JPH04331431A - Coil board and manufacture thereof - Google Patents
Coil board and manufacture thereofInfo
- Publication number
- JPH04331431A JPH04331431A JP9765691A JP9765691A JPH04331431A JP H04331431 A JPH04331431 A JP H04331431A JP 9765691 A JP9765691 A JP 9765691A JP 9765691 A JP9765691 A JP 9765691A JP H04331431 A JPH04331431 A JP H04331431A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- substrate
- circuit pattern
- coil body
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 27
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 11
- 238000007639 printing Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Manufacture Of Motors, Generators (AREA)
- Windings For Motors And Generators (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、コイル基板、特に偏
平モータ用の駆動コイルを有するコイル基板及びその製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil substrate, particularly a coil substrate having a drive coil for a flat motor, and a method for manufacturing the same.
【０００２】0002
【従来の技術】ステンレススチールやニッケル等の平板
状導電板に回路を形成し、この回路をプリプレグ基板に
熱プレスで転写し、プリプレグ基板上に導体回路を形成
した導体回路板及びその製造方法が知られている（特開
昭６３−６９２９１号公報）。[Prior Art] A conductor circuit board and its manufacturing method are provided in which a circuit is formed on a flat conductive plate made of stainless steel, nickel, etc., and the circuit is transferred to a prepreg board by heat press to form a conductor circuit on the prepreg board. It is known (Japanese Unexamined Patent Publication No. 63-69291).
【０００３】0003
【発明が解決しようとする課題】上記従来の回路板は平
板状導電板に形成した回路を転写することによって得ら
れるものであるから、メッキ工程などを含む製造工程が
複雑であり、また、良好な転写を行わせるために平板状
導電板の表面を研磨加工等により平滑性に優れた状態に
しなければならなかったり、あるいは、埋め込み型回路
板であるから、配線引き回わし用端子が樹脂層に埋没し
、そのため回路板に実装されるコイル等と回路との結線
に難があるなどの問題点が残されている。[Problems to be Solved by the Invention] Since the above-mentioned conventional circuit board is obtained by transferring a circuit formed on a flat conductive plate, the manufacturing process including the plating process is complicated, and it is difficult to achieve good quality. In order to perform accurate transfer, the surface of the flat conductive plate must be made smooth by polishing, etc., or because it is an embedded circuit board, the terminals for wiring routing must be placed on a resin layer. Therefore, problems remain, such as difficulty in connecting the coils and the like mounted on the circuit board to the circuit.
【０００４】0004
【課題を解決するための手段】請求項１記載の発明は、
ベース材の両面に設けられた樹脂層と、上記ベース材の
一方の樹脂層に少なくとも一部が埋設された回路パター
ン及びこの回路パターンに接続されたコイル体と、上記
ベース材の他方の樹脂層に少なくとも一部が埋め込まれ
た磁束の通路となるヨーク板とを具備していることに特
徴がある。[Means for solving the problem] The invention according to claim 1 includes:
a resin layer provided on both sides of the base material; a circuit pattern at least partially embedded in the resin layer of one of the base materials; a coil body connected to the circuit pattern; and a resin layer of the other base material. It is characterized in that it includes a yoke plate, which serves as a path for magnetic flux, and at least a portion thereof is embedded in the yoke plate.
【０００５】請求項２ないし４に記載された発明は、ベ
ース材に設けられた未硬化樹脂層に、回路パターン及び
その回路パターンに接続されるコイル体の少なくとも一
部を埋め込んでコイル基板を製造することを特徴とする
ものである。[0005] The invention described in claims 2 to 4 manufactures a coil board by embedding a circuit pattern and at least a part of a coil body connected to the circuit pattern in an uncured resin layer provided on a base material. It is characterized by:
【０００６】請求項５記載の発明は、ベース材上の未硬
化樹脂に熱プレスによってコイル体を埋め込むと共に未
硬化樹脂を硬化させたのち、樹脂表面に、コイル体に接
続される回路パターンを形成する製造方法に特徴がある
。[0006] According to the fifth aspect of the invention, after the coil body is embedded in the uncured resin on the base material by heat pressing and the uncured resin is cured, a circuit pattern connected to the coil body is formed on the resin surface. It is characterized by its manufacturing method.
【０００７】請求項６記載の発明は、ベース材の片面に
設けた樹脂層と、この樹脂層に少なくとも一部が埋め込
まれたコイル体と、上記樹脂層の表面に形成された上記
コイル体に接続される回路パターンとを有することを特
徴とする。The invention according to claim 6 provides a resin layer provided on one side of a base material, a coil body at least partially embedded in the resin layer, and a coil body formed on the surface of the resin layer. It is characterized by having a circuit pattern to be connected.
【０００８】[0008]
【作用】プリプレグ基板へのコイル、ヨークの埋め込み
及び回路の同時形成によりコイル基板が一体成形され、
コイル基板の薄型化、製造工程の簡略化が図られ、プリ
プレグ基板上に回路形成を行うことにより、プリント配
線基板が不要となり部品点数が削減する。更に、ヨーク
板をコイル体下の必要部分に所定の形状にて一体成形す
れば、従来の鉄板基板が不要となり、コイル基板の小型
・軽量化が図れる。[Operation] The coil board is integrally formed by embedding the coil and yoke in the prepreg board and simultaneously forming the circuit.
By making the coil board thinner and simplifying the manufacturing process, forming a circuit on the prepreg board eliminates the need for a printed wiring board and reduces the number of parts. Furthermore, if the yoke plate is integrally molded in a predetermined shape at a necessary portion under the coil body, the conventional iron plate substrate is no longer necessary, and the coil substrate can be made smaller and lighter.
【０００９】[0009]
【実施例】図１，２において、円形のベース材１の表裏
両面には樹脂層２，３がそれぞれ設けられており、一方
の樹脂層２には花弁状に並んだ複数のコイル体Ｃ１，Ｃ
２，・・・・が、そして他の樹脂層３には磁路を形成す
るためのドーナツ状のヨーク板５がそれぞれ埋め込まれ
て本発明のコイル基板が形成されている。[Embodiment] In FIGS. 1 and 2, resin layers 2 and 3 are provided on both the front and back surfaces of a circular base material 1, and one resin layer 2 includes a plurality of coil bodies C1 arranged in a petal shape, C
A donut-shaped yoke plate 5 for forming a magnetic path is embedded in each of the other resin layers 3 to form the coil substrate of the present invention.
【００１０】各コイル体Ｃ１，Ｃ２，・・・・は、所定
のコイル体同士が、一部を樹脂層２内に埋設された回路
パターンによって接続されている。例えば、コイル体Ｃ
１の内側端子とコイル体Ｃ４の外側端子とが銅箔からな
る回路パターンＣ１−４により、また、コイル体Ｃ２の
内側端子とコイル体Ｃ５の外側端子とが回路パターンＣ
２−５により、そしてコイル体Ｃ３，Ｃ４，Ｃ５の各内
側が互に回路パターンＣ３−４−５でそれぞれ接続され
ている。Predetermined coil bodies C1, C2, . . . are connected to each other by a circuit pattern partially embedded in the resin layer 2. For example, coil body C
The inner terminal of coil body C2 and the outer terminal of coil body C5 are formed by circuit pattern C1-4, and the inner terminal of coil body C2 and the outer terminal of coil body C5 are formed by circuit pattern C1-4.
2-5, and the inner sides of the coil bodies C3, C4, and C5 are connected to each other by a circuit pattern C3-4-5.
【００１１】コイルＣ１，Ｃ２及びＣ６の各外側端子は
、モータの駆動回路（図示されず）に接続される端子ａ
，ｂ，ｃとして樹脂層２の周縁に引き出されている。
なお、端子ａ，ｂ，ｃは、図１に示すように樹脂層２の
表面に形成してもよいし、樹脂層２の外周面を一部切欠
いてそこに端子部を形成してもよい。あるいは、裏面側
の樹脂層３に形成してもよい。Each outer terminal of the coils C1, C2 and C6 is connected to a terminal a which is connected to a motor drive circuit (not shown).
, b, and c are drawn out to the periphery of the resin layer 2. Note that the terminals a, b, and c may be formed on the surface of the resin layer 2 as shown in FIG. 1, or a part of the outer peripheral surface of the resin layer 2 may be cut out and the terminal portion may be formed there. . Alternatively, it may be formed on the resin layer 3 on the back side.
【００１２】コイル体と回路パターンとの結線は、図３
に示すように、コイル体Ｃ５を例にとると、同コイル体
Ｃ５の外側端子Ｃ５ａと回路パターンＣ１−５の端子Ｃ
５ｃとが、そして同コイル体Ｃ５の内側端子Ｃ５ｂと回
路パターンＣ１−５の端子Ｃ５ｄとが、コイル体Ｃ５が
樹脂層２に埋め込まれることによって互に接触すること
で行われる。The connection between the coil body and the circuit pattern is shown in FIG.
As shown in the figure, taking the coil body C5 as an example, the outer terminal C5a of the coil body C5 and the terminal C of the circuit pattern C1-5 are connected to each other.
5c, and the inner terminal C5b of the coil body C5 and the terminal C5d of the circuit pattern C1-5 are brought into contact with each other as the coil body C5 is embedded in the resin layer 2.
【００１３】ベース材１の材料としては、ガラスクロス
あるいはポリエステル、ガラス不織布、紙などが採用さ
れ、ベース材１の両面に設けられる樹脂としてはポリイ
ミド、エポキシ、フェノールなどが用いられる。As the material for the base material 1, glass cloth, polyester, glass nonwoven fabric, paper, etc. are used, and as the resin provided on both sides of the base material 1, polyimide, epoxy, phenol, etc. are used.
【００１４】次に、コイル基板の４つの製造方法、（１
）フレーム法、（２）メッキ法、（３）成形法及び（４
）印刷法を説明する。Next, four methods of manufacturing a coil substrate (1)
) frame method, (2) plating method, (3) molding method, and (4
) Explain printing methods.
【００１５】（１）フレーム法（図４）図４（ａ）に示
すように、ガラスクロスからなるベース材１の両面に未
硬化樹脂層２，３を設けたプリプレグ１０を用意する。
プリプレグ１０の一方の未硬化樹脂層２の上に、（ｂ）
に示すように、コイル体Ｃと予じめハンダＣａなどによ
り接続された回路フレーム１１を載せ、他方の未硬化樹
脂層３にはヨーク板５が当てがわれる。(1) Frame method (FIG. 4) As shown in FIG. 4(a), a prepreg 10 is prepared in which uncured resin layers 2 and 3 are provided on both sides of a base material 1 made of glass cloth. (b) on one uncured resin layer 2 of the prepreg 10;
As shown in FIG. 2, a circuit frame 11 connected to the coil body C in advance by solder Ca or the like is mounted, and a yoke plate 5 is applied to the other uncured resin layer 3.
【００１６】熱を加えながら、コイル体Ｃとヨーク板５
を、（ｃ）に示すように、各未硬化樹脂層２，３に押し
込んで未硬化樹脂層２に回路フレーム１１の一部とコイ
ル体Ｃを、そして未硬化樹脂層３にヨーク板５をそれぞ
れ埋め込む。While applying heat, the coil body C and the yoke plate 5 are
are pushed into each of the uncured resin layers 2 and 3, as shown in FIG. Embed each.
【００１７】回路フレーム１１は、銅箔、洋白箱をプレ
ス加工あるいはエッチングによって配線パターンに形成
したものである。The circuit frame 11 is formed by pressing or etching a copper foil or a nickel silver box into a wiring pattern.
【００１８】（２）メッキ法（図５）
図５（ａ）に示すように、ベース材１及び未硬化樹脂層
２，３からなるプリプレグ１０の未硬化樹脂層２上にメ
ッキにより回路パターン１２を形成し、（ｂ）に示すよ
うに、回路パターン１２上にコイル体Ｃを載せて回路パ
ターン１２とコイル体Ｃとをリフローにより結線し、未
硬化樹脂層３にヨーク板５を当てがい、熱を加えながら
、コイル体Ｃとヨーク板５を、（ｃ）に示すように各未
硬化樹脂層２，３に押し込む。(2) Plating method (FIG. 5) As shown in FIG. 5(a), a circuit pattern 12 is formed by plating on the uncured resin layer 2 of the prepreg 10 consisting of the base material 1 and uncured resin layers 2 and 3. , as shown in (b), place the coil body C on the circuit pattern 12, connect the circuit pattern 12 and the coil body C by reflow, apply the yoke plate 5 to the uncured resin layer 3, While applying heat, the coil body C and the yoke plate 5 are pushed into each of the uncured resin layers 2 and 3 as shown in (c).
【００１９】未硬化樹脂層２上の本実施例におけるメッ
キ法による回路パターン１２は、未硬化樹脂層２に触媒
レジンを塗布し、これを所定のパターンに露光し、現像
し、現像されたパターンに導電体をメッキすることによ
り形成されるが、未硬化樹脂層２にパネルメッキを施こ
し、その上に、塗布によりレジスト層を形成し、これを
露光・現像したのちエッチングを行って回路パターンを
形成してもよい（エッチング法）。パネルメッキの代り
にＣｕ箔を貼付してもよい。もう一つの回路パターン形
成法として、未硬化樹脂層２に触媒レンジ（ポリカーボ
ネート、エポキシ系等）または導電性ペーストで回路パ
ターンを印刷し、その上に導電体メッキを行う方法（印
刷法）を採用することもできる。The circuit pattern 12 formed by the plating method in this embodiment on the uncured resin layer 2 is obtained by applying a catalyst resin to the uncured resin layer 2, exposing it to light in a predetermined pattern, and developing the developed pattern. The circuit pattern is formed by plating a conductor on the uncured resin layer 2, and a resist layer is formed by coating on the uncured resin layer 2, which is exposed and developed, and then etched to form the circuit pattern. (etching method). Cu foil may be attached instead of panel plating. Another method for forming a circuit pattern is to print a circuit pattern on the uncured resin layer 2 using a catalyst oven (polycarbonate, epoxy, etc.) or conductive paste, and then conductive plating is applied on top of it (printing method). You can also.
【００２０】（３）成形法（図６）
図６（ａ）に示すように、未硬化樹脂層２にテフロン（
商品名）などの離型シート１３を介してプレス型１４に
より熱を加えながらコイル挿入凹部１５を形成し、次に
（ｂ）に示すように、このコイル挿入凹部１５の底面、
側壁の一部及び樹脂層２の一部に、前記のメッキ法ある
いはエッチング法により配線引き回わし回路１６を形成
したのち、マイナス公差で成形されたコイル挿入凹部１
５に、図（ｃ）に示すようにコイル体Ｃを圧入する。コ
イル体Ｃの挿入凹部１５への圧入により、コイルの内外
側各端子と回路１６、たとえば図３に示すＣ５ａとＣ５
ｃ，及びＣ５ｂとＣ５ｄとが互に圧接することにより結
線されるが、より信頼性を確保するためにはコイル圧入
時に、各端子に導電ペーストを塗布すればよい。(3) Molding method (FIG. 6) As shown in FIG. 6(a), Teflon (
A coil insertion recess 15 is formed while applying heat with a press mold 14 through a release sheet 13 such as (trade name), and then, as shown in (b), the bottom surface of this coil insertion recess 15,
After forming the wiring routing circuit 16 on a part of the side wall and a part of the resin layer 2 by the above-mentioned plating method or etching method, the coil insertion recess 1 is formed with a negative tolerance.
5, the coil body C is press-fitted as shown in Figure (c). By press-fitting the coil body C into the insertion recess 15, the inner and outer terminals of the coil and the circuit 16, for example C5a and C5 shown in FIG.
The wires are connected by pressing C5b and C5d together, but in order to ensure reliability, conductive paste may be applied to each terminal when press-fitting the coil.
【００２１】離型シート１３の代りにリリーザゲン、ダ
イフリー５４１（商品名）等のシリコン系、フッソ系な
どの離型剤を用いてもよい。また、コイル挿入凹部１５
を成形するときヨーク板５を同時に未硬化樹脂３に圧入
する。[0021] Instead of the release sheet 13, a silicone-based or fluorine-based release agent such as Lilisagen or Daifree 541 (trade name) may be used. In addition, the coil insertion recess 15
When molding, the yoke plate 5 is press-fitted into the uncured resin 3 at the same time.
【００２２】（４）印刷法（図７）
図７（ａ）に示すように、コイル体Ｃとヨーク板５とを
、未硬化樹脂層２と３とに熱プレスによりそれぞれ圧入
する。この場合、コイル体Ｃの結線用端子に樹脂が被ぶ
らないように、かつ半田ペーストのスクリーン印刷が可
能なレベルまで浮かしておく。次に（ｂ）に示すように
、配線引き回わし用回路１７をメッキ法、エッチング法
あるいは印刷法で形成する。その後、半田ペーストをス
クリーン印刷しリフローによりコイル体と回路との結線
を行う。(4) Printing method (FIG. 7) As shown in FIG. 7(a), the coil body C and the yoke plate 5 are press-fitted into the uncured resin layers 2 and 3 by hot pressing, respectively. In this case, the connection terminals of the coil body C are kept floating to a level that allows screen printing of the solder paste so that the resin does not cover them. Next, as shown in (b), a wiring circuit 17 is formed by a plating method, an etching method, or a printing method. Thereafter, solder paste is screen printed and the coil body and circuit are connected by reflow.
【００２３】ヨーク板５としてはケイ素鋼板、鉄板、パ
ーメンジュール等が用いられる。またコイル体としては
、巻回式で作られたスライスコイル、すなわち、巻回コ
イルを所定数接着等によって一体化し、その後、０．６
〜０．８ｍｍの厚さにスライスした偏平コイルが用いら
れる。As the yoke plate 5, silicon steel plate, iron plate, permendur, etc. are used. In addition, the coil body is a sliced coil made by a winding method, that is, a predetermined number of wound coils are integrated by gluing, etc., and then 0.6
A flat coil sliced to a thickness of ~0.8 mm is used.
【００２４】[0024]
【発明の効果】プリプレグ板を用いた発明によれば、コ
イル基板が一体成形され、コイル基板が軽量薄型化し、
またコイル基板の製造工程が簡略化する。また、コイル
と配線回路が一体化され、かつ、結線用端子が一体的に
設けられるのでコストダウンも図ることができる。[Effects of the Invention] According to the invention using a prepreg board, the coil substrate is integrally molded, and the coil substrate becomes lighter and thinner.
Furthermore, the manufacturing process of the coil substrate is simplified. Further, since the coil and the wiring circuit are integrated and the connection terminal is provided integrally, it is possible to reduce costs.
【図１】この発明の一実施例を示すコイル基板の平面図
である。FIG. 1 is a plan view of a coil substrate showing an embodiment of the present invention.
【図２】図１のＡ−Ａ拡大断面図である。FIG. 2 is an enlarged sectional view taken along line AA in FIG. 1;
【図３】樹脂層に形成されたコイル挿入凹部とこれに装
着されるコイル体とを示す傾斜図である。FIG. 3 is a slanted view showing a coil insertion recess formed in a resin layer and a coil body mounted therein.
【図４】この発明のフレーム法によるコイル基板の製造
方法の説明図である。FIG. 4 is an explanatory diagram of a method for manufacturing a coil substrate by the frame method of the present invention.
【図５】この発明のメッキ法によるコイル基板の製造方
法の説明図である。FIG. 5 is an explanatory diagram of a method for manufacturing a coil substrate by the plating method of the present invention.
【図６】この発明の成形法によるコイル基板の製造方法
の説明図である。FIG. 6 is an explanatory diagram of a method for manufacturing a coil substrate using the molding method of the present invention.
【図７】この発明の印刷法によるコイル基板の製造方法
の説明図である。FIG. 7 is an explanatory diagram of a method for manufacturing a coil substrate using the printing method of the present invention.
１ ベース材 ２，３ 樹脂層 ５ ヨーク板 １０ プリプレグ板 １１ 回路フレーム １２ 回路パターン １５ コイル挿入穴 １６，１７ 回路 1 Base material 2, 3 Resin layer 5 Yoke plate 10 Prepreg board 11 Circuit frame 12 Circuit pattern 15 Coil insertion hole 16, 17 Circuit
Claims (6)
記ベース材の一方の樹脂層に少なくとも一部が埋設され
た回路パターン及びこの回路パターンに接続されたコイ
ル体と、上記ベース材の他方の樹脂層に少なくとも一部
が埋め込まれたヨーク板とを具備したコイル基板。1. A resin layer provided on both sides of a base material, a circuit pattern at least partially embedded in one of the resin layers of the base material, a coil body connected to the circuit pattern, and the base material. and a yoke plate at least partially embedded in the other resin layer.
基板を用い、この基板の一方の面の未硬化樹脂層の表面
側から回路パターン及び該回路パターンに接続されるコ
イル体の少なくとも一部を、また、上記基板の他方の面
の未硬化樹脂の表面側からヨーク板の少なくとも一部を
それぞれ埋め込み、その後、上記未硬化樹脂を硬化させ
て形成するコイル基板の製造方法。[Claim 2] A circuit pattern and a coil body connected to the circuit pattern are formed from the surface side of the uncured resin layer on one side of the substrate by using a substrate having an uncured resin layer on both sides of the base material. A method for manufacturing a coil substrate, comprising embedding at least a portion of a yoke plate from the surface side of an uncured resin on the other surface of the substrate, and then curing the uncured resin.
を用い、この基板の上記未硬化樹脂の表面に回路パター
ン及び該回路パターンに接続されるコイル体を乗せ、熱
プレスにより上記回路パターン及び上記コイル体の少な
くとも一部を上記未硬化樹脂に埋め込んで一体化するコ
イル基板の製造方法。3. Using a substrate with an uncured resin on one side of a base material, a circuit pattern and a coil body connected to the circuit pattern are placed on the surface of the uncured resin of the substrate, and the circuit is formed by heat pressing. A method for manufacturing a coil substrate, comprising embedding a pattern and at least a portion of the coil body in the uncured resin to integrate the pattern.
を用い、この基板の上記未硬化樹脂の表面にコイル体が
挿入されるコイル挿入凹部を熱プレスにより形成し、そ
の後、上記コイル挿入凹部を含めて上記樹脂部表面に回
路パターンを形成した後、上記回路パターンと接続され
るコイル体を上記コイル挿入凹部に保持させるコイル基
板の製造方法。4. Using a substrate with an uncured resin on one side of the base material, a coil insertion recess into which the coil body is inserted is formed on the surface of the uncured resin of this substrate by hot pressing, and then the coil A method for manufacturing a coil substrate, comprising forming a circuit pattern on the surface of the resin part including the insertion recess, and then holding a coil body connected to the circuit pattern in the coil insertion recess.
を用い、この基板の上記未硬化樹脂の表面に熱プレスに
よりコイル体を埋め込むと共に上記未硬化樹脂を硬化さ
せた後、上記樹脂表面に上記コイル体に接続される回路
パターンを形成するコイル基板の製造方法。5. Using a substrate having an uncured resin on one side of a base material, embedding a coil body in the surface of the uncured resin of the substrate by heat pressing and curing the uncured resin; A method for manufacturing a coil substrate, comprising forming a circuit pattern connected to the coil body on the surface thereof.
脂層に少なくとも一部が埋め込まれたコイル体と、上記
樹脂層の表面に形成された上記コイル体に接続される回
路パターンとを有するコイル基板。6. A resin layer provided on one side of a base material, a coil body at least partially embedded in the resin layer, and a circuit pattern connected to the coil body formed on the surface of the resin layer. A coil board with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3097656A JP2796200B2 (en) | 1991-04-26 | 1991-04-26 | Manufacturing method of coil substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3097656A JP2796200B2 (en) | 1991-04-26 | 1991-04-26 | Manufacturing method of coil substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04331431A true JPH04331431A (en) | 1992-11-19 |
| JP2796200B2 JP2796200B2 (en) | 1998-09-10 |
Family
ID=14198118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3097656A Expired - Lifetime JP2796200B2 (en) | 1991-04-26 | 1991-04-26 | Manufacturing method of coil substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2796200B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010067710A1 (en) | 2008-12-12 | 2010-06-17 | Honda Motor Co., Ltd. | Stator coil for axial gap electrical rotating machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5274806A (en) * | 1976-12-02 | 1977-06-23 | Toshiba Corp | Manufacturing of electronic instrument use frame |
| JPS5537871A (en) * | 1978-09-11 | 1980-03-17 | Toshiba Corp | Method and device for manufacturing electrically-insulated coil |
| JPS61141977U (en) * | 1985-02-19 | 1986-09-02 | ||
| JPS6211348U (en) * | 1985-07-03 | 1987-01-23 | ||
| JPH0268673U (en) * | 1988-11-10 | 1990-05-24 | ||
| JPH02122552U (en) * | 1989-03-15 | 1990-10-08 |
-
1991
- 1991-04-26 JP JP3097656A patent/JP2796200B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5274806A (en) * | 1976-12-02 | 1977-06-23 | Toshiba Corp | Manufacturing of electronic instrument use frame |
| JPS5537871A (en) * | 1978-09-11 | 1980-03-17 | Toshiba Corp | Method and device for manufacturing electrically-insulated coil |
| JPS61141977U (en) * | 1985-02-19 | 1986-09-02 | ||
| JPS6211348U (en) * | 1985-07-03 | 1987-01-23 | ||
| JPH0268673U (en) * | 1988-11-10 | 1990-05-24 | ||
| JPH02122552U (en) * | 1989-03-15 | 1990-10-08 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010067710A1 (en) | 2008-12-12 | 2010-06-17 | Honda Motor Co., Ltd. | Stator coil for axial gap electrical rotating machine |
| US8334628B2 (en) | 2008-12-12 | 2012-12-18 | Honda Motor Co., Ltd. | Stator coil for axial gap electrical rotating machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2796200B2 (en) | 1998-09-10 |
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