JP2004266021A - Electronic equipment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic equipment apparatus which improves a work of mounting substrates and which improves the reliability of connecting a connector between the substrates. <P>SOLUTION: When the first substrate 20 and the second substrate 30 with electronic parts mounted thereon are housed in a chassis 70 in the electronic equipment apparatus; the first substrate 20 and the second substrate 30 are mounted at a substrate mounting chassis 70 via screws, etc., threaded holes 61 provided at upper and lower parts of a housing 60 are then matched to threaded holes 73 provided at the folding contact piece of the substrate mounting chassis 70, and clamped with screws, etc. Incidentally, when the first substrate 20 and the second substrate 30 are mounted on the substrate mounting chassis 70, connectors are connected together. Accordingly, the mounting of the connectors can be facilitated. Since a load is not applied to a connector mounting terminal, the quality of a product can be improved. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic device that connects boards (board-to-board) and stores the boards in a housing.
[0002]
[Prior art]
FIG. 5 is an exploded perspective view showing a configuration of a conventional electronic device. A fixing device for fixing a first substrate 20 and a second substrate 30 to a U-shaped casing 10 with screws or the like. The parts 11 and 12 are provided on the upper and lower parts of the housing 10.
[0003]
The upper fixing portion 11 provided at the upper part of the housing 10 is formed by cutting out a part of the housing 10 and forming a bending contact piece for fixing at a predetermined position. The lower fixing portion 12 is formed by fixing a preformed fixing member at a predetermined position on the lower surface of the housing 10 by welding or the like, and is used for fixing the fixing portions 11 and 12 with screws or the like. Holes are provided respectively. The U-shaped casing 10 is provided with a notch at a position corresponding to the screw hole to facilitate the screwing operation. Further, a plurality of holes for connecting an external connector are provided on the rear surface.
[0004]
In FIG. 5, when the first substrate 20 and the second substrate 30 on which electronic components are mounted are housed in the housing 10 to form an electronic device, first, the first substrate 20 is transferred in the direction of the thick arrow. To the fixing portions 11 and 12 provided at predetermined positions of the housing 10. That is, the first substrate 20 is fixed to the upper fixing portion 11 and the lower fixing portion 12 with screws or the like. At this time, the connector 21 provided on the rear surface of the first substrate 20 is in an unconnected state.
[0005]
Next, the second substrate 30 is transported in the direction of the thick arrow to the fixing portions 11 and 12 provided at predetermined positions of the housing 10. In this case, the operation of connecting the connector 31 provided on the rear surface of the second substrate 30 to the connector 21 of the first substrate 20 which has already been fixed, and the rear portion on which the external connection connector is disposed are connected to the rear portion of the housing 10. After the work of inserting into the hole is performed in parallel, the upper fixing part 11 and the lower fixing part 12 are fixed with screws or the like.
[0006]
A technique for connecting connectors provided on a substrate is conventionally known as shown in Patent Document 1 below.
[0007]
After doing so, the cover 50 is put on the U-shaped casing 10 from above, and the cover 50 is fixed with screws or the like. Finally, the front panel 40 is attached so as to cover the front surface of the U-shaped casing 10, and the front panel 40 is fixed with screws. By providing the guide plate 41 on the side of the front panel 40, assembly can be facilitated, and mechanical reinforcement can be achieved.
[0008]
[Patent Document 1]
JP-A-9-7715
[Problems to be solved by the invention]
As described above, in the conventional electronic device, the parallel work described above must be performed in order to fix the second substrate 30 at a predetermined position of the housing. Therefore, there is a problem that the connector connection must be performed from the user, and the connector connection is difficult.
[0010]
Further, even if the connection of the connector is completed, a considerable load is applied to the connector mounting terminal portion, so that a problem such as disconnection occurs and the quality of the product cannot be sufficiently ensured.
[0011]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide an electronic apparatus that improves the work required for mounting a board and improves the reliability of connector connection between the boards.
[0012]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention provides a board mounting chassis having spacers and through holes provided on the front and back surfaces, and a bent piece provided on the periphery, and the through hole. A first substrate attached to the spacer on the front surface, and a second connector penetrating the through-hole and connected to the first connector; A second substrate mounted on the spacer and a housing for housing the substrate mounting chassis. With this configuration, the number of steps for assembling can be significantly reduced, and the work of attaching the board to the housing can be significantly improved.
[0013]
According to a second aspect of the present invention, in the first aspect of the present invention, a through hole is provided at a predetermined position of the board mounting chassis, and the back surface of the first board and the second A connector mounted on the back surface of the substrate is connected. With this configuration, the connector can be easily mounted, and no load is applied to the connector mounting terminal portion, so that the quality of the product can be improved.
[0014]
According to a third aspect of the present invention, in the first aspect, a plurality of bent contact pieces are provided on an upper side and a lower side of the board mounting chassis, and the first board or the second board is provided. When mounting on the board mounting chassis, the circuit components mounted on the other board are protected by the bent contact pieces and the first board and the second board are stored in the housing. The circuit component mounted on the substrate is protected by the bent contact piece. With this configuration, the circuit components mounted on the board can be protected when the board is mounted and the board is housed in the housing.
[0015]
The invention according to claim 4 of the present invention is characterized in that, in the invention according to claim 3, a screw hole is provided only on one substrate side of the plurality of bending contact pieces. With this configuration, the number of steps for assembly can be reduced, and the work of attaching the board to the housing can be improved.
[0016]
According to a fifth aspect of the present invention, in the first aspect of the present invention, a plurality of spacers are provided on both sides of the board mounting chassis, and a predetermined gap is formed between the board mounting chassis and the board. It is characterized by being secured. With this configuration, a heat radiation space can be secured, and workability in the housing can be secured.
[0017]
The invention according to claim 6 of the present invention is characterized in that, in the invention according to claim 1, a cushioning material is attached to an upper side of the housing side of the housing. With this configuration, the assembly can be performed softly, and the occurrence of mechanical vibration can be prevented.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0019]
FIG. 1 is an exploded perspective view showing a configuration of an electronic apparatus according to an embodiment of the present invention. In the electronic apparatus of the present invention, a first substrate 20 and a second substrate 30 are mounted on a substrate mounting chassis. Attachment is made to each of the connectors 70 and connector connection is performed to achieve board-to-board connection, which is assembled into the U-shaped casing 60 and fixed.
[0020]
Further, the board mounting chassis 70 is provided with a plurality of bent contact pieces 72 for fixing to the housing 60 in the vertical direction toward the first board 20 side and the second board 30 side. Part of the contact piece 72 is provided with a hole 73 for fixing with a screw or the like. In order to directly connect the connectors provided on the back surface of the first substrate 20 and the back surface of the second substrate 30, a through hole is provided at a predetermined position in the board mounting chassis 70, and the connector connection is made through this through hole. Is to be achieved. Further, the board mounting chassis 70 is provided with a spacer for receiving a screw at a predetermined position, and the screw is inserted through the spacer so that the first board 20 and the second board 30 are fixed. . These will be described later.
[0021]
In order to receive the board mounting chassis 70 on which the first board 20 and the second board 30 are mounted in the U-shaped casing 60, the cushioning material 62 is attached to the upper side of the U-shaped casing 60. I have. In addition, screw holes 61 are provided in the upper and lower portions of the U-shaped casing 60 in correspondence with the screw holes 73 provided in the bent contact pieces of the board mounting chassis 70 described above. The screw hole 61 is provided so as to penetrate the cushioning material 62 attached to the upper side of the housing 60, and an external connector is provided on the rear surface of the U-shaped housing 60 as in the conventional example. A plurality of holes for connection are provided.
[0022]
In FIG. 1, when the first board 20 and the second board 30 on which electronic components are mounted are housed in the board mounting chassis 70 to form an electronic device, the first board 20 and the second board 30 After being attached to the board mounting chassis 70 by screws or the like, they are transferred in the direction of the thick arrow to be transferred to the screw holes 61 provided at the upper and lower portions of the housing 60 and the screws provided at the bent contact pieces of the board mounting chassis 70. Align with hole 73 and fix with screws or the like. When the first board 20 and the second board 30 are mounted on the board mounting chassis 70, the connectors are connected together, so that the connectors can be easily mounted, and the connector mounting terminal section is provided. As a result, the quality of the product can be improved.
[0023]
Next, the cover 50 is put on the U-shaped casing 60 from above, and the cover 50 is fixed with screws or the like. Finally, the front panel 40 is attached so as to cover the front surface of the U-shaped casing 60, and the front panel 40 is fixed with screws or the like. By providing the guide plate 41 on the side in the front panel 40 as in the conventional example, assembly can be facilitated, and mechanical reinforcement can also be enabled.
[0024]
FIG. 2 is a perspective view showing a configuration of the board mounting chassis according to the embodiment of the present invention. In FIG. 2, a plurality of bent contact pieces 72 are provided symmetrically on the upper side and the lower side of the board mounting chassis 70, and each bent contact piece 72 is connected to the first substrate 20 and the second substrate 30. Turned to the side. In the example of FIG. 2, a screw hole 73 is provided in the bent contact piece 72 on the first substrate 20 side. Thus, the number of steps for assembling can be reduced, and the work of attaching the board to the housing can be improved. Note that a screw hole 73 may be provided in the bent contact piece 72 on the second substrate 30 side.
[0025]
A through-hole 71 is provided at a predetermined position of the board mounting chassis 70 of FIG. 2, and the connector 21 provided on the back of the first board 20 and the through-hole 71 are provided on the back of the second board 30 through the through-hole 71. The connector 31 is interconnected. Further, the substrate mounting chassis 70 is provided with a plurality of spacers 74 for holding the first substrate 20 and the second substrate 30 at predetermined intervals, and female screws are cut in the spacers 74. At the time of mounting, a male screw is inserted. With this configuration, a heat radiation space can be ensured and workability in the housing can be ensured, that is, the connector mounted on the rear surface of each board can be easily guided to the outside of the housing from the rear hole of the housing 60. Note that the first substrate 20 and the second substrate 30 are not different from the conventional configuration.
[0026]
FIG. 3 is a perspective view showing a configuration when the first and second substrates are mounted on the substrate mounting chassis according to the embodiment of the present invention. As shown in FIG. 3, the first substrate 20 and the second substrate 30 are securely fixed to the substrate mounting chassis 70 according to the embodiment of the present invention by screws 75 and the like.
[0027]
The board mounting chassis 70 according to the embodiment of the present invention is set to be longer than each board in the up-down direction so that the bending contact piece 72 is fixed to the housing with screws or the like. The first and second boards 20 and 30 are set to be shorter than the respective boards in the front and rear direction so as not to hinder connection work of an external connector or the like attached in the front and rear direction of the first board 20 and the second board 30.
[0028]
FIG. 4 is an assembled perspective view of the electronic apparatus according to the embodiment of the present invention, in which the first board 20 and the second board 30 are mounted on the board mounting chassis 70 as shown in FIGS. , Assembled according to the procedure shown in FIG.
[0029]
As described above, in the electronic apparatus of the present invention, the first board 20 and the second board 30 are mounted on the board mounting chassis 70 and then housed in the housing 60, so that the number of assembling steps can be significantly reduced. In addition, the work of attaching the board to the housing 60 can be greatly improved. In addition, since the connector connection is performed in addition to the case where the first substrate 20 and the second substrate 30 are attached, the connector can be easily attached, and a load can be applied to the connector mounting terminal portion. Since it disappears, the quality of the product can be improved.
[0030]
【The invention's effect】
As described above, in the electronic device of the present invention, the first substrate and the second substrate are mounted on the substrate mounting chassis and then housed in the housing, so that the number of steps for assembly can be greatly reduced. Thus, the effect of greatly improving the work of attaching the board to the housing can be obtained.
[0031]
In addition, since the connector connection is performed at the same time when the first substrate and the second substrate are mounted on the substrate mounting chassis, the connector can be easily mounted, and a load is applied to the connector mounting terminal portion. As a result, the quality of the product can be improved.
[0032]
Further, since a plurality of bent contact pieces are provided on the board mounting chassis, when the board is mounted on the board mounting chassis, the circuit components mounted on the other board can be protected by the bent contact pieces. . Further, when the board is housed in the housing, it is possible to protect the circuit components mounted on the board.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a configuration of an electronic apparatus according to an embodiment of the present invention;
FIG. 2 is a perspective view showing a configuration of a board mounting chassis according to the embodiment of the present invention;
FIG. 3 is a perspective view showing a configuration when the first and second substrates are mounted on the substrate mounting chassis according to the embodiment of the present invention;
FIG. 4 is an assembled perspective view of the electronic apparatus according to the embodiment of the invention;
FIG. 5 is an exploded perspective view showing a configuration of a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Case 11 Upper fixing part 12 Lower fixing part 20 First substrate 21 Connector 30 Second substrate 31 Connector 40 Front panel 41 Guide plate 50 Cover 60 Housing 61 Screw hole 62 Buffer material 70 Substrate mounting chassis 71 Through hole 72 Folding piece 73 Screw hole 74 Spacer 75 Screw

Claims (6)

A substrate mounting chassis having spacers and through holes provided on the front and back surfaces, and having bent pieces provided on the periphery,
A first board having a first connector penetrating through the through-hole and attached to a spacer on the surface;
A second substrate that has a second connector that penetrates the through hole and is connected to the first connector, and that is attached to the spacer on the back surface;
An electronic device comprising: a housing for housing the board mounting chassis. A through hole is provided at a predetermined position of the board mounting chassis, and connectors mounted on the back surface of the first board and the back face of the second board are connected through the through hole. Item 2. The electronic apparatus according to Item 1. A plurality of bent contact pieces are provided on upper and lower sides of the board mounting chassis, and when mounting the first board or the second board to the board mounting chassis, a circuit component mounted on the other board is mounted. When the first substrate and the second substrate are housed in the housing, the circuit components mounted on the substrate are protected by the bending contacts while protecting with the bending contacts. The electronic device according to claim 1, wherein: 4. The electronic apparatus according to claim 3, wherein a screw hole is provided only on one of the plurality of bent contact pieces on the substrate side. 4. The electronic apparatus according to claim 1, wherein a plurality of spacers are provided on both sides of the board mounting chassis to secure a predetermined gap between the board mounting chassis and the board. 2. The electronic apparatus according to claim 1, wherein a buffer material is attached to an upper side of the housing side of the housing.

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