11-01 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541169U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002344092A (en) * | 2001-05-17 | 2002-11-29 | Denso Corp | Printed board |
| JP2011018677A (en) * | 2009-07-07 | 2011-01-27 | Fujitsu Ltd | Semiconductor device, method of manufacturing semiconductor device, and electronic equipment |
| JP2012216672A (en) * | 2011-03-31 | 2012-11-08 | Toshiba Corp | Storage device, electronic apparatus, and substrate assembly |
| JP2014099572A (en) * | 2012-11-16 | 2014-05-29 | Honda Motor Co Ltd | Circuit board fixed while being held by mechanical structure, and controller using the same |
| JP2016162944A (en) * | 2015-03-04 | 2016-09-05 | アンリツ株式会社 | Printed circuit board and printed circuit board coupling structure using the same |
| JPWO2022172900A1 (en) * | 2021-02-12 | 2022-08-18 |
-
1991
- 1991-11-01 JP JP9018391U patent/JPH0541169U/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002344092A (en) * | 2001-05-17 | 2002-11-29 | Denso Corp | Printed board |
| JP2011018677A (en) * | 2009-07-07 | 2011-01-27 | Fujitsu Ltd | Semiconductor device, method of manufacturing semiconductor device, and electronic equipment |
| JP2012216672A (en) * | 2011-03-31 | 2012-11-08 | Toshiba Corp | Storage device, electronic apparatus, and substrate assembly |
| JP2014099572A (en) * | 2012-11-16 | 2014-05-29 | Honda Motor Co Ltd | Circuit board fixed while being held by mechanical structure, and controller using the same |
| JP2016162944A (en) * | 2015-03-04 | 2016-09-05 | アンリツ株式会社 | Printed circuit board and printed circuit board coupling structure using the same |
| JPWO2022172900A1 (en) * | 2021-02-12 | 2022-08-18 |
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