JP2013148713A - Optical block assembly and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical block assembly that can suppress contact failure at a connector connection part of a relay substrate and a circuit substrate, and a manufacturing method therefor.SOLUTION: An optical block assembly is manufactured as follows. First, element substrates, each of which includes an imaging element, and a relay substrate 4 are wired and connected together, and also the relay substrate 4 is temporarily placed on a right side plate 33 of an optical block sub-assy 3. Next, a cage member 5 for housing the temporarily placed relay substrate 4 in the inner side thereof is attached to the optical block sub-assy 3. Further, a circuit substrate 6 is fixed onto the right side surface of the cage member 5. Then, screw parts 11a to 11c are respectively inserted into penetration holes 6a to 6c of the cage member 5 and are tightened in bosses with screw holes 43a to 43c of the relay substrate 4 which become exposed by an opening part 5a or a notched part 5b of the cage member 5. By this, the relay substrate 4 is fixed to the inner side surface of the cage member 5 and also is connector-connected with the circuit substrate 6.

Description

  The present invention relates to an optical block assembly applied to an imaging apparatus such as a television camera and a manufacturing method thereof.

  As an optical block applied to a conventional television camera, for example, an optical block described in Patent Document 1 is known. This optical block includes three main boards (element boards) on which an image sensor is mounted and a connector board (relay board) for relaying signals, and the relay board and each element board have the same shape. It is electrically connected by three flexible sheets.

JP-A-5-284212

By the way, a circuit board on which a drive circuit for generating a drive pulse (drive signal) for the image sensor is mounted is electrically connected to the relay board. Although it is possible to electrically connect the relay board and the circuit board by wiring, from the viewpoint of reducing the number of components and downsizing of the apparatus, the relay board and the circuit can be used without using wiring. Many configurations are employed in which a board is connected to a connector.
However, in such a conventional configuration, since the relay board and the circuit board are fixed to separate members, vibration is applied to the television camera (imaging device), such as during moving shooting using a relay vehicle. In this case, the amplitude of the relay board is different from the amplitude of the circuit board, and there is a possibility that a contact failure may occur at the connection part (connector connection part) between the two.

  The present invention has been made paying attention to such a situation, and even when vibration is applied to an imaging apparatus such as a television camera, contact failure at the connection portion between the relay board and the circuit board is not caused. It is an object of the present invention to provide an optical block assembly and a method for manufacturing the same that can suppress generation.

  An optical block assembly according to an aspect of the present invention is an optical block assembly applied to an imaging apparatus, and includes an element substrate having an imaging element that receives light decomposed by a spectroscopic unit, and a driving signal for the imaging element A circuit board fixed to an outer surface of a cage member that houses at least the spectroscopic portion inside, and the cage member And a relay board that relays signals between the element board and the circuit board. The circuit board has a first connector portion. The relay board is exposed by an opening or a notch formed in the cage member, and is exposed by an opening or a notch formed in the cage member and penetrates the circuit board from the outside. And a female thread part to be fitted to the male thread part of the threaded part. The relay board is connected to the element board by wiring, and the second connector part is connected to the first connector part of the circuit board by the screw component on the inner surface of the cage member. It is fixed.

  A method of manufacturing an optical block assembly according to another aspect of the present invention is applied to an imaging apparatus, and generates an element substrate having an imaging element that receives light decomposed by a spectroscopic unit, and a driving signal for the imaging element An optical block assembly comprising: a circuit board having at least one of a driving circuit for processing and a processing circuit for processing an output signal of the imaging element; and a relay board for relaying signals between the element board and the circuit board (A) a step of wiring connecting the element substrate and the relay substrate and temporarily placing the relay substrate on a temporary placement portion; and (b) at least the spectroscopic portion and the temporary placement portion. Attaching a cage member for accommodating the relay board inside; (c) fixing the circuit board to an outer surface of the cage member; and (d) forming the circuit board on the circuit board. A threaded part is inserted into the through-hole from the outside of the circuit board, and the threaded part of the threaded part is exposed to the female threaded part of the relay board exposed by the opening or the notch formed in the cage member. Fixing the relay board to the inner surface of the cage member by tightening, and connecting the circuit board and the relay board with a connector.

Generally, since the order in which the relay board and the circuit board are assembled is different, the boards cannot be fixed and integrated with one member in advance.
According to the optical block assembly and the manufacturing method thereof, the relay board and the circuit board to be connected to the connector are fixed to one member (the cage member) when the assembly is completed. Even if added, it is possible to prevent the relay board and the circuit board from vibrating with different amplitudes, and it is possible to suppress the occurrence of contact failure at the connector connecting portions of both boards. Further, since the relay board and the circuit board are integrated in the middle of the assembly or at the final stage, the conventional assembly procedure is not greatly changed.

1 is an exploded perspective view of an optical block assembly according to an embodiment of the present invention. It is a figure which shows the structure of an optical block sub-assembly. It is a figure which shows the structure of the optical block main body which comprises the said optical block sub-assembly. It is a figure which shows the right side board which comprises the said optical block sub-assembly. It is a figure for demonstrating the assembly | attachment procedure of an optical block assembly. It is a figure for demonstrating the assembly | attachment procedure of an optical block assembly. It is a figure for demonstrating the assembly | attachment procedure of an optical block assembly. It is a figure for demonstrating the assembly | attachment procedure of an optical block assembly.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view of an optical block assembly (optical block assembly) according to an embodiment of the present invention. The optical block assembly 1 is applied to an imaging device (not shown) such as a television camera. As shown in FIG. 1, an optical block assembly 1 includes a front frame 2, an optical block sub-assembly 3, a relay board 4, a cage member 5, and a circuit board that constitute a part of the front surface of the imaging apparatus. 6.

FIG. 2 shows the configuration of the optical block sub-assembly 3. 2A is a front view, FIG. 2B is a left side view, FIG. 2C is a right side view, and FIG. 2D is a plan view.
As shown in FIG. 2, the optical block subassembly 3 includes an optical block main body 31, a left side plate 32, a right side plate 33, and a support plate 34.

FIG. 3 shows the configuration of the optical block body 31. 3A is a front view, FIG. 3B is a left side view, FIG. 3C is a right side view, and FIG. 3D is a plan view.
As shown in FIG. 3, the optical block main body 31 includes a mount base 312 having a lens mount 311 on which an imaging lens (not shown) is mounted, a spectral prism (spectral unit) 313 fixed to the mount base 312, and a first To third element substrates 314a to 314c.

Screw holes 312 a to 312 d for attaching the front frame 2 are formed on the front surface of the mount base 312, and screw holes 312 e to 312 h for fixing the cage member 5 are formed on the upper surface and the left and right side surfaces of the mount base 312. Has been.
The spectral prism 313 decomposes (splits) the imaging light incident through the imaging lens into R, G, and B light, and emits the light from the corresponding light exit surfaces.

  The first to third element substrates 314a to 314c are disposed adjacent to the light exit surface of the spectroscopic prism 313, respectively. The first to third element substrates 314a to 314c have CCD, CMOS and other imaging elements 315a to 315c that receive the light decomposed by the spectroscopic prism 313 and convert them into electrical signals, and wiring connectors 316a to 316c. It is installed. For example, the image sensor 315a mounted on the first element substrate 314a receives B light emitted from the spectroscopic prism 313 and converts it into an electrical signal, and the image sensor 315b mounted on the second element substrate 314b The G light emitted from the prism 313 is received and converted into an electrical signal, and the image sensor 315c mounted on the third element substrate 314c receives the R light emitted from the spectral prism 313 and converts it into an electrical signal. .

The left side plate 32, the right side plate 33, and the support plate 34 are made of, for example, a sheet metal member, and are fixed to the optical block body 31 directly by screws or indirectly via a bracket or the like.
FIG. 4 shows the right side plate 33. As shown in FIG. 4, three protrusions 33 a to 33 c are formed on the right side plate 33 by bending. The protrusions 33 a to 33 c protrude to the right side of the optical block body 31 when the right side plate 33 is fixed to the optical block body 31. Each of the protrusions 33a to 33c is formed so that the tip side is narrower than the bending source side. Note that the number of protrusions is not limited to three, but may be plural.
The support plate 34 is mainly used for fixing the cage member 5. Screw holes 34a and 34b for fixing the cage member 5 are formed in the support plate 34 (see FIG. 2).

The relay board 4 is configured such that the drive signals (drive pulses) of the first to third image sensors 315a to 315c and the output signals of the image sensors 315a to 315c are between the first to third element boards 314a to 314c and the circuit board 6. Relay.
As shown in FIG. 1, three wiring connectors 41 a to 41 c and a male connector 42 constituting one of the stacking connectors are mounted on one surface of the relay substrate 4. Further, on one surface of the relay substrate 4, three screw hole bosses 43 a to 43 c each having a screw hole formed at the tip are provided upright. However, the number of bosses with screw holes is not limited to three, but may be plural.

Further, the relay board 4 is fitted with the two long holes 4a and 4b into which the front ends of the protrusions 33a and 33b of the right side plate 33 (see FIG. 4) are inserted, respectively, and the front end of the protrusion 33c of the right side plate 33. A cutout portion 4c to be joined is formed, whereby the relay substrate 4 is held by the right side plate 33 (projections 33a to 33c thereof). In other words, the relay board 4 can be temporarily placed on the right side plate 3. Here, the temporary placement refers to holding the relay board 4 in a predetermined position without being fixed, for example.
In the following, the one surface of the relay substrate 4, that is, the surface on which the connectors 41 a to 41 c and 42 and the bosses 43 a to 43 c are provided is referred to as “surface” of the relay substrate 4, and the other surface of the relay substrate 4. Is called the “back surface” of the relay substrate 4.

  The cage member 5 is made of, for example, a sheet metal member, and is attached to the optical block sub-assembly 3 (the mount base 312 and the support plate 34) by screws. More specifically, the cage member 5 is attached to the optical block sub-assembly 3 after the relay substrate 4 is temporarily placed on the right side plate 33. When the cage member 5 is attached to the optical block sub-assembly 3, the relay substrate 4 temporarily placed on the spectroscopic prism 313, the left side plate 32, the right side plate 33, and the right side plate 33 is accommodated inside the cage member 5. . Of course, all or part of the first to third element substrates 314 a to 314 c may be accommodated inside the cage member 5.

  On the right side surface of the cage member 5, four substrate supporting bosses 51 a to 51 d having a screw hole formed at the tip are erected. However, the number of substrate supporting bosses is not limited to four, and a plurality (preferably three or more) may be provided. On the right side surface of the cage member 5, when the cage member 5 is attached to the optical block subassembly 3, the male side connector portion 42 of the relay board 4 temporarily placed on the right side plate 33 and screw holes are provided. An opening 5a that exposes the bosses 43a and 43b and a notch 5b that exposes the boss 43c with a screw hole are formed. However, the present invention is not limited to this, and the cage member 5 has openings and cutouts (notches) that expose the male connector portion 42 and the screw hole bosses 43a to 43c of the relay board 4 temporarily placed on the right side plate 33. It is sufficient that the escape portion is also appropriately formed.

  The circuit board 6 is fixed by screws to board support bosses 51 a to 51 d erected on the outer surface of the cage member 5, more specifically, on the right side surface of the cage member 5. On one surface of the circuit board 6, a drive circuit (not shown) for generating drive signals (drive pulses) for the first to third image sensors 315a to 315c and output signals of the first to third image sensors 315a to 315c are provided. At least one of the processing circuits (not shown) for processing the above and a female connector 61 constituting the other of the stacking connectors are mounted. On the other surface of the circuit board 6, a wiring connector 62 to which wiring (not shown) extending from the imaging device side is connected is mounted.

  Further, the circuit board 6 has three through holes 6 a to 6 located corresponding to the bosses 43 a to 43 c of the relay board 4 temporarily placed on the right side plate 33 when fixed to the outer surface of the cage member 5. 6c is formed. Hereinafter, the one surface of the circuit board 6, that is, the surface on which the female connector 61 is mounted is referred to as the “surface” of the circuit board 6, and the other surface of the circuit board 6, that is, the wiring connector 61. The surface on which is mounted is referred to as the “back surface” of the circuit board 6.

Here, the assembly procedure of the optical block assembly 1 will be described with reference to FIGS.
First, the first to third element substrates 314a to 314c of the optical block / sub-assembly 3 (see FIG. 2) and the relay substrate 4 (see FIGS. 1 and 5) are connected by wiring, and the relay substrate 4 is connected to the optical block / sub-assembly. Temporarily placed on the right side plate 33 of the assembly 3. The relay board 4 may be temporarily placed after the wiring connection is made, or the wiring connection may be made after the relay board 4 is temporarily placed.

  Specifically, as shown in FIG. 5, the wiring connection between the element substrate and the relay substrate is performed by connecting one end of three flexible wirings (FFC, FPC, etc.) 7a to 7c to the first to third element substrates 314a to 314c, respectively. The wiring connectors 316a to 316c are connected to each other, and the other ends of the three flexible wirings 7a to 7c are connected to the wiring connectors 41a to 41c of the relay board 4, respectively. In addition, the temporary placement of the relay board 4 is performed by inserting the long holes 4a and 4b and the cutout part 4c of the relay board 4 with the back surface facing the right side plate 33 into the corresponding protrusions 33a to 33c of the right side plate 33. Is done by.

  Next, as shown in FIG. 6, the spectroscopic prism 313, the left side plate 32, the right side plate 33, and the cage member 5 that accommodates the relay substrate 4 temporarily placed on the right side plate 33 are optically received by screws 8 a to 8 f. Attach to block sub-assembly 3. As a result, the relay board 4 temporarily placed on the right side plate 33 is positioned inside the cage member 5, but the male side connector portion 42 and the screw hole bosses 43 a to 43 c of the relay board 4 are connected to the cage member 5. It is exposed from the opening part 5a or notch part 5b formed. The front frame 2 is attached to the front surface of the mount base 312 with screws 9a to 9d.

  Next, as shown in FIG. 7, the circuit board 6 whose surface is directed to the right side surface of the cage member 5 is placed on the outer surface of the cage member 5 by screws 10a to 10d, more specifically, the cage member. 5 is fixed to the substrate supporting bosses 51a to 51d (see FIGS. 1 and 6) which are erected on the right side surface of FIG. At this time, the through holes 6 a to 6 c of the circuit board 6 are positioned corresponding to the bosses 43 a to 43 c of the relay board 4 temporarily placed on the right side plate 33.

Then, as shown in FIG. 8, screw parts 11 a to 11 c are inserted from the outside of the circuit board 6 into the through holes 6 a to 6 c formed in the circuit board 6, and the screw parts of the screw parts 11 a to 11 c are relayed. The board 4 is tightened into screw holes bosses 43a to 43c (female thread portions). Thereby, the relay board 4 temporarily placed on the right side plate 33 is drawn toward the circuit board 6 and is fixed to the inner side of the right side surface of the cage member 5 (that is, the inner side surface of the cage member 5). At this time, the male side connector portion 42 of the relay board 4 is connected to the female side connector portion 61 of the circuit board 6, and the relay board 4 and the circuit board 6 are connector-connected.
The optical block assembly 1 is assembled in the above procedure.

  The optical block assembly 1 according to the present embodiment described above includes first to third imaging elements that receive R light, G light, or B light separated by the spectral prism (spectral part) 313 that decomposes imaging light. The cage member 5 includes at least one of an element substrate 314a to 314c, a drive circuit that generates a drive signal for each image sensor, and a processing circuit that processes an output signal of each image sensor, and accommodates at least the spectroscopic prism 313 inside. A circuit board 6 fixed to the outer surface; and a relay board 4 that is disposed inside the cage member 5 and relays signals between the first to third element boards 314a to 314c and the circuit board 6. .

  The circuit board 6 has a female connector part (first connector part) 61 constituting one of the stacking connectors. The relay board 4 is a screw that fits with a male connector part (second connector part) 42 that constitutes the other of the stacking connectors and male screw parts 11a to 11c of screw parts that penetrate the circuit board 6 from the outside. Threaded hole bosses 43a to 43c each having a hole (female thread portion) formed at the tip thereof. Here, the male connector portion 42 and the threaded hole bosses 43 a to 43 c of the relay substrate 4 are exposed by the opening 5 a or the notch portion 5 b formed in the cage member 5.

  Then, by tightening the screw parts 11a to 11c into screw holes (female thread portions) formed at the tips of the bosses 43a to 43c with screw holes, the relay board 4 has the male connector portion 42 of the circuit board 6. It is fixed to the inner surface of the cage member 5 while being connected to the female connector 61.

  As a result, the relay board 4 and the circuit board 6 to be connected to the connector are both fixed to the cage member 5, so that even when vibration is applied to the imaging device, the relay board 4 and the circuit board 6 have different amplitudes. Therefore, it is possible to suppress the occurrence of contact failure at the connector connecting portions of both boards. Further, since the relay board 4 before being fixed can be temporarily placed on the right side plate (temporary placing part) 33, the relay board 4 can be easily fixed to the inner surface of the cage member 5. Furthermore, since the relay board 4 and the circuit board 6 are integrated at the final stage (or halfway) of the assembly, the conventional assembly procedure is not greatly changed.

In the above embodiment, the relay board 4 has a male connector portion of a stacking connector and the circuit board 6 has a female connector portion of a stacking connector. However, the relay board 4 has a female connector portion. Of course, the circuit board 6 may have a male connector part.
As mentioned above, although preferable embodiment of this invention was described, this invention is not restrict | limited to the said embodiment, A various deformation | transformation and change are possible based on the technical idea of this invention.

  DESCRIPTION OF SYMBOLS 1 ... Optical block assembly, 3 ... Optical block sub-assembly, 4 ... Relay board, 4a, 4b ... Long hole, 4c ... Notch part, 5 ... Cage member, 5a ... Opening part, 5b ... Notch part, 6 ... Circuit boards, 6a to 6c ... Through holes, 11a to 11c ... Screw parts, 31 ... Optical block body, 33 ... Right side plate (temporary placement part), 42 ... Male side connector part (second connector part), 43a to 43c Boss with screw hole (female thread portion), 61 female connector portion (first connector portion) 311 mount base, 312 lens mount, 313 spectroscopic prism (spectral portion), 314a to 314c first to first Three-element substrate, 315a to 315c, image sensor

Claims (4)

An optical block assembly applied to an imaging device,
An element substrate having an image sensor for receiving the light decomposed by the spectroscopic unit;
A circuit that has at least one of a drive circuit that generates a drive signal for the image sensor and a processing circuit that processes an output signal of the image sensor, and is fixed to an outer surface of a cage member that houses at least the spectroscopic unit inside A substrate,
A relay board that is arranged inside the cage member and relays a signal between the element board and the circuit board;
With
The circuit board has a first connector portion,
The relay board is exposed by an opening or a notch formed in the cage member, and is exposed by an opening or a notch formed in the cage member and penetrates the circuit board from the outside. A female thread part to be fitted to the male thread part of the thread component to be
The relay board is connected to the element board by wiring and fixed to the inner surface of the cage member in a state where the second connector part is connected to the first connector part of the circuit board by the screw component. An optical block assembly.   2. The optical block assembly according to claim 1, further comprising a temporary placement portion that is disposed inside the cage member and is capable of temporarily placing the relay board before being fixed to an inner surface of the cage member.   The first connector portion is a female connector portion or a male connector portion constituting one of the stacking connectors, and the second connector portion is a male connector portion or a female side constituting the other of the stacking connectors. The optical block assembly according to claim 1, wherein the optical block assembly is a connector portion. At least one of an element substrate having an imaging element that is applied to an imaging apparatus and receives light decomposed by a spectroscopic unit, a driving circuit that generates a driving signal of the imaging element, and a processing circuit that processes an output signal of the imaging element A method of manufacturing an optical block assembly, comprising: a circuit board having a relay board; and a relay board that relays signals between the element board and the circuit board,
Wiring connecting the element substrate and the relay substrate, and temporarily placing the relay substrate in a temporary placement portion;
Attaching a cage member that accommodates at least the spectroscopic unit and the temporarily placed relay board; and
Fixing the circuit board to an outer surface of the cage member;
The relay board is configured such that a screw component is inserted from the outside of the circuit board into a through hole formed in the circuit board, and a screw portion of the screw component is exposed by an opening or a notch formed in the cage member. Fixing the relay board to the inner surface of the cage member by tightening to a female screw part, and connecting the circuit board and the relay board with a connector;
A method for manufacturing an optical block assembly.