JPH0743554U - Mounting structure for electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] The present invention is designed so that even if the position of an electronic component such as a connector or a switch is changed or the substrate is warped or the like, the end face of the electronic component is different from the substrate, the case or the like. It is an object of the present invention to provide a mounting structure for an electronic component, which can be surely exposed to the outside from an opening such as a case without applying stress. An electronic component is mounted on a substrate 11 held inside a case or the like, and an end surface of at least one electronic component 12 mounted on a side edge of the substrate is In a mounting structure 10 for an electronic component, which is exposed to the outside through an opening provided in a case or the like, a mounting portion 11 of a board on which the electronic component is mounted.
The mounting structure 10 of the electronic component is configured such that a has slits 12 and 13 on both sides of the electronic component.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a mounting structure for electronic parts, and in particular, the end faces of electronic parts such as connectors and switches mounted on a substrate inside a case are exposed to the outside through an opening in the case. Related to the mounting structure of electronic parts.

[0002]

[Prior art]

 Conventionally, such an electronic component mounting structure is configured as shown in FIG. 4, for example. That is, in FIG. 4, the mounting structure 1 is composed of a case 2, a substrate 3 held in the case 2, electronic components mounted on the substrate 3, and a connector 4 in the illustrated case. .

As shown in FIG. 5, the connector 4 is mounted along the side edge of the board 3, and its end face is exposed to the outside through an opening 2 a provided in the case 2. The soldering portion 2b on the peripheral edge of the opening 2a is grounded by the soldering 5. In the illustrated case, the end surface of the connector 4 is arranged so as to fit into the opening 2a of the case 2.

[0004]

[Problems to be solved by the device]

 However, in the mounting structure having such a structure, for example, when each connector 4 is mounted on the substrate 3, the connecting lead wire of each connector 4 is formed on the surface of the substrate 3 by so-called solder dipping. Although it can be fixed and electrically connected to a conductive pattern (not shown), in some cases, electronic parts such as the connector 4 may be displaced from a predetermined mounting position, or by solder dipping, 3 itself may cause a warp as shown in FIG.

Therefore, when the board 3 is held in the case 2, the end surfaces of the connectors 4 mounted on the board 3 are exposed to the outside through the corresponding openings 2 a of the case 2. The substrate 3 is forcibly sandwiched between the cases 2. Therefore, when the board 3 is assembled in the case 2, stress is generated in the board 3 and each connector 4. Thus, due to this stress, the connecting lead wire is peeled from the conductive pattern formed on the surface of the substrate 3, each connector 4 is detached from the substrate 3, the substrate 3 is cracked, or the case 2 However, there is a problem that the opening 2a may be damaged.

Further, when the deformation of the substrate 3 such as warpage is large, or when the mounting position of the electronic component such as each connector 4 is largely displaced, the end surface of each connector 4 is exposed to the outside from the opening 2a. In the state, there is a problem that the substrate 3 may not be incorporated in the case 2.

In view of the above-mentioned points, the present invention makes it possible for the end surface of an electronic component to be attached to a substrate, a case, etc. even if the electronic component such as a connector or a switch is displaced or the substrate is warped or otherwise deformed. The purpose of the present invention is to provide a mounting structure for electronic components that can be exposed to the outside through an opening such as a case without causing stress.

[0008]

[Means for Solving the Problems]

 According to the present invention, an electronic component is mounted on a substrate held inside a case or the like, and at least one electronic component mounted on a side edge of the substrate is mounted on the substrate. In the mounting structure for electronic components, the end face of which is exposed to the outside through the opening provided in the case or the like, the edge of the board on which the electronic component is mounted is located on both sides of the electronic component. This is achieved by an electronic component mounting structure characterized by having a slit.

[0009]

[Action]

 According to the above configuration, the electronic component whose end surface is exposed to the outside through the opening provided in the case or the like is mounted on the edge of the board, and the board is mounted on both sides of the mounting part. By having the slit, flexibility is imparted. Therefore, even if the mounting position of the electronic component is displaced or the board itself is deformed such as warped due to solder dip or the like, the mounting part of the board is deformed based on the above flexibility, The electronic component mounted on this mounting portion can be accurately aligned with the opening of the case or the like.

[0010] Thus, even if the electronic component is displaced or the substrate is warped, the electronic component can be reliably exposed to the outside from the opening of the case without giving stress to the substrate or the case. Can be exposed to.

[0011]

【Example】

 Hereinafter, the present invention will be described in more detail based on an embodiment shown in the drawings. FIG. 1 shows an embodiment of a mounting structure for electronic parts according to the present invention. That is, in FIG. 1, a mounting structure 10 is similar to the conventional mounting structure 1 shown in FIG. 4, a substrate 11 to be held in a case 2, an electronic component mounted on the substrate 11, In the case of, it is composed of the connector 12.

As shown in FIGS. 1 and 4, the connector 12 is mounted along the side edge of the substrate 11, and its end face is exposed to the outside through an opening 2 a provided in the case 2. As such, the side edge of the substrate 11 is projected laterally. As a result, the end surface of the connector 12 is fitted into the opening 2a of the case 2.

The above structure is similar to the conventional electronic component mounting structure 1 shown in FIG. 4, but in the electronic component mounting structure 10 according to the present invention, the connector at the side edge of the substrate 11 is used. In the mounting portion 11a of 12, the substrate 11 is provided with slits 13 and 14 on both sides of the mounting portion 11a, as shown in FIG.

The mounting structure 10 according to the embodiment of the present invention is configured as described above, and when the substrate 11 is held in the case 2 (see FIG. 4), the end face of the connector 12 is opened in the case 2. The substrate 11 is mounted in the case 2 in a state of being aligned with 2a. As a result, the board 11 can be fixedly held at a predetermined position in the case 2, and the connector 12 mounted on the side edge of the board 11 fits into the opening 2a in the case 2, and It is exposed to the outside through the opening 2a.

At this time, in the connector 12, the mounting portion 11a of the board 11 on which the connector 12 is mounted is provided with flexibility by the slits 13 and 14 provided on both sides thereof. As a result, even if the board 11 is deformed such as warped due to solder dip or the like, the end face of the connector 12 has a small deformation of the mounting portion 11a of the board 11 and is reliably inserted into the opening 2a of the case 2. And can be reliably exposed to the outside through the opening 2a.

At this time, since the mounting portion 11a of the substrate 11 is provided with flexibility due to the presence of the slits 13 and 14, the deformation of the mounting portion 11a is absorbed, so that the substrate 11 The stress on the case 2 can be reduced. Thus, it is possible to effectively prevent the opening of the board 11 and the case from being broken or the connector 12 coming off the board 11 due to the stress.

In the above embodiment, the case where the electronic component mounted on the mounting portion 11a at the edge of the substrate 11 is the connector 12 has been described, but the present invention is not limited to this, and as shown in FIG. 2, for example. It is obvious that the switch 15 may be mounted on the mounting portion 11a of the substrate 11, and the present invention can be applied to other electronic components.

Further, in the above embodiment, the slits 13 and 14 extend straight inward from the edge of the substrate 11, but as shown in FIG. Extension portions 16a and 17a may be provided that extend straight from the edge of 11 toward the inside and further extend close to each other so as to surround the mounting portion 11a. As a result, the mounting portion 11a can be moved and adjusted further in the up-down direction or the left-right direction with respect to the substrate 11, and therefore the mounting position of the connector 12 on the substrate 11 is displaced. Even if it is, it can be separated from the substrate 11, and the deformation thereof can reduce the stress on the substrate 11 and the case.

[0019]

[Effect of device]

 As described above, according to the present invention, even if the electronic components such as the connector and the switch are displaced or the substrate is deformed such as warped, the end surface of the electronic component is not attached to the substrate, the case, or the like. It is possible to provide an extremely excellent mounting structure for electronic components, which can be surely exposed to the outside from the opening of the case or the like without giving stress to it.

[Brief description of drawings]

FIG. 1 is a partially enlarged perspective view showing a main part of an embodiment of an electronic component mounting structure according to the present invention.

FIG. 2 is a partially enlarged perspective view showing another embodiment of an electronic component mounting structure according to the present invention.

FIG. 3 is a partially enlarged perspective view showing still another embodiment of an electronic component mounting structure according to the present invention.

FIG. 4 is a schematic cross-sectional view showing an example of a conventional electronic component mounting structure.

5 is a partially enlarged perspective view showing a main part of the mounting structure of FIG.

6 is an exploded cross-sectional view showing a case where the substrate in the mounting structure of FIG. 4 is warped.

[Explanation of symbols]

 10 Electronic Component Mounting Structure 11 Board 11a Mounting Part 12 Connector 13, 14, 16, 17 Slit 15 Switch 16a, 17a Extension

Claims (1)

[Scope of utility model registration request] 1. An electronic component is mounted on a substrate held inside a case or the like, and at least one electronic component mounted on a side edge of the substrate among the electronic components,
In the mounting structure of the electronic component, the end surface of which is exposed to the outside through an opening provided in the case or the like, mounting portions of the board on which the electronic component is mounted are provided on both sides of the electronic component. A mounting structure for electronic parts, which is provided with a slit.