JPH043501Y2 - - Google Patents

Info

Publication number

JPH043501Y2

JPH043501Y2 JP1364386U JP1364386U JPH043501Y2 JP H043501 Y2 JPH043501 Y2 JP H043501Y2 JP 1364386 U JP1364386 U JP 1364386U JP 1364386 U JP1364386 U JP 1364386U JP H043501 Y2 JPH043501 Y2 JP H043501Y2

Authority

JP

Japan

Prior art keywords

semiconductor element

base

recess

fixing material

semiconductor package

Prior art date

1986-01-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004065 semiconductor Substances 0.000 claims description 36
• 239000000463 material Substances 0.000 description 14
• 238000010304 firing Methods 0.000 description 5
• 238000000034 method Methods 0.000 description 5
• 239000010931 gold Substances 0.000 description 4
• 239000000919 ceramic Substances 0.000 description 3
• 239000011521 glass Substances 0.000 description 3
• 238000002844 melting Methods 0.000 description 3
• 230000008018 melting Effects 0.000 description 3
• 239000000758 substrate Substances 0.000 description 3
• 230000002950 deficient Effects 0.000 description 2
• 239000012777 electrically insulating material Substances 0.000 description 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
• 229910052737 gold Inorganic materials 0.000 description 2
• 238000010438 heat treatment Methods 0.000 description 2
• 230000001788 irregular Effects 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• 230000008646 thermal stress Effects 0.000 description 2
• 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 238000005219 brazing Methods 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 229910000833 kovar Inorganic materials 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1