JP2000244153A - Electronic control unit - Google Patents

Electronic control unit

Info

Publication number
JP2000244153A
JP2000244153A JP11220834A JP22083499A JP2000244153A JP 2000244153 A JP2000244153 A JP 2000244153A JP 11220834 A JP11220834 A JP 11220834A JP 22083499 A JP22083499 A JP 22083499A JP 2000244153 A JP2000244153 A JP 2000244153A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
case
electronic control
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11220834A
Other languages
Japanese (ja)
Other versions
JP3675243B2 (en
Inventor
Junichi Kondo
潤一 近藤
Toshinori Matsui
俊憲 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP22083499A priority Critical patent/JP3675243B2/en
Publication of JP2000244153A publication Critical patent/JP2000244153A/en
Application granted granted Critical
Publication of JP3675243B2 publication Critical patent/JP3675243B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To surely load a printed board in a case of a simple constitution, without being affected by variations of board thickness, etc. SOLUTION: A plurality of projection parts 12a, 12b are formed alternately at a bottom part 11b of an inner wall surface of a case 11 keeping a space to both sides of a printed board 15. Therefore, even if the printed board 15 is a slightly large in thickness with respect to the prescribed dimensional interval of the projection parts 12a, 12b, it is bent along the protrusions 12a, 12b and fixed surely to a prescribed position. Thereby, a highly reliable electronic control unit can be constituted, without causing built-in defects when the printed board 15 is loaded in the case 11 and without causing damages, etc., in a wiring pattern of the printed board 15, a mounted electronic component, etc.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、複数の電子部品を
実装するプリント基板をケースに収容してなる電子制御
機器に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic control device in which a printed circuit board on which a plurality of electronic components are mounted is housed in a case.

【0002】[0002]

【従来の技術】従来、図7の部分断面斜視図にて示すよ
うに、袋構造のケース31に複数の電子部品(図示略)
を実装したプリント基板35をその基板平面に沿った方
向に挿入し、ケース31の内壁面の底部31bに形成さ
れたレール状の対向する2本の突起部32a,32bを
利用し、その端縁面を挟持し固定するようにした電子制
御機器が知られている。このプリント基板35は挿入先
端の端縁面が突起部32a,32bにて挟持され固定さ
れたのち、ケース31の開口部側がねじ等にて固定され
組付完了とされている。
2. Description of the Related Art Conventionally, as shown in a partially sectional perspective view of FIG.
Is inserted in the direction along the plane of the board, and two rail-shaped opposed projections 32a and 32b formed on the bottom 31b of the inner wall surface of the case 31 are used to insert the printed circuit board 35 into its edge. 2. Description of the Related Art An electronic control device in which a surface is sandwiched and fixed is known. The printed circuit board 35 is fixed after the end edge surface of the insertion tip is sandwiched and fixed by the projections 32a and 32b, and the opening side of the case 31 is fixed by screws or the like.

【0003】[0003]

【発明が解決しようとする課題】ところで、前述のもの
では、ケースの内壁面の底部31bに形成されたプリン
ト基板35を挟持するための突起部32a,32bの隙
間寸法は、用いられるプリント基板35の板厚によって
規定されることとなる。そこで、図8(a)に示すよう
に、ケースの内壁面の底部31bに形成された突起部3
2a,32bの隙間寸法に対してプリント基板35の板
厚が薄いときにはガタツキがでるため、ケース側にかか
る振動や衝撃等によって異音発生やプリント基板35の
配線パターン(図示略)や実装された電子部品に損傷等
が生じるという不具合があった。
By the way, in the above-mentioned case, the size of the gap between the projections 32a and 32b for holding the printed board 35 formed on the bottom 31b of the inner wall surface of the case is determined by the printed board 35 used. Is determined by the thickness of the sheet. Therefore, as shown in FIG. 8A, the protrusion 3 formed on the bottom 31b of the inner wall surface of the case.
When the thickness of the printed circuit board 35 is small with respect to the gap size between 2a and 32b, rattling occurs. Therefore, abnormal noise is generated due to vibration or impact applied to the case side, or the wiring pattern (not shown) of the printed circuit board 35 or mounted. There was a problem that electronic parts were damaged.

【0004】一方、図8(b)に示すように、プリント
基板35′側の総厚みはそれ自身の板厚に例えば、防湿
処理が施されているときには防湿剤36塗布による厚み
増加分が加算されることとなる。このプリント基板3
5′への防湿剤36塗布による厚み増加分は工程管理が
極めて難しく、仕上がりの総厚みに対するばらつきが大
きいこととなる。これに加え、防湿処理が施されプリン
ト基板35′の端縁面に防湿剤36が溜まって固着状態
となっているようなときには、プリント基板35′の端
縁面がケースの内壁面の底部31bに形成された突起部
32a,32bの対向する隙間寸法に入りきらないこと
で組付不良となるという不具合があった。
On the other hand, as shown in FIG. 8 (b), the total thickness of the printed circuit board 35 'is added to its own thickness by, for example, the thickness increase due to the application of the moisture proof agent 36 when the moisture proof treatment is applied. Will be done. This printed circuit board 3
The increase in the thickness due to the application of the moisture-proofing agent 36 to the 5 'is extremely difficult to control the process, and the variation in the total thickness of the finish is large. In addition, when the moisture-proofing treatment is performed and the moisture-proofing agent 36 accumulates on the edge surface of the printed circuit board 35 'and is in a fixed state, the edge surface of the printed circuit board 35' is fixed to the bottom 31b of the inner wall surface of the case. In this case, the protrusions 32a and 32b formed in the above-mentioned parts do not fit in the gap between the protrusions 32a and 32b.

【0005】そこで、この発明はかかる不具合を解決す
るためになされたもので、プリント基板をその板厚等の
ばらつきに影響されることなく簡単な構成からなるケー
スに収容し確実に固定することが可能な電子制御機器の
提供を課題としている。
In view of the above, the present invention has been made to solve such a problem, and it is possible to accommodate a printed circuit board in a case having a simple structure without being affected by variations in the thickness of the printed circuit board and securely fix it. The task is to provide possible electronic control devices.

【0006】[0006]

【課題を解決するための手段】請求項1の電子制御機器
によれば、ケースの内壁面の底部に形成された複数の突
起部はプリント基板の表裏面に対して間隔をあけて形成
されている。このため、ケースの内壁面の底部に形成さ
れた突起部の所定の寸法間隔とほぼ等しい板厚のプリン
ト基板では、元々の平面状態が維持され所定位置に確実
に固定される。また、ケースの内壁面の底部に形成され
た突起部の所定の寸法間隔より板厚が厚いプリント基板
であっても、それら突起部に沿って湾曲され所定位置に
確実に固定される。これにより、プリント基板をその基
板平面に沿った方向に挿入しケースに収容する際に組付
不良が発生せず、プリント基板の配線パターンや実装さ
れた電子部品等に損傷等が生じることもない。即ち、プ
リント基板の層構成や防湿剤等による板厚のばらつきに
影響されることなく簡単な構成にてプリント基板をケー
ス内の所定位置に確実に固定することができ、振動や衝
撃に対して信頼性の高い電子制御機器を構築することが
できる。また、電子制御機器の複数の仕様に対してケー
スの共通化が達成できるためコスト削減が可能となる。
According to the electronic control device of the present invention, the plurality of projections formed on the bottom of the inner wall surface of the case are formed at intervals on the front and back surfaces of the printed circuit board. I have. For this reason, in the case of a printed circuit board having a thickness substantially equal to a predetermined dimension interval of the projection formed on the bottom of the inner wall surface of the case, the original flat state is maintained and the printed circuit board is securely fixed at the predetermined position. Further, even if the printed circuit board is thicker than a predetermined dimension interval of the projections formed on the bottom of the inner wall surface of the case, it is curved along the projections and securely fixed at a predetermined position. As a result, when the printed circuit board is inserted in a direction along the plane of the board and accommodated in the case, no assembly failure occurs, and no damage occurs to the wiring pattern of the printed circuit board, the mounted electronic components, and the like. . In other words, the printed circuit board can be securely fixed at a predetermined position in the case with a simple structure without being affected by variations in the thickness of the printed circuit board due to a layer structure or a moisture proof agent. A highly reliable electronic control device can be constructed. In addition, since a common case can be achieved for a plurality of specifications of the electronic control device, the cost can be reduced.

【0007】請求項2の電子制御機器では、プリント基
板に形成されたスリット状の切込部によって、プリント
基板の突起部による固定に伴う変形領域を少なくするこ
とができるのである。このため、プリント基板をケース
内の所定位置に確実に固定することができ、振動や衝撃
に対して信頼性の高い電子制御機器を構築することがで
きる。また、電子制御機器の複数の仕様に対してケース
の共通化が達成できるためコスト削減が可能となる。
According to the electronic control device of the second aspect, the slit-shaped cut portion formed on the printed board can reduce the deformation area due to the fixing of the printed board by the projection. Therefore, the printed circuit board can be securely fixed at a predetermined position in the case, and an electronic control device having high reliability against vibration and impact can be constructed. In addition, since a common case can be achieved for a plurality of specifications of the electronic control device, the cost can be reduced.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施の形態を実施
例に基づいて説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on examples.

【0009】図1は本発明の実施の形態の一実施例にか
かる電子制御機器の全体構成を示す断面図である。ま
た、図2は図1の電子制御機器のケースにおけるプリン
ト基板の固定状態を示す部分断面斜視図である。なお、
図2ではプリント基板の配線パターンや実装された電子
部品等は省略されている。
FIG. 1 is a sectional view showing the overall configuration of an electronic control device according to an embodiment of the present invention. FIG. 2 is a partial sectional perspective view showing a fixed state of a printed circuit board in the case of the electronic control device of FIG. In addition,
In FIG. 2, a wiring pattern of a printed circuit board, mounted electronic components, and the like are omitted.

【0010】図1及び図2において、10は電子制御機
器としての電子制御ユニット(Electronic Control Uni
t;以下、『ECU』と記す)であり、ECU10は例え
ば、アルミニウム合金ダイカスト製の略直方体形状で袋
構造のケース11には、種々の電子部品16a,16b
等が実装されたプリント基板15が収容されている。こ
のECU10のケース11の上端面には開口部11aが
形成され、この開口部11a側からプリント基板15が
その基板平面に沿った方向に挿入されている。ケース1
1の内壁面の底部11bには、プリント基板15の表裏
面に対して所定の寸法間隔にて交互に複数の突起部12
a,12bが形成されている。
1 and 2, reference numeral 10 denotes an electronic control unit as an electronic control device.
t; hereinafter referred to as “ECU”). The ECU 10 includes, for example, various electronic components 16a and 16b in a case 11 having a bag shape and a substantially rectangular parallelepiped shape made of aluminum alloy die-casting.
And the like are accommodated therein. An opening 11a is formed in the upper end surface of the case 11 of the ECU 10, and a printed circuit board 15 is inserted from the opening 11a side in a direction along the plane of the board. Case 1
A plurality of protrusions 12 are alternately arranged at predetermined intervals on the front and back surfaces of the printed circuit board 15 on the bottom 11b of the inner wall surface of the printed circuit board 15.
a, 12b are formed.

【0011】プリント基板15に実装されている種々の
電子部品16a,16b等のうち、発熱性を有する電子
部品16aはアルミニウム板材等からなり放熱性の良好
なヒートシンク17面にねじ、接着剤等により密着され
固定されている。このヒートシンク17はプリント基板
15にねじ止めされ固定されている。また、プリント基
板15には外部接続コネクタ18がはんだ付けされ固設
されている。
Of the various electronic components 16a and 16b mounted on the printed circuit board 15, the heat-generating electronic component 16a is made of an aluminum plate or the like, and is mounted on a heat sink 17 having good heat radiation by means of screws, adhesive or the like. Closely attached and fixed. The heat sink 17 is fixed to the printed circuit board 15 by screws. An external connector 18 is soldered and fixed to the printed circuit board 15.

【0012】プリント基板15はECU10のケース1
1の内壁面の底部11bに形成された突起部12a,1
2b間に挿入され、ヒートシンク17がECU10のケ
ース11に穿たれた貫通穴(図示略)を介してねじ13
にて固定されている。このように、ECU10のケース
11にプリント基板15がその基板平面に沿った方向に
挿入されたとき、外部接続コネクタ18はケース11の
開口部11a側に位置され、この外部接続コネクタ18
の周囲でケース11の開口部11a側を覆うようケース
蓋19がねじ等にて固定されることでECU10が組付
完了とされる。
The printed circuit board 15 is the case 1 of the ECU 10.
Projection portions 12a, 1 formed on bottom 11b of inner wall surface
2b, and the heat sink 17 is screwed through a through hole (not shown) formed in the case 11 of the ECU 10.
It is fixed at. As described above, when the printed board 15 is inserted into the case 11 of the ECU 10 in a direction along the plane of the board, the external connector 18 is positioned on the opening 11a side of the case 11, and the external connector 18
When the case lid 19 is fixed with screws or the like so as to cover the opening 11a side of the case 11 around the ECU 10, the assembly of the ECU 10 is completed.

【0013】次に、本実施例の作用について、図1のA
−A線に沿う断面を示す図3を参照して説明する。
Next, the operation of this embodiment will be described with reference to FIG.
This will be described with reference to FIG. 3 showing a cross section taken along line -A.

【0014】上述したように、ECU10のケース11
にプリント基板15が収容された組付完了状態では、プ
リント基板15の挿入先端側の端縁面はケース11の内
壁面の底部11bに形成された複数の突起部12a,1
2bにその表裏面が挟持され固定されている。ここで、
ECU10のケース11の内壁面の底部11bに形成さ
れた突起部12a,12b間の寸法間隔は、設計上、用
いられるプリント基板15の寸法公差等を考慮した最小
の板厚寸法に設定される。
As described above, the case 11 of the ECU 10
When the printed circuit board 15 is accommodated in the assembled state, the edge surface of the printed circuit board 15 on the insertion front end side has a plurality of protrusions 12 a, 1 formed on the bottom 11 b of the inner wall surface of the case 11.
The front and back surfaces are sandwiched and fixed to 2b. here,
The dimension interval between the projections 12a and 12b formed on the bottom 11b of the inner wall surface of the case 11 of the ECU 10 is set to the minimum thickness in consideration of the dimensional tolerance of the printed board 15 used in design.

【0015】図3(a)に示すように、ECU10のケ
ース11の内壁面の底部11bに形成された突起部12
a,12b間の寸法間隔に対してプリント基板15の板
厚が一致している状態では、プリント基板15は元々の
平面状態が維持されその表裏面が突起部12a,12b
間に挟持されガタツキなく確実に固定される。
As shown in FIG. 3A, a projection 12 formed on the bottom 11b of the inner wall surface of the case 11 of the ECU 10 is provided.
In a state where the thickness of the printed circuit board 15 matches the dimensional interval between the printed circuit boards 15a and 12b, the printed circuit board 15 maintains its original flat state, and the front and back surfaces thereof have the projections 12a and 12b.
It is sandwiched between and fixed securely without rattling.

【0016】また、図3(b)に示すように、ECU1
0のケース11の内壁面の底部11bに形成された突起
部12a,12b間の寸法間隔に対して寸法公差、層構
成の相違や防湿剤塗布によって板厚が厚くなった状態の
プリント基板15′においては、プリント基板15′側
が突起部12a,12bに沿って湾曲されその表裏面が
突起部12a,12b間に挟持されガタツキなく確実に
固定される。この際、用いることが可能なプリント基板
15′の最大厚みは、ケース11の内壁面の底部11b
に形成されている突起部12a,12bによる湾曲によ
ってその配線パターンや実装された電子部品に損傷等が
生じない程度に収まるよう予め規定されている。
Further, as shown in FIG.
The printed circuit board 15 ′ has a large thickness due to a dimensional tolerance, a difference in a layer configuration, or a moisture-proof agent applied to a dimensional interval between the protrusions 12 a and 12 b formed on the bottom 11 b of the inner wall surface of the case 11. In the above, the printed circuit board 15 'side is curved along the projections 12a and 12b, and its front and back surfaces are sandwiched between the projections 12a and 12b, and are securely fixed without rattling. At this time, the maximum thickness of the printed board 15 ′ that can be used is the bottom 11 b of the inner wall surface of the case 11.
The wiring patterns and the mounted electronic components are defined in advance so as not to cause damage to the wiring patterns and the mounted electronic components due to the curvature of the projections 12a and 12b formed on the substrate.

【0017】なお、ケース11の内壁面の底部11bに
形成された突起部12a,12bに対して、プリント基
板15(15′)の挟持側の各先端側に面取り形状のよ
うな傾斜面を形成すれば、それら突起部12a,12b
間にプリント基板15(15′)を挿入し易くすること
ができ作業性を向上することができる。
The projections 12a and 12b formed on the bottom 11b of the inner wall surface of the case 11 are formed with inclined surfaces such as chamfered shapes on the front end sides of the printed circuit board 15 (15 ') on the clamping side. Then, the projections 12a, 12b
The printed circuit board 15 (15 ') can be easily inserted therebetween, so that workability can be improved.

【0018】次に、プリント基板15(15′)面上へ
の電子部品16b等の実装条件について図4を参照して
説明する。ここで、図4は図2に対応する部分断面斜視
図である。
Next, conditions for mounting the electronic components 16b and the like on the printed circuit board 15 (15 ') will be described with reference to FIG. Here, FIG. 4 is a partial sectional perspective view corresponding to FIG.

【0019】図4において、ケース11の内壁面の底部
11bに形成されている突起部12a,12bを利用し
てプリント基板15(15′)を挟持し固定する際に
は、プリント基板15(15′)に対する湾曲等の外部
応力によって実装されている電子部品16b等に損傷が
生じることが想定される。したがって、プリント基板1
5(15′)に対する湾曲等の外部応力の影響が及ぶこ
とがないよう図4に斜線にて示すプリント基板15(1
5′)面上の実装禁止領域P1 を避けて電子部品16b
等を実装することが設計上の必須要件とされる。
In FIG. 4, when the printed circuit board 15 (15 ') is sandwiched and fixed by using the projections 12a and 12b formed on the bottom 11b of the inner wall surface of the case 11, the printed circuit board 15 (15 It is assumed that the mounted electronic component 16b and the like may be damaged by external stress such as bending to '). Therefore, the printed circuit board 1
The printed circuit board 15 (1 ') shown by oblique lines in FIG.
5 ') Electronic component 16b avoiding mounting prohibited area P1 on the surface
Implementing such as is an essential requirement in design.

【0020】このように、本実施例の電子制御機器とし
てのECU10は、複数の電子部品16a,16b等を
実装するプリント基板15(15′)と、プリント基板
15(15′)がその基板平面に沿った方向に挿入され
るようプリント基板15(15′)を収容する袋構造か
らなるケース11と、ケース11の内壁面の底部11b
でプリント基板15(15′)を挟持するようプリント
基板15(15′)の表裏面に対して所定の寸法間隔に
て交互に形成する複数の突起部12a,12bとを具備
するものである。
As described above, the ECU 10 as the electronic control device of the present embodiment includes a printed circuit board 15 (15 ') on which a plurality of electronic components 16a, 16b and the like are mounted and a printed circuit board 15 (15'). 11, which has a bag structure for accommodating the printed circuit board 15 (15 ') so as to be inserted in a direction along the bottom, and a bottom 11b of the inner wall surface of the case 11
And a plurality of protrusions 12a and 12b formed alternately at predetermined intervals on the front and back surfaces of the printed board 15 (15 ') so as to sandwich the printed board 15 (15').

【0021】つまり、ケース11の内壁面の底部11b
には複数の突起部12a,12bがプリント基板15
(15′)の表裏面に対して間隔をあけて交互に形成さ
れている。このため、ケース11の内壁面の底部11b
に形成された突起部12a,12bの所定の寸法間隔と
ほぼ等しい板厚のプリント基板15では、元々の平面状
態が維持され所定位置に確実に固定される。また、ケー
ス11の内壁面の底部11bに形成された突起部12
a,12bの所定の寸法間隔より板厚が厚いプリント基
板15′であっても、それら突起部12a,12bに沿
って湾曲され所定位置に確実に固定される。これによ
り、プリント基板15(15′)をその基板平面に沿っ
た方向に挿入しケース11に収容する際に組付不良が発
生せず、プリント基板15(15′)の配線パターン
(図示略)や実装された電子部品16a,16b等に損
傷等が生じることもない。即ち、プリント基板15(1
5′)の層構成や防湿剤等による板厚のばらつきに影響
されることなく簡単な構成にてプリント基板15(1
5′)をケース11内の所定位置に確実に固定すること
ができ、振動や衝撃に対して信頼性の高いECU10を
構築することができる。また、ECU10の複数の仕様
に対してケース11の共通化が達成できるためコスト削
減が可能となる。
That is, the bottom 11b of the inner wall surface of the case 11
A plurality of projections 12a and 12b
It is formed alternately with an interval on the front and back surfaces of (15 '). For this reason, the bottom 11b of the inner wall surface of the case 11
In the printed circuit board 15 having a thickness substantially equal to the predetermined distance between the projections 12a and 12b formed on the printed circuit board, the original flat state is maintained and the printed circuit board 15 is securely fixed at the predetermined position. Also, a projection 12 formed on the bottom 11b of the inner wall surface of the case 11
Even if the printed circuit board 15 'is thicker than the predetermined dimensional interval between a and 12b, the printed circuit board 15' is curved along the projections 12a and 12b and is securely fixed at a predetermined position. Thus, when the printed circuit board 15 (15 ') is inserted in the direction along the plane of the board and accommodated in the case 11, no assembly failure occurs, and the wiring pattern (not shown) of the printed circuit board 15 (15') Also, there is no possibility that the mounted electronic components 16a, 16b and the like are damaged. That is, the printed circuit board 15 (1
The printed circuit board 15 (1) has a simple configuration without being affected by the layer configuration of 5 ′) or the thickness variation due to the moisture proof agent or the like.
5 ′) can be securely fixed to a predetermined position in the case 11, and the ECU 10 having high reliability against vibration and impact can be constructed. Further, since the case 11 can be shared for a plurality of specifications of the ECU 10, the cost can be reduced.

【0022】次に、本発明の実施の形態の一実施例にか
かる電子制御機器の変形例について図5を参照して説明
する。なお、図中、上述の実施例と同様の構成または相
当部分からなるものについては同一符号及び同一記号を
付し、その詳細な説明を省略する。また、図5ではプリ
ント基板の配線パターンや実装された電子部品等は省略
されている。更に、本変形例の電子制御機器の全体構成
については、上述の実施例における図1の断面図と同様
であり、その詳細な説明を省略する。
Next, a modification of the electronic control device according to one embodiment of the present invention will be described with reference to FIG. In the drawings, the same reference numerals and symbols are given to components having the same configuration or corresponding portions as those in the above-described embodiment, and detailed description thereof will be omitted. In FIG. 5, the wiring pattern of the printed circuit board, mounted electronic components, and the like are omitted. Further, the overall configuration of the electronic control device of this modification is the same as the cross-sectional view of FIG. 1 in the above-described embodiment, and a detailed description thereof will be omitted.

【0023】図5に示すように、上述の実施例と同様、
ケース11の内壁面の底部11bには突起部12a,1
2bが形成されている。そして、プリント基板25は、
その収容されたケース11の内壁面の底部11b側の端
縁面が、突起部12a,12bによって挟持され固定さ
れている。本変形例のプリント基板25が複数の突起部
12a,12bにて挟持され固定されたとき、隣接する
突起部12a,12bの中間位置となるプリント基板2
5の端縁面にスリット状の切込部25aが形成されてい
る。
As shown in FIG. 5, similar to the above embodiment,
Protrusions 12a, 1
2b is formed. And the printed circuit board 25
An edge surface on the bottom 11b side of the inner wall surface of the accommodated case 11 is sandwiched and fixed by the protrusions 12a and 12b. When the printed board 25 of this modification is sandwiched and fixed by the plurality of protrusions 12a, 12b, the printed board 2 is located at an intermediate position between the adjacent protrusions 12a, 12b.
5, a slit-like cut portion 25a is formed on the edge surface.

【0024】このため、図3(b)に示すように、ケー
ス11の内壁面の底部11bに形成された突起部12
a,12bの所定の寸法間隔に対してプリント基板25
の板厚が厚いときであっても、プリント基板25の湾曲
する部分を切込部25aの切込寸法以内に納めるように
することができる。これにより、上述の実施例と同様、
プリント基板25をケース11に収容する際に組付不良
が発生せず、プリント基板25の配線パターン(図示
略)や実装された電子部品16a,16b等に損傷等が
生じることもない。即ち、プリント基板25の層構成や
防湿剤等による板厚のばらつきに影響されることなく簡
単な構成にてプリント基板25をケース11に収容し、
所定位置に確実に固定することができ、振動や衝撃に対
して信頼性の高いECU10を構築することができる。
また、ECU10の複数の仕様に対してケース11の共
通化が達成できるためコスト削減が可能となる。
For this reason, as shown in FIG. 3B, a projection 12 formed on the bottom 11b of the inner wall surface of the case 11 is formed.
a, 12b with respect to the predetermined dimensional interval.
Even when the thickness is large, the curved portion of the printed board 25 can be accommodated within the cut size of the cut portion 25a. Thereby, similar to the above-described embodiment,
When the printed circuit board 25 is accommodated in the case 11, no assembly failure occurs, and no damage occurs to the wiring pattern (not shown) of the printed circuit board 25, the mounted electronic components 16a, 16b, and the like. That is, the printed circuit board 25 is housed in the case 11 with a simple structure without being influenced by the layer structure of the printed circuit board 25 or the thickness variation due to the moisture proof agent,
The ECU 10 can be reliably fixed at a predetermined position, and a highly reliable ECU 10 against vibration and impact can be constructed.
Further, since the case 11 can be shared for a plurality of specifications of the ECU 10, the cost can be reduced.

【0025】次に、プリント基板25面上への電子部品
16b等の実装条件について図6を参照して説明する。
ここで、図6は図5に対応する部分断面図である。
Next, the conditions for mounting the electronic components 16b and the like on the surface of the printed circuit board 25 will be described with reference to FIG.
Here, FIG. 6 is a partial sectional view corresponding to FIG.

【0026】図6において、ケース11の内壁面の底部
11bに形成されている突起部12a,12bを利用し
てプリント基板25を挟持し固定する際には、プリント
基板25に対する湾曲等の外部応力によって実装されて
いる電子部品16b等に損傷が生じることが想定され
る。本変形例においては、隣接する突起部12a,12
bの中間位置となるプリント基板25の端縁面にスリッ
ト状の切込部25aが形成されており、プリント基板2
5が複数の突起部12a,12bにて挟持され固定され
たとき、プリント基板25の湾曲等の外部応力の影響が
及ぶ部分を切込部25aの切込寸法以内、即ち、図6に
斜線にて示す実装禁止領域P2 内に納めることができ
る。つまり、プリント基板25の実装禁止領域P2 は、
上述の実施例における図4に示すプリント基板15(1
5′)面上の実装禁止領域P1 より幅狭く設定すること
ができる。したがって、プリント基板25ではプリント
基板15(15′)より広い電子部品16b等の実装面
積を得ることが可能となる。
In FIG. 6, when the printed circuit board 25 is pinched and fixed by using the projections 12a and 12b formed on the bottom 11b of the inner wall surface of the case 11, external stress such as bending on the printed circuit board 25 is applied. It is assumed that the electronic component 16b and the like mounted thereon are damaged. In this modification, the adjacent protrusions 12a, 12a
b, a slit-shaped notch 25a is formed in the edge surface of the printed circuit board 25 at an intermediate position of the printed circuit board 25.
When the protrusion 5 is sandwiched and fixed by the plurality of protrusions 12a and 12b, the portion affected by external stress such as the curvature of the printed circuit board 25 is within the cutout dimension of the cutout 25a, that is, hatched in FIG. Can be accommodated in the mounting prohibited area P2 shown in FIG. That is, the mounting prohibited area P2 of the printed board 25 is
The printed board 15 (1) shown in FIG.
5 ') It can be set narrower than the mounting prohibited area P1 on the surface. Therefore, it is possible to obtain a larger mounting area for the electronic components 16b and the like on the printed board 25 than the printed board 15 (15 ').

【0027】このように、本変形例の電子制御機器とし
てのECU10のプリント基板25は、隣接する突起部
12a,12bの中間位置となる端縁面にスリット状の
切込部25aを形成するものである。つまり、プリント
基板25に形成されたスリット状の切込部25aによっ
て、プリント基板25の突起部12a,12bによる固
定に伴う変形領域を少なくすることができるのである。
このため、プリント基板25をケース11内の所定位置
に確実に固定することができ、振動や衝撃に対して信頼
性の高いECU10を構築することができる。また、E
CU10の複数の仕様に対してケース11の共通化が達
成できるためコスト削減が可能となる。
As described above, the printed circuit board 25 of the ECU 10 as the electronic control device according to the present modification has the slit-shaped cut portion 25a formed on the edge surface at the intermediate position between the adjacent protrusions 12a and 12b. It is. In other words, the slit-shaped cut portion 25a formed on the printed board 25 can reduce the deformation area associated with the fixing of the printed board 25 by the projections 12a and 12b.
Therefore, the printed circuit board 25 can be securely fixed at a predetermined position in the case 11, and the ECU 10 having high reliability against vibration and impact can be constructed. Also, E
Since the case 11 can be shared for a plurality of specifications of the CU 10, the cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 図1は本発明の実施の形態の一実施例にかか
る電子制御機器の全体構成を示す断面図である。
FIG. 1 is a cross-sectional view illustrating an overall configuration of an electronic control device according to an example of an embodiment of the present invention.

【図2】 図2は図1の電子制御機器のケースにおける
プリント基板の固定状態を示す部分断面斜視図である。
FIG. 2 is a partial sectional perspective view showing a fixed state of a printed circuit board in a case of the electronic control device of FIG. 1;

【図3】 図3は図1のA−A線に沿う断面図である。FIG. 3 is a cross-sectional view taken along line AA of FIG.

【図4】 図4は本発明の実施の形態の一実施例にかか
る電子制御機器のプリント基板における実装禁止領域を
示す部分断面斜視図である。
FIG. 4 is a partial cross-sectional perspective view showing a mounting prohibited area on a printed circuit board of the electronic control device according to one example of the embodiment of the present invention.

【図5】 図5は本発明の実施の形態の一実施例にかか
る電子制御機器で用いられているプリント基板の変形例
を示す部分断面図である。
FIG. 5 is a partial cross-sectional view showing a modified example of a printed circuit board used in an electronic control device according to one example of an embodiment of the present invention.

【図6】 図6は本発明の実施の形態の一実施例にかか
る電子制御機器のプリント基板の変形例における実装禁
止領域を示す部分断面図である。
FIG. 6 is a partial cross-sectional view showing a mounting prohibited area in a modified example of a printed circuit board of an electronic control device according to one example of an embodiment of the present invention.

【図7】 図7は従来の電子制御機器におけるプリント
基板とケースの突起部との固定状態を示す部分断面斜視
図である。
FIG. 7 is a partial cross-sectional perspective view showing a fixed state of a printed circuit board and a projection of a case in a conventional electronic control device.

【図8】 図8は従来の電子制御機器におけるプリント
基板とケースの突起部との固定状態を示す部分断面図で
ある。
FIG. 8 is a partial cross-sectional view showing a fixed state of a printed circuit board and a projection of a case in a conventional electronic control device.

【符号の説明】[Explanation of symbols]

10 ECU(電子制御機器) 11 ケース 11b (内壁面の)底部 12a,12b 突起部 15,25 プリント基板 25a 切込部 Reference Signs List 10 ECU (Electronic Control Equipment) 11 Case 11b Bottom part (of inner wall surface) 12a, 12b Projection part 15, 25 Printed circuit board 25a Cut part

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 複数の電子部品を実装するプリント基板
と、 前記プリント基板がその基板平面に沿った方向に挿入さ
れるよう前記プリント基板を収容する袋構造からなるケ
ースと、 前記ケースの内壁面の底部で前記プリント基板を挟持す
るよう前記プリント基板の表裏面に対して所定の寸法間
隔にて交互に形成する複数の突起部とを具備することを
特徴とする電子制御機器。
1. A printed circuit board on which a plurality of electronic components are mounted, a case having a bag structure for accommodating the printed circuit board such that the printed circuit board is inserted in a direction along a plane of the printed circuit board, and an inner wall surface of the case A plurality of protrusions formed alternately at predetermined intervals on the front and back surfaces of the printed circuit board so as to sandwich the printed circuit board at the bottom of the electronic control apparatus.
【請求項2】 前記プリント基板は、隣接する前記突起
部の中間位置となる端縁面にスリット状の切込部を形成
することを特徴とする請求項1に記載の電子制御機器。
2. The electronic control device according to claim 1, wherein the printed circuit board has a slit-shaped notch formed in an edge surface at an intermediate position between the adjacent protrusions.
JP22083499A 1998-12-24 1999-08-04 Electronic control equipment Expired - Fee Related JP3675243B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22083499A JP3675243B2 (en) 1998-12-24 1999-08-04 Electronic control equipment

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-367187 1998-12-24
JP36718798 1998-12-24
JP22083499A JP3675243B2 (en) 1998-12-24 1999-08-04 Electronic control equipment

Publications (2)

Publication Number Publication Date
JP2000244153A true JP2000244153A (en) 2000-09-08
JP3675243B2 JP3675243B2 (en) 2005-07-27

Family

ID=26523938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22083499A Expired - Fee Related JP3675243B2 (en) 1998-12-24 1999-08-04 Electronic control equipment

Country Status (1)

Country Link
JP (1) JP3675243B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101245895B1 (en) 2011-06-27 2013-03-20 매그나칩 반도체 유한회사 Combination of frame for electronic circuit unit and electronic circuit unit module having the samr
JP2013069997A (en) * 2011-09-26 2013-04-18 Denso Corp Electronic control device
US9578761B2 (en) 2013-05-22 2017-02-21 Denso Corporation Electronic control unit and protective case
US9723739B2 (en) 2013-05-22 2017-08-01 Denso Corporation Electronic control unit and protective case

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101245895B1 (en) 2011-06-27 2013-03-20 매그나칩 반도체 유한회사 Combination of frame for electronic circuit unit and electronic circuit unit module having the samr
JP2013069997A (en) * 2011-09-26 2013-04-18 Denso Corp Electronic control device
US9578761B2 (en) 2013-05-22 2017-02-21 Denso Corporation Electronic control unit and protective case
US9723739B2 (en) 2013-05-22 2017-08-01 Denso Corporation Electronic control unit and protective case
DE112014002526B4 (en) 2013-05-22 2023-08-17 Denso Corporation ELECTRONIC CONTROL UNIT

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